DE69937948D1 - Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils - Google Patents

Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils

Info

Publication number
DE69937948D1
DE69937948D1 DE69937948T DE69937948T DE69937948D1 DE 69937948 D1 DE69937948 D1 DE 69937948D1 DE 69937948 T DE69937948 T DE 69937948T DE 69937948 T DE69937948 T DE 69937948T DE 69937948 D1 DE69937948 D1 DE 69937948D1
Authority
DE
Germany
Prior art keywords
magnetron
compensate
magnet arrangement
movable magnet
erosion profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69937948T
Other languages
English (en)
Inventor
Bosscher Wilmert De
Hove Steven August Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soleras Advanced Coatings BV
Original Assignee
Bekaert Advanced Coatings NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bekaert Advanced Coatings NV filed Critical Bekaert Advanced Coatings NV
Application granted granted Critical
Publication of DE69937948D1 publication Critical patent/DE69937948D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
DE69937948T 1999-06-21 1999-06-21 Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils Expired - Lifetime DE69937948D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP99870127A EP1063679B1 (de) 1999-06-21 1999-06-21 Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils

Publications (1)

Publication Number Publication Date
DE69937948D1 true DE69937948D1 (de) 2008-02-21

Family

ID=8243855

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69937948T Expired - Lifetime DE69937948D1 (de) 1999-06-21 1999-06-21 Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils

Country Status (4)

Country Link
US (1) US6416639B1 (de)
EP (1) EP1063679B1 (de)
JP (1) JP2001059171A (de)
DE (1) DE69937948D1 (de)

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DE10138165A1 (de) * 2001-08-03 2003-02-27 Singulus Technologies Ag Magnetron-Zerstäubungsanlage mit einer Vorrichtung zum Verhindern einer Rückbeschichtung des Zerstäubungstargets
US6805770B1 (en) * 2001-08-30 2004-10-19 Oster Magnetics, Inc. Technique for improving uniformity of magnetic fields that rotate or oscillate about an axis
US6841050B2 (en) 2002-05-21 2005-01-11 Applied Materials, Inc. Small planetary magnetron
US6852202B2 (en) 2002-05-21 2005-02-08 Applied Materials, Inc. Small epicyclic magnetron with controlled radial sputtering profile
JP2004029679A (ja) 2002-06-28 2004-01-29 Toshiba Corp 光モジュール装置及びプロジェクションテレビ装置並びに光モジュール装置の製造方法
BE1015154A5 (fr) * 2002-10-23 2004-10-05 Alloys For Technical Applic S Ensemble destine a la pulverisation cathodique magnetron.
US7674360B2 (en) * 2003-12-12 2010-03-09 Applied Materials, Inc. Mechanism for varying the spacing between sputter magnetron and target
US8500975B2 (en) * 2004-01-07 2013-08-06 Applied Materials, Inc. Method and apparatus for sputtering onto large flat panels
US7513982B2 (en) * 2004-01-07 2009-04-07 Applied Materials, Inc. Two dimensional magnetron scanning for flat panel sputtering
US20060049040A1 (en) * 2004-01-07 2006-03-09 Applied Materials, Inc. Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels
JP2008505250A (ja) * 2004-07-01 2008-02-21 カーディナル・シージー・カンパニー マグネトロンスパッタリング用の振動磁石を有する円筒形のターゲット
DE112005001599B4 (de) 2004-07-09 2019-03-28 National Institute For Materials Science Verfahren zum Umstellen der Magnetflussverteilung einer Magnetron-Zerstäubungsvorrichtung
WO2006063484A1 (en) 2004-12-17 2006-06-22 Unaxis Balzers Aktiengesellschaft Magnetron sputtering apparatus
US20060207872A1 (en) * 2005-03-21 2006-09-21 Sergey Mishin Dual magnetron thin film deposition system
US20060272941A1 (en) * 2005-06-06 2006-12-07 Simpson Wayne R Large area elastomer bonded sputtering target and method for manufacturing
JP4923450B2 (ja) * 2005-07-01 2012-04-25 富士ゼロックス株式会社 バッチ処理支援装置および方法、プログラム
US20070012559A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Method of improving magnetron sputtering of large-area substrates using a removable anode
US20070084720A1 (en) * 2005-07-13 2007-04-19 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070012663A1 (en) * 2005-07-13 2007-01-18 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070051616A1 (en) * 2005-09-07 2007-03-08 Le Hienminh H Multizone magnetron assembly
US20070056843A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones
US7588668B2 (en) 2005-09-13 2009-09-15 Applied Materials, Inc. Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers
US20070056850A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Large-area magnetron sputtering chamber with individually controlled sputtering zones
EP1775353B1 (de) * 2005-09-15 2008-10-08 Applied Materials GmbH & Co. KG Beschichtungsanlage und Verfahren zum Betrieb einer Beschichtungsanlage
WO2007068133A1 (en) 2005-12-13 2007-06-21 Oc Oerlikon Balzers Ag Improved sputter target utilization
US20070246354A1 (en) * 2006-04-19 2007-10-25 Maxim Integrated Products, Inc. Plasma systems with magnetic filter devices to alter film deposition/etching characteristics
ATE499697T1 (de) * 2006-11-14 2011-03-15 Applied Materials Inc Magnetron-sputterquelle, sputter- beschichtungsanlage und verfahren zur beschichtung eines substrats
CN201068469Y (zh) * 2007-05-15 2008-06-04 北京京东方光电科技有限公司 可延长靶材使用寿命的平面磁控溅射靶
EP2067874B1 (de) 2007-11-29 2011-03-02 W.C. Heraeus GmbH Magnetische Shunts in Rohrtargets
DE102007060306B4 (de) 2007-11-29 2011-12-15 W.C. Heraeus Gmbh Magnetische Shunts in Rohrtargets
US8016982B2 (en) * 2007-11-30 2011-09-13 Panasonic Corporation Sputtering apparatus and sputtering method
US8500962B2 (en) * 2008-07-21 2013-08-06 Ascentool Inc Deposition system and methods having improved material utilization
WO2011056581A2 (en) 2009-10-26 2011-05-12 General Plasma, Inc. Rotary magnetron magnet bar and apparatus containing the same for high target utilization
TW201120229A (en) * 2009-12-04 2011-06-16 Ind Tech Res Inst Structure for increasing utilization rate of target
JP2014523969A (ja) 2011-06-27 2014-09-18 ソレラス・リミテッド スパッタリングターゲット
US10032872B2 (en) 2013-05-17 2018-07-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, method for manufacturing the same, and apparatus for manufacturing semiconductor device
CN107208249B (zh) 2015-02-03 2019-08-20 卡迪奈尔镀膜玻璃公司 包括气体分配系统的喷溅装置
EP3310941B1 (de) * 2015-06-16 2020-12-30 Schneider GmbH & Co. KG Vorrichtung und verfahren zur beschichtung von linsen
US10056238B2 (en) 2016-06-27 2018-08-21 Cardinal Cg Company Adjustable return path magnet assembly and methods
US10151023B2 (en) 2016-06-27 2018-12-11 Cardinal Cg Company Laterally adjustable return path magnet assembly and methods
DE102016125273A1 (de) 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Anlage, Verfahren und Träger zur Beschichtung von Brillengläsern
US11244815B2 (en) 2017-04-20 2022-02-08 Honeywell International Inc. Profiled sputtering target and method of making the same
US10790127B2 (en) 2017-05-04 2020-09-29 Cardinal Cg Company Flexible adjustable return path magnet assembly and methods
CN111411342B (zh) * 2019-01-07 2023-02-17 长鑫存储技术有限公司 薄膜沉积设备及薄膜沉积设备的控制方法
JP7264703B2 (ja) * 2019-04-10 2023-04-25 株式会社トヨタプロダクションエンジニアリング マグネトロンスパッタ装置の作動シミュレーション装置及び作動シミュレーション方法
CN112593193B (zh) * 2020-11-16 2022-12-09 中建材玻璃新材料研究院集团有限公司 一种真空磁控溅射镀膜设备及其镀膜方法

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US4444643A (en) * 1982-09-03 1984-04-24 Gartek Systems, Inc. Planar magnetron sputtering device
US4714536A (en) 1985-08-26 1987-12-22 Varian Associates, Inc. Planar magnetron sputtering device with combined circumferential and radial movement of magnetic fields
US5130005A (en) 1990-10-31 1992-07-14 Materials Research Corporation Magnetron sputter coating method and apparatus with rotating magnet cathode
US5364518A (en) 1991-05-28 1994-11-15 Leybold Aktiengesellschaft Magnetron cathode for a rotating target
KR950000906B1 (ko) 1991-08-02 1995-02-03 니찌덴 아넬바 가부시기가이샤 스퍼터링장치
US5188717A (en) 1991-09-12 1993-02-23 Novellus Systems, Inc. Sweeping method and magnet track apparatus for magnetron sputtering
US5328585A (en) 1992-12-11 1994-07-12 Photran Corporation Linear planar-magnetron sputtering apparatus with reciprocating magnet-array
US5399253A (en) * 1992-12-23 1995-03-21 Balzers Aktiengesellschaft Plasma generating device
US5417833A (en) 1993-04-14 1995-05-23 Varian Associates, Inc. Sputtering apparatus having a rotating magnet array and fixed electromagnets
US5507931A (en) 1993-12-30 1996-04-16 Deposition Technologies, Inc. Sputter deposition process
WO1996021750A1 (en) 1995-01-12 1996-07-18 The Boc Group, Inc. Rotatable magnetron with curved or segmented end magnets
JP3814764B2 (ja) * 1995-02-23 2006-08-30 東京エレクトロン株式会社 スパッタ処理方式
JP2910611B2 (ja) 1995-03-30 1999-06-23 日本電気株式会社 形状シミュレーション方法
KR100262768B1 (ko) 1996-04-24 2000-08-01 니시히라 순지 스퍼터성막장치
US5830327A (en) * 1996-10-02 1998-11-03 Intevac, Inc. Methods and apparatus for sputtering with rotating magnet sputter sources
US5876576A (en) * 1997-10-27 1999-03-02 Applied Materials, Inc. Apparatus for sputtering magnetic target materials
EP0918351A1 (de) 1997-11-19 1999-05-26 Sinvaco N.V. Flaches magnetron mit bewegbarer Magnetsanlage

Also Published As

Publication number Publication date
EP1063679B1 (de) 2008-01-09
JP2001059171A (ja) 2001-03-06
EP1063679A1 (de) 2000-12-27
US6416639B1 (en) 2002-07-09

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