KR970001008B1 - 원판형 공작물을 지지시키기 위한 캐리어 - Google Patents
원판형 공작물을 지지시키기 위한 캐리어 Download PDFInfo
- Publication number
- KR970001008B1 KR970001008B1 KR1019880014743A KR880014743A KR970001008B1 KR 970001008 B1 KR970001008 B1 KR 970001008B1 KR 1019880014743 A KR1019880014743 A KR 1019880014743A KR 880014743 A KR880014743 A KR 880014743A KR 970001008 B1 KR970001008 B1 KR 970001008B1
- Authority
- KR
- South Korea
- Prior art keywords
- carrier
- shaft
- annular
- outer portion
- rim
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0422—Apparatus for fluid treatment for etching for wet etching
- H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Weting (AREA)
- ing And Chemical Polishing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photographic Processing Devices Using Wet Methods (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Holding Or Fastening Of Disk On Rotational Shaft (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960060979A KR0120321B1 (ko) | 1987-11-09 | 1996-12-02 | 원판형 공작물 에칭장치 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATA2958/87 | 1987-11-09 | ||
| AT0295887A AT389959B (de) | 1987-11-09 | 1987-11-09 | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR890008014A KR890008014A (ko) | 1989-07-08 |
| KR970001008B1 true KR970001008B1 (ko) | 1997-01-25 |
Family
ID=3543072
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019880014743A Expired - Lifetime KR970001008B1 (ko) | 1987-11-09 | 1988-11-09 | 원판형 공작물을 지지시키기 위한 캐리어 |
| KR1019960060979A Ceased KR0120321B1 (ko) | 1987-11-09 | 1996-12-02 | 원판형 공작물 에칭장치 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960060979A Ceased KR0120321B1 (ko) | 1987-11-09 | 1996-12-02 | 원판형 공작물 에칭장치 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4903717A (enExample) |
| EP (2) | EP0316296B1 (enExample) |
| JP (2) | JPH01240682A (enExample) |
| KR (2) | KR970001008B1 (enExample) |
| AT (3) | AT389959B (enExample) |
| CA (1) | CA1309929C (enExample) |
| DE (2) | DE3889672D1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7350319B2 (en) | 2004-09-06 | 2008-04-01 | Samsung Electronics Co., Ltd. | Clothing dryer |
Families Citing this family (208)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5198034A (en) * | 1987-03-31 | 1993-03-30 | Epsilon Technology, Inc. | Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment |
| US4821674A (en) * | 1987-03-31 | 1989-04-18 | Deboer Wiebe B | Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment |
| DE3943478C2 (de) * | 1989-05-08 | 1995-11-16 | Philips Electronics Nv | Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumbehandlungsanlage |
| US4989345A (en) * | 1989-12-18 | 1991-02-05 | Gill Jr Gerald L | Centrifugal spin dryer for semiconductor wafer |
| DE4116392C2 (de) * | 1991-05-18 | 2001-05-03 | Micronas Gmbh | Halterung zur einseitigen Naßätzung von Halbleiterscheiben |
| US5224503A (en) * | 1992-06-15 | 1993-07-06 | Semitool, Inc. | Centrifugal wafer carrier cleaning apparatus |
| JP3402644B2 (ja) * | 1993-01-29 | 2003-05-06 | キヤノン株式会社 | 半導体装置の製造方法 |
| EP0611274B1 (de) * | 1993-02-08 | 1998-12-02 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG | Träger für scheibenförmige Gegenstände |
| DE59406900D1 (de) * | 1993-02-08 | 1998-10-22 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige Gegenstände |
| JP3277404B2 (ja) * | 1993-03-31 | 2002-04-22 | ソニー株式会社 | 基板洗浄方法及び基板洗浄装置 |
| JP2862754B2 (ja) * | 1993-04-19 | 1999-03-03 | 東京エレクトロン株式会社 | 処理装置及び回転部材 |
| US5510723A (en) * | 1994-03-01 | 1996-04-23 | Micron Custom Manufacturing, Inc. Usa | Diced semiconductor device handler |
| US5979475A (en) * | 1994-04-28 | 1999-11-09 | Hitachi, Ltd. | Specimen holding method and fluid treatment method of specimen surface and systems therefor |
| US5705223A (en) * | 1994-07-26 | 1998-01-06 | International Business Machine Corp. | Method and apparatus for coating a semiconductor wafer |
| US5516125A (en) * | 1994-11-30 | 1996-05-14 | Texas Instruments Incorporated | Baffled collet for vacuum pick-up of a semiconductor die |
| AT405225B (de) * | 1995-05-02 | 1999-06-25 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum behandeln annähernd runder oder kreisscheibenförmiger gegenstände, insbesondere siliziumwafer |
| JPH08316190A (ja) * | 1995-05-18 | 1996-11-29 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| WO1997003456A1 (de) * | 1995-07-12 | 1997-01-30 | Sez Semiconductor-Equipment Zubehör Für Die Halbleiterfertigung Gesellschaft Mbh | Träger für scheibenförmige gegenstände, insbesondere siliziumscheiben |
| US5697427A (en) * | 1995-12-22 | 1997-12-16 | Applied Materials, Inc. | Apparatus and method for cooling a substrate |
| KR100282160B1 (ko) * | 1996-05-07 | 2001-03-02 | 가야시마 고조 | 기판처리장치 및 처리방법 |
| DE19621399A1 (de) * | 1996-05-28 | 1997-12-04 | Siemens Ag | Verfahren zum Ätzen eines Halbleitersubstrats sowie Ätzanlage |
| US6183565B1 (en) | 1997-07-08 | 2001-02-06 | Asm International N.V | Method and apparatus for supporting a semiconductor wafer during processing |
| US6413436B1 (en) * | 1999-01-27 | 2002-07-02 | Semitool, Inc. | Selective treatment of the surface of a microelectronic workpiece |
| US6264752B1 (en) | 1998-03-13 | 2001-07-24 | Gary L. Curtis | Reactor for processing a microelectronic workpiece |
| US6350319B1 (en) * | 1998-03-13 | 2002-02-26 | Semitool, Inc. | Micro-environment reactor for processing a workpiece |
| US5778554A (en) | 1996-07-15 | 1998-07-14 | Oliver Design, Inc. | Wafer spin dryer and method of drying a wafer |
| KR100508575B1 (ko) * | 1996-09-24 | 2005-10-21 | 동경 엘렉트론 주식회사 | 세정처리방법및장치와기판처리용장치 |
| SG103277A1 (en) * | 1996-09-24 | 2004-04-29 | Tokyo Electron Ltd | Method and apparatus for cleaning treatment |
| AT407312B (de) * | 1996-11-20 | 2001-02-26 | Sez Semiconduct Equip Zubehoer | Rotierbarer träger für kreisrunde, scheibenförmige gegenstände, insbesondere halbleiterwafer oder -substrate |
| AT407450B (de) * | 1997-03-18 | 2001-03-26 | Thallner Erich | Vorrichtung zur behandlung scheibenförmiger halbleiter- und siliziumsubstrate |
| AT407806B (de) * | 1997-05-23 | 2001-06-25 | Sez Semiconduct Equip Zubehoer | Anordnung zum behandeln wafer-förmiger gegenstände, insbesondere von siliziumwafern |
| US5834731A (en) * | 1997-06-04 | 1998-11-10 | Hmt Technology Corporation | Laser texturing apparatus with bernoulli holder |
| AT405701B (de) * | 1997-06-18 | 1999-11-25 | Sez Semiconduct Equip Zubehoer | Greifer für halbleiterwafer und andere scheibenförmige gegenstände |
| AT411304B (de) * | 1997-06-18 | 2003-11-25 | Sez Ag | Träger für scheibenförmige gegenstände, insbesondere silizium-wafer |
| AT407385B (de) * | 1997-09-18 | 2001-02-26 | Sez Semiconduct Equip Zubehoer | Anordnung um das nachtropfen von flüssigkeiten aus leitungen zu verhindern |
| AT410043B (de) * | 1997-09-30 | 2003-01-27 | Sez Ag | Verfahren zum planarisieren von halbleitersubstraten |
| US6332470B1 (en) * | 1997-12-30 | 2001-12-25 | Boris Fishkin | Aerosol substrate cleaner |
| DE19801360A1 (de) * | 1998-01-16 | 1999-07-22 | Sez Semiconduct Equip Zubehoer | Verfahren und Vorrichtung zum Behandeln von Halbleiter-Oberflächen |
| WO1999041022A1 (en) * | 1998-02-14 | 1999-08-19 | Strasbaugh | Accurate positioning of a wafer |
| DE19806406C1 (de) * | 1998-02-17 | 1999-07-29 | Sez Semiconduct Equip Zubehoer | Verfahren zum Rauhätzen einer Halbleiter-Oberfläche |
| DE19807460A1 (de) * | 1998-02-21 | 1999-04-15 | Sez Semiconduct Equip Zubehoer | Ringförmige Aufnahme für einen rotierenden Träger |
| US20050217707A1 (en) * | 1998-03-13 | 2005-10-06 | Aegerter Brian K | Selective processing of microelectronic workpiece surfaces |
| US6423642B1 (en) | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
| US6318385B1 (en) | 1998-03-13 | 2001-11-20 | Semitool, Inc. | Micro-environment chamber and system for rinsing and drying a semiconductor workpiece |
| TW452828B (en) * | 1998-03-13 | 2001-09-01 | Semitool Inc | Micro-environment reactor for processing a microelectronic workpiece |
| US6632292B1 (en) | 1998-03-13 | 2003-10-14 | Semitool, Inc. | Selective treatment of microelectronic workpiece surfaces |
| US5967578A (en) * | 1998-05-29 | 1999-10-19 | Sez North America, Inc. | Tool for the contact-free support of plate-like substrates |
| US6125863A (en) * | 1998-06-30 | 2000-10-03 | Semitool, Inc. | Offset rotor flat media processor |
| US6062239A (en) * | 1998-06-30 | 2000-05-16 | Semitool, Inc. | Cross flow centrifugal processor |
| US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| US6432214B2 (en) | 1998-07-10 | 2002-08-13 | Semitool, Inc. | Cleaning apparatus |
| TW380284B (en) * | 1998-09-09 | 2000-01-21 | Promos Technologies Inc | Method for improving etching uniformity during a wet etching process |
| US6217034B1 (en) * | 1998-09-24 | 2001-04-17 | Kla-Tencor Corporation | Edge handling wafer chuck |
| DE19854743A1 (de) * | 1998-11-27 | 2000-06-08 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum Naßätzen einer Kante einer Halbleiterscheibe |
| AT408930B (de) | 1999-01-13 | 2002-04-25 | Thallner Erich | Vorrichtung zur chemischen behandlung von wafern |
| US6680253B2 (en) | 1999-01-22 | 2004-01-20 | Semitool, Inc. | Apparatus for processing a workpiece |
| US6492284B2 (en) | 1999-01-22 | 2002-12-10 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
| US7217325B2 (en) * | 1999-01-22 | 2007-05-15 | Semitool, Inc. | System for processing a workpiece |
| US6511914B2 (en) | 1999-01-22 | 2003-01-28 | Semitool, Inc. | Reactor for processing a workpiece using sonic energy |
| US6548411B2 (en) | 1999-01-22 | 2003-04-15 | Semitool, Inc. | Apparatus and methods for processing a workpiece |
| US20030038035A1 (en) * | 2001-05-30 | 2003-02-27 | Wilson Gregory J. | Methods and systems for controlling current in electrochemical processing of microelectronic workpieces |
| KR100695660B1 (ko) * | 1999-04-13 | 2007-03-19 | 세미툴 인코포레이티드 | 개선된 처리 유체 유동을 갖는 처리 챔버를 구비하는가공편 프로세서 |
| US7438788B2 (en) * | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
| US7160421B2 (en) * | 1999-04-13 | 2007-01-09 | Semitool, Inc. | Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7264698B2 (en) * | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| US7020537B2 (en) * | 1999-04-13 | 2006-03-28 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
| ATE211855T1 (de) * | 1999-04-28 | 2002-01-15 | Sez Semiconduct Equip Zubehoer | Vorrichtung und verfahren zur flüssigkeitsbehandlung von scheibenförmigen gegenständen |
| US6600557B1 (en) | 1999-05-21 | 2003-07-29 | Memc Electronic Materials, Inc. | Method for the detection of processing-induced defects in a silicon wafer |
| US6221781B1 (en) | 1999-05-27 | 2001-04-24 | Fsi International, Inc. | Combined process chamber with multi-positionable pedestal |
| AT409429B (de) | 1999-07-15 | 2002-08-26 | Sez Semiconduct Equip Zubehoer | Verfahren zum ätzbehandeln von halbleitersubstraten zwecks freilegen einer metallschicht |
| TW504776B (en) * | 1999-09-09 | 2002-10-01 | Mimasu Semiconductor Ind Co | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
| US6428505B1 (en) | 1999-11-19 | 2002-08-06 | Prismedical Corporation | In-line IV drug delivery pack with controllable dilution |
| US6497241B1 (en) * | 1999-12-23 | 2002-12-24 | Lam Research Corporation | Hollow core spindle and spin, rinse, and dry module including the same |
| US6286231B1 (en) | 2000-01-12 | 2001-09-11 | Semitool, Inc. | Method and apparatus for high-pressure wafer processing and drying |
| SG118063A1 (en) * | 2000-02-11 | 2006-01-27 | Sez Ag | A device for an etch treatment of a disk-like object |
| US20050183959A1 (en) * | 2000-04-13 | 2005-08-25 | Wilson Gregory J. | Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece |
| US7102763B2 (en) * | 2000-07-08 | 2006-09-05 | Semitool, Inc. | Methods and apparatus for processing microelectronic workpieces using metrology |
| DE10052762A1 (de) * | 2000-10-25 | 2002-05-16 | Infineon Technologies Ag | Verfahren und Vorrichtung zum Reinigen einer Halbleiterscheibe |
| EP1202326B1 (de) | 2000-10-31 | 2004-01-02 | Sez Ag | Vorrichtung zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen |
| US20050061676A1 (en) * | 2001-03-12 | 2005-03-24 | Wilson Gregory J. | System for electrochemically processing a workpiece |
| CA2448696A1 (en) | 2001-05-04 | 2002-11-14 | Prismedical Corporation | Dual chamber dissolution container with passive agitation |
| WO2003008140A2 (en) * | 2001-07-16 | 2003-01-30 | Semitool, Inc. | Apparatus for processing a workpiece |
| US6689418B2 (en) | 2001-08-03 | 2004-02-10 | Applied Materials Inc. | Apparatus for wafer rinse and clean and edge etching |
| WO2003018874A2 (en) * | 2001-08-31 | 2003-03-06 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| AT413162B (de) * | 2001-09-26 | 2005-11-15 | Sez Ag | Ringförmige aufnahmevorrichtung für einen rotierenden träger zur aufnahme eines scheibenförmigen gegenstandes wie eines halbleiterwafers |
| US6786996B2 (en) | 2001-10-16 | 2004-09-07 | Applied Materials Inc. | Apparatus and method for edge bead removal |
| US6708701B2 (en) * | 2001-10-16 | 2004-03-23 | Applied Materials Inc. | Capillary ring |
| JP4018958B2 (ja) * | 2001-10-30 | 2007-12-05 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| AT411335B (de) * | 2002-03-06 | 2003-12-29 | Sez Ag | Verfahren zum nassbehandeln von scheibenförmigen gegenständen |
| DE10212420A1 (de) * | 2002-03-21 | 2003-10-16 | Erich Thallner | Einrichtung zur Aufnahme eines Wafers |
| AT500984B1 (de) * | 2002-06-25 | 2007-05-15 | Sez Ag | Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen |
| US6908567B2 (en) * | 2002-07-30 | 2005-06-21 | Applied Materials Israel, Ltd. | Contaminant removal by laser-accelerated fluid |
| US7584760B2 (en) * | 2002-09-13 | 2009-09-08 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
| DE10243022A1 (de) * | 2002-09-17 | 2004-03-25 | Degussa Ag | Abscheidung eines Feststoffs durch thermische Zersetzung einer gasförmigen Substanz in einem Becherreaktor |
| US20050049751A1 (en) * | 2002-11-11 | 2005-03-03 | Farnworth Warren M. | Machine vision systems for use with programmable material consolidation apparatus and systems |
| US6992014B2 (en) * | 2002-11-13 | 2006-01-31 | International Business Machines Corporation | Method and apparatus for etch rate uniformity control |
| US20040108212A1 (en) * | 2002-12-06 | 2004-06-10 | Lyndon Graham | Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces |
| DE10302611B4 (de) * | 2003-01-23 | 2011-07-07 | Siltronic AG, 81737 | Polierte Halbleiterscheibe und Verfahren zu deren Herstellung und Anordnung bestehend aus einer Halbleiterscheibe und einem Schild |
| DE602004019061D1 (de) * | 2003-03-20 | 2009-03-05 | Sez Ag | Einrichtung und verfahren zur nassbehandlung scheibenförmiger artikel |
| JP4105574B2 (ja) * | 2003-03-26 | 2008-06-25 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| US20040206304A1 (en) * | 2003-04-15 | 2004-10-21 | Menear John Edgar | Pressurized chuck for controlling backside wafer contamination |
| US7467635B2 (en) * | 2003-05-12 | 2008-12-23 | Sprout Co., Ltd. | Apparatus and method for substrate processing |
| CN1301804C (zh) * | 2003-09-19 | 2007-02-28 | 旺宏电子股份有限公司 | 清洗保养旋转蚀刻机的方法 |
| US20050112279A1 (en) * | 2003-11-24 | 2005-05-26 | International Business Machines Corporation | Dynamic release wafer grip and method of use |
| DE20318462U1 (de) * | 2003-11-26 | 2004-03-11 | Infineon Technologies Ag | Anordnung elektronischer Halbleiterbauelemente auf einem Trägersystem zur Behandlung der Halbleiterbauelemente mit einem flüssigen Medium |
| JP4342331B2 (ja) * | 2004-02-09 | 2009-10-14 | 株式会社コガネイ | 非接触搬送装置 |
| JP4437415B2 (ja) * | 2004-03-03 | 2010-03-24 | リンク・パワー株式会社 | 非接触保持装置および非接触保持搬送装置 |
| WO2005091346A1 (ja) * | 2004-03-22 | 2005-09-29 | Mimasu Semiconductor Industry Co. Ltd. | スピンエッチングにおける工程管理方法及びスピンエッチング装置 |
| TWI241976B (en) * | 2004-05-27 | 2005-10-21 | Quanta Display Inc | Substrate transporting apparatus |
| TWI267405B (en) | 2004-07-20 | 2006-12-01 | Sez Ag | Fluid discharging device |
| US7193295B2 (en) * | 2004-08-20 | 2007-03-20 | Semitool, Inc. | Process and apparatus for thinning a semiconductor workpiece |
| US7288489B2 (en) * | 2004-08-20 | 2007-10-30 | Semitool, Inc. | Process for thinning a semiconductor workpiece |
| US20060040111A1 (en) * | 2004-08-20 | 2006-02-23 | Dolechek Kert L | Process chamber and system for thinning a semiconductor workpiece |
| US7354649B2 (en) | 2004-08-20 | 2008-04-08 | Semitool, Inc. | Semiconductor workpiece |
| US20060046499A1 (en) * | 2004-08-20 | 2006-03-02 | Dolechek Kert L | Apparatus for use in thinning a semiconductor workpiece |
| JP2006086384A (ja) * | 2004-09-16 | 2006-03-30 | Ses Co Ltd | 基板処理装置 |
| EP1829094A2 (en) * | 2004-12-03 | 2007-09-05 | Solid State Equipment Corporation | Wet etching of the edge and bevel of a silicon wafer |
| KR101255048B1 (ko) | 2005-04-01 | 2013-04-16 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리 유체를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는데 이용되는 장치용 배리어 구조 및 노즐 장치 |
| JP2007115728A (ja) * | 2005-10-18 | 2007-05-10 | Sumco Corp | ウェーハの枚葉式エッチング装置及びウェーハの枚葉式エッチング方法 |
| KR100687011B1 (ko) * | 2006-01-13 | 2007-02-26 | 세메스 주식회사 | 기판 처리 장치 |
| JP2009543338A (ja) | 2006-07-07 | 2009-12-03 | エフエスアイ インターナショナル インコーポレーテッド | 1つ以上の処理流体によりマイクロエレクトロニクス半製品を処理するために用いられる道具において使われる隔壁構造およびノズル装置 |
| US8042254B1 (en) * | 2006-12-22 | 2011-10-25 | Kla-Tencor Corporation | Method for improving edge handling chuck aerodynamics |
| US7849865B2 (en) * | 2007-01-05 | 2010-12-14 | Semitool, Inc. | System for processing a workpiece |
| JP2008282938A (ja) * | 2007-05-10 | 2008-11-20 | Sumco Corp | ウェーハの枚葉式エッチング装置 |
| US7516995B2 (en) * | 2007-06-08 | 2009-04-14 | Nebojsa Ilija Jaksic | Method for manipulating objects |
| TWI373804B (en) * | 2007-07-13 | 2012-10-01 | Lam Res Ag | Apparatus and method for wet treatment of disc-like articles |
| KR101060664B1 (ko) * | 2007-08-07 | 2011-08-31 | 에프에스아이 인터내쇼날 인크. | 하나 이상의 처리유체로 전자소자를 처리하는 장비의 배리어 판 및 벤튜리 시스템의 세정방법 및 관련 장치 |
| US8235062B2 (en) * | 2008-05-09 | 2012-08-07 | Fsi International, Inc. | Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation |
| US9159593B2 (en) * | 2008-06-02 | 2015-10-13 | Lam Research Corporation | Method of particle contaminant removal |
| JP5084639B2 (ja) * | 2008-06-30 | 2012-11-28 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
| CN101673062B (zh) * | 2008-09-09 | 2011-10-26 | 中芯国际集成电路制造(北京)有限公司 | 一种全湿法去胶的装置 |
| DE102009051565A1 (de) * | 2009-10-22 | 2011-04-28 | Alexander Borowski | Ansaug-Greifervorrichtung für flache Substrate |
| US20110130009A1 (en) * | 2009-11-30 | 2011-06-02 | Lam Research Ag | Method and apparatus for surface treatment using a mixture of acid and oxidizing gas |
| US8608146B2 (en) * | 2009-12-18 | 2013-12-17 | Lam Research Ag | Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin |
| US8613288B2 (en) * | 2009-12-18 | 2013-12-24 | Lam Research Ag | High temperature chuck and method of using same |
| US8596623B2 (en) * | 2009-12-18 | 2013-12-03 | Lam Research Ag | Device and process for liquid treatment of a wafer shaped article |
| IT1398436B1 (it) * | 2010-01-27 | 2013-02-22 | Applied Materials Inc | Dispositivo di manipolazione di substrati mediante aria compressa |
| US9190310B2 (en) | 2010-04-16 | 2015-11-17 | Lam Research Ag | Grounded chuck |
| US9130002B2 (en) * | 2010-05-07 | 2015-09-08 | Lam Research Ag | Device for holding wafer shaped articles |
| US8485204B2 (en) | 2010-05-25 | 2013-07-16 | Lam Research Ag | Closed chamber with fluid separation feature |
| CN102023487B (zh) * | 2010-05-26 | 2013-06-19 | 沈阳芯源微电子设备有限公司 | 真空边缘夹持机构 |
| US8646767B2 (en) * | 2010-07-23 | 2014-02-11 | Lam Research Ag | Device for holding wafer shaped articles |
| US8926788B2 (en) | 2010-10-27 | 2015-01-06 | Lam Research Ag | Closed chamber for wafer wet processing |
| DE202010015018U1 (de) * | 2010-11-07 | 2011-04-14 | Bohnet, Hans | Anordnung zur Herstellung von strukturierten Substraten |
| US9997379B2 (en) | 2010-11-30 | 2018-06-12 | Lam Research Ag | Method and apparatus for wafer wet processing |
| US8997764B2 (en) | 2011-05-27 | 2015-04-07 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
| US8945341B2 (en) | 2011-08-22 | 2015-02-03 | Lam Research Ag | Method and device for wet treatment of plate-like articles |
| US10269615B2 (en) | 2011-09-09 | 2019-04-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US9355883B2 (en) | 2011-09-09 | 2016-05-31 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
| US8894877B2 (en) | 2011-10-19 | 2014-11-25 | Lam Research Ag | Method, apparatus and composition for wet etching |
| US9484229B2 (en) | 2011-11-14 | 2016-11-01 | Lam Research Ag | Device and method for processing wafer-shaped articles |
| US9136155B2 (en) | 2011-11-17 | 2015-09-15 | Lam Research Ag | Method and device for processing wafer shaped articles |
| US8899246B2 (en) | 2011-11-23 | 2014-12-02 | Lam Research Ag | Device and method for processing wafer shaped articles |
| US8974632B2 (en) | 2011-11-30 | 2015-03-10 | Lam Research Ag | Device and method for treating wafer-shaped articles |
| US9633890B2 (en) | 2011-12-16 | 2017-04-25 | Lam Research Ag | Device for treating surfaces of wafer-shaped articles and gripping pin for use in the device |
| US8662554B1 (en) * | 2011-12-20 | 2014-03-04 | Western Digital Technologies, Inc. | Vacuum pick-up end effecter to pick and place a component in a manufacturing process |
| US9548223B2 (en) | 2011-12-23 | 2017-01-17 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| CN103357637B (zh) * | 2012-03-31 | 2016-06-22 | 弘塑科技股份有限公司 | 清洗蚀刻机台移动式泄液槽的排气装置 |
| US20130309874A1 (en) | 2012-05-15 | 2013-11-21 | Lam Research Ag | Method and apparatus for liquid treatment of wafer-shaped articles |
| US9316443B2 (en) | 2012-08-23 | 2016-04-19 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
| US9147593B2 (en) | 2012-10-10 | 2015-09-29 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles |
| US9748120B2 (en) | 2013-07-01 | 2017-08-29 | Lam Research Ag | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
| US9093482B2 (en) | 2012-10-12 | 2015-07-28 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
| US9616451B2 (en) | 2012-11-19 | 2017-04-11 | Lam Research Ag | Apparatus for processing wafer-shaped articles |
| US9146007B2 (en) | 2012-11-27 | 2015-09-29 | Lam Research Ag | Apparatus for liquid treatment of work pieces and flow control system for use in same |
| US9589818B2 (en) | 2012-12-20 | 2017-03-07 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles and liquid control ring for use in same |
| US9870933B2 (en) | 2013-02-08 | 2018-01-16 | Lam Research Ag | Process and apparatus for treating surfaces of wafer-shaped articles |
| US10134611B2 (en) | 2013-03-22 | 2018-11-20 | Lam Research Ag | Collector for use with an apparatus for treating wafer-shaped articles |
| US9245777B2 (en) | 2013-05-15 | 2016-01-26 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus |
| US9022444B1 (en) | 2013-05-20 | 2015-05-05 | Western Digital Technologies, Inc. | Vacuum nozzle having back-pressure release hole |
| US9418883B2 (en) | 2013-07-03 | 2016-08-16 | Lam Research Ag | Device for holding wafer shaped articles |
| US9120232B1 (en) | 2013-07-26 | 2015-09-01 | Western Digital Technologies, Inc. | Vacuum pick-up end effector with improved vacuum reading for small surface |
| US10707099B2 (en) | 2013-08-12 | 2020-07-07 | Veeco Instruments Inc. | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
| US9355836B2 (en) | 2013-12-31 | 2016-05-31 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
| US10043686B2 (en) | 2013-12-31 | 2018-08-07 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US9597701B2 (en) | 2013-12-31 | 2017-03-21 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US9657397B2 (en) | 2013-12-31 | 2017-05-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US9536770B2 (en) | 2014-01-14 | 2017-01-03 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
| US9698029B2 (en) | 2014-02-19 | 2017-07-04 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
| US9779979B2 (en) | 2014-02-24 | 2017-10-03 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles |
| US9799539B2 (en) | 2014-06-16 | 2017-10-24 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
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| US9500405B2 (en) * | 2014-10-28 | 2016-11-22 | Lam Research Ag | Convective wafer heating by impingement with hot gas |
| US10167552B2 (en) | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
| CN104701233B (zh) * | 2015-03-10 | 2017-10-17 | 北京七星华创电子股份有限公司 | 一种盘状物夹持装置 |
| KR102356217B1 (ko) * | 2015-05-14 | 2022-01-27 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 기판 베벨 및 이면 보호를 위한 장치 |
| US9911630B2 (en) | 2015-10-30 | 2018-03-06 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US9887120B2 (en) | 2015-11-03 | 2018-02-06 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US9968970B2 (en) | 2015-12-04 | 2018-05-15 | Lam Research Ag | Spin chuck with in situ cleaning capability |
| US9972514B2 (en) | 2016-03-07 | 2018-05-15 | Lam Research Ag | Apparatus for liquid treatment of wafer shaped articles |
| US9887122B2 (en) | 2016-05-06 | 2018-02-06 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
| US10720343B2 (en) | 2016-05-31 | 2020-07-21 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
| US10068792B2 (en) | 2016-05-31 | 2018-09-04 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
| CN106181765A (zh) * | 2016-07-26 | 2016-12-07 | 四川然新材料科技有限公司 | 一种用于圆片刀加工的固定装置 |
| US10446416B2 (en) | 2016-08-09 | 2019-10-15 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
| US10312117B2 (en) | 2016-08-10 | 2019-06-04 | Lam Research Ag | Apparatus and radiant heating plate for processing wafer-shaped articles |
| US10483010B2 (en) | 2016-09-07 | 2019-11-19 | Lam Research Ag | Reduction of surface and embedded substrate charge by controlled exposure to vacuum ultraviolet (VUV) light in low-oxygen environment |
| US11342215B2 (en) | 2017-04-25 | 2022-05-24 | Veeco Instruments Inc. | Semiconductor wafer processing chamber |
| US10658204B2 (en) | 2017-08-08 | 2020-05-19 | Lam Research Ag | Spin chuck with concentrated center and radial heating |
| GB201813368D0 (en) | 2018-08-16 | 2018-10-03 | Lam Res Ag | Etchant composition |
| CN111453996A (zh) * | 2020-03-05 | 2020-07-28 | 绍兴同芯成集成电路有限公司 | 一种环形玻璃载板的制造方法 |
| GB202012725D0 (en) | 2020-08-14 | 2020-09-30 | Lam Res Ag | Apparatus for processing a wafer-shaped article |
| CN112185885B (zh) * | 2020-12-01 | 2021-07-16 | 西安奕斯伟硅片技术有限公司 | 一种用于卡夹硅片的卡盘销及用于保持硅片的装置 |
| WO2022126403A1 (en) * | 2020-12-16 | 2022-06-23 | Acm Research (Shanghai) , Inc. | Substrate supporting apparatus |
| JP7738507B2 (ja) * | 2022-03-24 | 2025-09-12 | 株式会社Screenホールディングス | 基板処理装置 |
| BE1031752B1 (fr) | 2023-07-05 | 2025-02-06 | The Soil Res Lab Sprl | Vis chauffantes pour le traitement des plantes invasives |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3523706A (en) * | 1967-10-27 | 1970-08-11 | Ibm | Apparatus for supporting articles without structural contact and for positioning the supported articles |
| US3953265A (en) * | 1975-04-28 | 1976-04-27 | International Business Machines Corporation | Meniscus-contained method of handling fluids in the manufacture of semiconductor wafers |
| DE2609754A1 (de) * | 1976-03-09 | 1977-09-22 | Wacker Chemitronic | Halterung fuer das beidseitig beruehrungslose aufnehmen von scheiben |
| JPS54113265A (en) * | 1978-02-23 | 1979-09-04 | Mitsubishi Electric Corp | Resistor developing equipement |
| US4131267A (en) * | 1978-06-02 | 1978-12-26 | Disco Kabushiki Kaisha | Apparatus for holding workpiece by suction |
| DE3027934A1 (de) * | 1980-07-23 | 1982-02-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur einseitigen aetzung von halbleiterscheiben |
| DE3036829A1 (de) * | 1980-09-30 | 1982-05-13 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum aufnehmen von kristallscheiben |
| US4530635A (en) * | 1983-06-15 | 1985-07-23 | The Perkin-Elmer Corporation | Wafer transferring chuck assembly |
| JPS6074626A (ja) * | 1983-09-30 | 1985-04-26 | Fujitsu Ltd | ウエハー処理方法及び装置 |
| JPS6092620A (ja) * | 1983-10-26 | 1985-05-24 | Mitsubishi Electric Corp | 反応性イオンビ−ムエツチング装置 |
| US4674521A (en) * | 1985-05-20 | 1987-06-23 | Machine Technology, Inc. | Rinsing apparatus and method |
| US4677758A (en) * | 1985-10-08 | 1987-07-07 | Seiichiro Aigo | Spin drier for semiconductor material |
| JPS6286822A (ja) * | 1985-10-14 | 1987-04-21 | Nec Corp | 半導体素子の製造装置 |
-
1987
- 1987-11-09 AT AT0295887A patent/AT389959B/de not_active IP Right Cessation
-
1988
- 1988-10-31 AT AT88890271T patent/ATE104470T1/de not_active IP Right Cessation
- 1988-10-31 DE DE3889672T patent/DE3889672D1/de not_active Expired - Lifetime
- 1988-10-31 DE DE3889073T patent/DE3889073D1/de not_active Expired - Lifetime
- 1988-10-31 AT AT91104986T patent/ATE105972T1/de not_active IP Right Cessation
- 1988-10-31 EP EP88890271A patent/EP0316296B1/de not_active Expired - Lifetime
- 1988-10-31 EP EP91104986A patent/EP0444714B1/de not_active Expired - Lifetime
- 1988-11-09 CA CA000582633A patent/CA1309929C/en not_active Expired - Lifetime
- 1988-11-09 JP JP63283515A patent/JPH01240682A/ja active Granted
- 1988-11-09 KR KR1019880014743A patent/KR970001008B1/ko not_active Expired - Lifetime
- 1988-11-09 US US07/269,017 patent/US4903717A/en not_active Expired - Lifetime
-
1991
- 1991-09-30 JP JP3251845A patent/JPH0715150B2/ja not_active Expired - Lifetime
-
1996
- 1996-12-02 KR KR1019960060979A patent/KR0120321B1/ko not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7350319B2 (en) | 2004-09-06 | 2008-04-01 | Samsung Electronics Co., Ltd. | Clothing dryer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05283395A (ja) | 1993-10-29 |
| US4903717A (en) | 1990-02-27 |
| EP0444714A1 (de) | 1991-09-04 |
| KR890008014A (ko) | 1989-07-08 |
| EP0444714B1 (de) | 1994-05-18 |
| DE3889672D1 (de) | 1994-06-23 |
| AT389959B (de) | 1990-02-26 |
| JPH0514791B2 (enExample) | 1993-02-25 |
| EP0316296B1 (de) | 1994-04-13 |
| JPH01240682A (ja) | 1989-09-26 |
| ATE105972T1 (de) | 1994-06-15 |
| JPH0715150B2 (ja) | 1995-02-22 |
| ATE104470T1 (de) | 1994-04-15 |
| ATA295887A (de) | 1989-07-15 |
| DE3889073D1 (de) | 1994-05-19 |
| CA1309929C (en) | 1992-11-10 |
| EP0316296A3 (en) | 1990-09-19 |
| KR0120321B1 (ko) | 1997-10-22 |
| EP0316296A2 (de) | 1989-05-17 |
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