KR970005694B1 - Semiconductor memory device - Google Patents

Semiconductor memory device Download PDF

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Publication number
KR970005694B1
KR970005694B1 KR93013407A KR930013407A KR970005694B1 KR 970005694 B1 KR970005694 B1 KR 970005694B1 KR 93013407 A KR93013407 A KR 93013407A KR 930013407 A KR930013407 A KR 930013407A KR 970005694 B1 KR970005694 B1 KR 970005694B1
Authority
KR
South Korea
Prior art keywords
memory device
semiconductor memory
semiconductor
memory
Prior art date
Application number
KR93013407A
Other languages
English (en)
Other versions
KR940006268A (ko
Inventor
Toru Ojaki
Hiroshi Takatou
Akihiro Nitayama
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of KR940006268A publication Critical patent/KR940006268A/ko
Application granted granted Critical
Publication of KR970005694B1 publication Critical patent/KR970005694B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/50—Peripheral circuit region structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
KR93013407A 1992-07-17 1993-07-16 Semiconductor memory device KR970005694B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19112092A JP3197064B2 (ja) 1992-07-17 1992-07-17 半導体記憶装置
JP92-191120 1992-07-17

Publications (2)

Publication Number Publication Date
KR940006268A KR940006268A (ko) 1994-03-23
KR970005694B1 true KR970005694B1 (en) 1997-04-18

Family

ID=16269203

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93013407A KR970005694B1 (en) 1992-07-17 1993-07-16 Semiconductor memory device

Country Status (4)

Country Link
US (1) US5414655A (ko)
JP (1) JP3197064B2 (ko)
KR (1) KR970005694B1 (ko)
DE (1) DE4323961A1 (ko)

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DE4221432C2 (de) * 1992-06-30 1994-06-09 Siemens Ag Globales Planarisierungsverfahren für integrierte Halbleiterschaltungen oder mikromechanische Bauteile
US5714779A (en) * 1992-06-30 1998-02-03 Siemens Aktiengesellschaft Semiconductor memory device having a transistor, a bit line, a word line and a stacked capacitor
DE69329376T2 (de) * 1992-12-30 2001-01-04 Samsung Electronics Co Ltd Verfahren zur Herstellung einer SOI-Transistor-DRAM
US6744091B1 (en) 1995-01-31 2004-06-01 Fujitsu Limited Semiconductor storage device with self-aligned opening and method for fabricating the same
JP4190760B2 (ja) * 1995-01-31 2008-12-03 富士通マイクロエレクトロニクス株式会社 半導体装置
JP2008263211A (ja) * 1995-01-31 2008-10-30 Fujitsu Ltd 半導体装置
JP3127348B2 (ja) * 1995-02-27 2001-01-22 エルジイ・セミコン・カンパニイ・リミテッド 凹凸の表面形状を有するタングステン膜を用いた半導体装置の製造方法
US5539230A (en) * 1995-03-16 1996-07-23 International Business Machines Corporation Chimney capacitor
US5920088A (en) 1995-06-16 1999-07-06 Interuniversitair Micro-Electronica Centrum (Imec Vzw) Vertical MISFET devices
US5963800A (en) * 1995-06-16 1999-10-05 Interuniversitair Micro-Elektronica Centrum (Imec Vzw) CMOS integration process having vertical channel
US5914504A (en) * 1995-06-16 1999-06-22 Imec Vzw DRAM applications using vertical MISFET devices
US6004839A (en) * 1996-01-17 1999-12-21 Nec Corporation Semiconductor device with conductive plugs
DE19618530A1 (de) * 1996-05-08 1997-11-13 Siemens Ag Kondensator mit einer Carbid- oder Boridbarriereschicht
US5866946A (en) * 1996-05-23 1999-02-02 Kabushiki Kaisha Toshiba Semiconductor device having a plug for diffusing hydrogen into a semiconductor substrate
JP2005244251A (ja) * 1996-07-10 2005-09-08 Fujitsu Ltd 半導体装置とその製造方法
JP3941133B2 (ja) * 1996-07-18 2007-07-04 富士通株式会社 半導体装置およびその製造方法
JP3516558B2 (ja) * 1996-08-26 2004-04-05 シャープ株式会社 半導体装置の製造方法
JPH1070252A (ja) * 1996-08-27 1998-03-10 Mitsubishi Electric Corp 半導体装置およびその製造方法
TW377495B (en) * 1996-10-04 1999-12-21 Hitachi Ltd Method of manufacturing semiconductor memory cells and the same apparatus
KR100238218B1 (ko) * 1996-11-29 2000-02-01 윤종용 반도체장치의 커패시터 제조방법
JP2923912B2 (ja) * 1996-12-25 1999-07-26 日本電気株式会社 半導体装置
JPH10242419A (ja) 1997-02-27 1998-09-11 Mitsubishi Electric Corp 半導体装置の製造方法及び半導体装置
TW399319B (en) * 1997-03-19 2000-07-21 Hitachi Ltd Semiconductor device
JPH11186524A (ja) 1997-12-24 1999-07-09 Mitsubishi Electric Corp 半導体装置およびその製造方法
US6384446B2 (en) * 1998-02-17 2002-05-07 Agere Systems Guardian Corp. Grooved capacitor structure for integrated circuits
TW410424B (en) * 1998-09-30 2000-11-01 Taiwan Semiconductor Mfg Method for reducing the aspect ratio of the DRAM periphery contact
US6072210A (en) 1998-12-24 2000-06-06 Lucent Technologies Inc. Integrate DRAM cell having a DRAM capacitor and a transistor
TW454330B (en) 1999-05-26 2001-09-11 Matsushita Electronics Corp Semiconductor apparatus and its manufacturing method
US6333225B1 (en) 1999-08-20 2001-12-25 Micron Technology, Inc. Integrated circuitry and methods of forming circuitry
US6958508B2 (en) * 2000-10-17 2005-10-25 Matsushita Electric Industrial Co., Ltd. Ferroelectric memory having ferroelectric capacitor insulative film
JP4829678B2 (ja) * 2000-10-17 2011-12-07 パナソニック株式会社 強誘電体メモリ及びその製造方法
KR20020052455A (ko) * 2000-12-26 2002-07-04 박종섭 반도체 소자의 제조방법
JP2003289134A (ja) * 2002-03-28 2003-10-10 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
KR100469151B1 (ko) * 2002-05-24 2005-02-02 주식회사 하이닉스반도체 반도체소자의 형성 방법
DE10228571A1 (de) * 2002-06-26 2004-01-22 Infineon Technologies Ag Herstellungsverfahren für eine Halbleiterstruktur mit einer Mehrzahl von Gatestapeln auf einem Halbleitersubstrat und entsprechende Halbleiterstruktur
KR100448719B1 (ko) * 2002-10-18 2004-09-13 삼성전자주식회사 다마신공정을 이용한 반도체 장치 및 그의 제조방법
JP2006108152A (ja) * 2004-09-30 2006-04-20 Oki Electric Ind Co Ltd 半導体記憶装置
JP4557903B2 (ja) * 2006-02-10 2010-10-06 パナソニック株式会社 半導体装置及びその製造方法
DE102006016530A1 (de) * 2006-04-07 2007-10-11 Infineon Technologies Ag Speicherkondensator und Verfahren zum Herstellen eines solchen Speicherkondensators
US20100223433A1 (en) * 2009-02-27 2010-09-02 Tatu Ylonen Oy Ltd Configurable object graph traversal with redirection for garbage collection

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0789569B2 (ja) * 1986-03-26 1995-09-27 株式会社日立製作所 半導体集積回路装置及びその製造方法
JPH01154551A (ja) * 1987-12-11 1989-06-16 Oki Electric Ind Co Ltd 半導体メモリ集積回路装置及びその製造方法
JP2590171B2 (ja) * 1988-01-08 1997-03-12 株式会社日立製作所 半導体記憶装置
JPH0828473B2 (ja) * 1988-09-29 1996-03-21 三菱電機株式会社 半導体装置およびその製造方法
EP0370407A1 (en) * 1988-11-18 1990-05-30 Nec Corporation Semiconductor memory device of one transistor - one capacitor memory cell type
FR2658951B1 (fr) * 1990-02-23 1992-05-07 Bonis Maurice Procede de fabrication d'un circuit integre pour filiere analogique rapide utilisant des lignes d'interconnexions locales en siliciure.
JPH0834304B2 (ja) * 1990-09-20 1996-03-29 富士通株式会社 半導体装置およびその製造方法

Also Published As

Publication number Publication date
US5414655A (en) 1995-05-09
DE4323961A1 (de) 1994-01-20
KR940006268A (ko) 1994-03-23
JP3197064B2 (ja) 2001-08-13
JPH0637280A (ja) 1994-02-10

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