IT1398436B1 - Dispositivo di manipolazione di substrati mediante aria compressa - Google Patents

Dispositivo di manipolazione di substrati mediante aria compressa

Info

Publication number
IT1398436B1
IT1398436B1 ITUD2010A000014A ITUD20100014A IT1398436B1 IT 1398436 B1 IT1398436 B1 IT 1398436B1 IT UD2010A000014 A ITUD2010A000014 A IT UD2010A000014A IT UD20100014 A ITUD20100014 A IT UD20100014A IT 1398436 B1 IT1398436 B1 IT 1398436B1
Authority
IT
Italy
Prior art keywords
substrates
compressed air
handling device
handling
compressed
Prior art date
Application number
ITUD2010A000014A
Other languages
English (en)
Inventor
Rocco Giordano
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to ITUD2010A000014A priority Critical patent/IT1398436B1/it
Priority to PCT/EP2011/051083 priority patent/WO2011092214A1/en
Priority to CN2011800076518A priority patent/CN102741997A/zh
Priority to US13/575,018 priority patent/US20130088029A1/en
Priority to EP11700953A priority patent/EP2529396A1/en
Priority to TW100103121A priority patent/TW201203443A/zh
Publication of ITUD20100014A1 publication Critical patent/ITUD20100014A1/it
Application granted granted Critical
Publication of IT1398436B1 publication Critical patent/IT1398436B1/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
ITUD2010A000014A 2010-01-27 2010-01-27 Dispositivo di manipolazione di substrati mediante aria compressa IT1398436B1 (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ITUD2010A000014A IT1398436B1 (it) 2010-01-27 2010-01-27 Dispositivo di manipolazione di substrati mediante aria compressa
PCT/EP2011/051083 WO2011092214A1 (en) 2010-01-27 2011-01-26 Handling device for substrates using compressed air
CN2011800076518A CN102741997A (zh) 2010-01-27 2011-01-26 利用压缩空气的衬底处理装置
US13/575,018 US20130088029A1 (en) 2010-01-27 2011-01-26 Handling device for substrates using compressed air
EP11700953A EP2529396A1 (en) 2010-01-27 2011-01-26 Handling device for substrates using compressed air
TW100103121A TW201203443A (en) 2010-01-27 2011-01-27 Handling device for substrates using compressed air

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2010A000014A IT1398436B1 (it) 2010-01-27 2010-01-27 Dispositivo di manipolazione di substrati mediante aria compressa

Publications (2)

Publication Number Publication Date
ITUD20100014A1 ITUD20100014A1 (it) 2011-07-28
IT1398436B1 true IT1398436B1 (it) 2013-02-22

Family

ID=42238772

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2010A000014A IT1398436B1 (it) 2010-01-27 2010-01-27 Dispositivo di manipolazione di substrati mediante aria compressa

Country Status (6)

Country Link
US (1) US20130088029A1 (it)
EP (1) EP2529396A1 (it)
CN (1) CN102741997A (it)
IT (1) IT1398436B1 (it)
TW (1) TW201203443A (it)
WO (1) WO2011092214A1 (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013017728B4 (de) * 2013-10-23 2015-05-07 Beumer Gmbh & Co. Kg Sauggreifvorrichtung
DE102018125682B4 (de) * 2018-10-16 2023-01-19 Asm Assembly Systems Gmbh & Co. Kg Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602543A (en) * 1968-12-18 1971-08-31 Munck Int As Arrangement in suction cup for vacuum lifting
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH0666381B2 (ja) * 1989-05-18 1994-08-24 株式会社エンヤシステム ウエハチヤツク方法及び装置
EP0611273B1 (de) * 1993-02-08 1998-09-16 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Träger für scheibenförmige Gegenstände
WO1997003456A1 (de) * 1995-07-12 1997-01-30 Sez Semiconductor-Equipment Zubehör Für Die Halbleiterfertigung Gesellschaft Mbh Träger für scheibenförmige gegenstände, insbesondere siliziumscheiben
US5920797A (en) * 1996-12-03 1999-07-06 Applied Materials, Inc. Method for gaseous substrate support
EP1103353A4 (en) * 1998-06-08 2002-07-24 Kuraitekku Co Ltd RETENTION AND SUCTION CUP FOR LAMELLAR MATERIAL
WO2003009346A2 (en) * 2001-07-15 2003-01-30 Applied Materials,Inc. Processing system
JP4043019B2 (ja) * 2002-04-26 2008-02-06 大日本スクリーン製造株式会社 基板処理装置
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
JP4342331B2 (ja) * 2004-02-09 2009-10-14 株式会社コガネイ 非接触搬送装置
JP4491340B2 (ja) * 2004-12-28 2010-06-30 株式会社コガネイ 搬送装置
KR100791004B1 (ko) * 2006-12-01 2008-01-04 삼성전자주식회사 진공 흡착형 피커 및 피킹 방법
JP2009032980A (ja) * 2007-07-27 2009-02-12 Ihi Corp 非接触搬送装置

Also Published As

Publication number Publication date
WO2011092214A1 (en) 2011-08-04
ITUD20100014A1 (it) 2011-07-28
CN102741997A (zh) 2012-10-17
TW201203443A (en) 2012-01-16
US20130088029A1 (en) 2013-04-11
EP2529396A1 (en) 2012-12-05

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