KR960705866A - 경화 억제된 에폭시 수지 조성물 및 당해 조성물로부터 제조된 적층물(Cure inhibited epoxy resin compositions and laminates prepared from the compositions) - Google Patents

경화 억제된 에폭시 수지 조성물 및 당해 조성물로부터 제조된 적층물(Cure inhibited epoxy resin compositions and laminates prepared from the compositions) Download PDF

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KR960705866A
KR960705866A KR1019960702283A KR19960702283A KR960705866A KR 960705866 A KR960705866 A KR 960705866A KR 1019960702283 A KR1019960702283 A KR 1019960702283A KR 19960702283 A KR19960702283 A KR 19960702283A KR 960705866 A KR960705866 A KR 960705866A
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composition
polyepoxide
inhibitor
catalyst
cure
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KR1019960702283A
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KR100332449B1 (ko
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이. 슐츠 크레이그
엘. 버트램 제임스
에이. 클레이 윌리엄
샤 관-밍
강 죠제프
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스티븐 에스. 그레이스
더 다우 케미칼 캄파니
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)

Abstract

요약하자면, 본 발명은 저온에서 경화제와 폴리에폭사이드의 반응을 억제하는 화합물 부류의 발견에 관한 것이다. 에폭시 수지 조성물은 폴리에폭사이드(a), 폴리에폭사이드용 아민 또는 아미드 경화제(b), 폴리에폭사이드와 경화제 반응용 촉매(폴리에폭사이드 1당량당) 약 15meq 이상(c) 및 (1) 약 171℃에서의 조성물의 겔화 시간이 억제제를 함유하지 않는 유사한 조성물보다 약 50％ 이상 더 길어지고, (2) 약 175℃ 이상의 온도에서 조성물이 약 50분 이내에 경화되도록 선택된 경화 억제제(d)를 함유한다. 당해 조성물은 촉매 하중이 크지만, 억제제가 겔화 시간을 연장시킴으로써 적층 공정과 기타 공정이 가능하기 때문에 신속히 경화될 수 있다.

Description

경화 억제된 에폭시 수지 조성물 및 당해 조성물로부터 제조된 적층물(Cure inhibited epoxy resin compositions and laminates prepared from the compositions)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 폴리에폭사이드(a), 폴리에폭사이드용 아민 또는 아미드 경화제(b) 및 폴리에폭사이드와 경화제 반응용 촉매(c)를 포함하는 에폭시 수지 조성물로서, (1)촉매의 농도가 폴리에폭사이드 1당량당 약 15meq 이상이고, (2) 조성물이 붕산 이외의 루이스산인 경화 억제제를 추가로 함유하고, 경화 억제제가 ① 약 171℃에서의 조성물의 스트로크-경화 겔화 시간이 억제제를 함유하지 않는 유사한 조성물보다 약 50％ 이상 더 길어지고, ② 175℃ 이상의 온도에서 조성물이 약 60분 이내에 경화되도록 선택됨을 특징으로 하는 수지 조성물.
  2. 제1항에 있어서, 1개 이상의 용매를 추가로 포함하는 조성물.
  3. 제1항 또는 제2항에 있어서, 억제제가 할로겐화붕소 또는 붕소 이외의 아연, 붕소, 주석, 티탄, 코발트, 망간, 철, 규소 또는 알루미늄의 임의의 할로겐화물, 산화물, 수산화물 또는 알콕사이드인 조성물.
  4. 제1항 내지 제3항 중의 어느 한 항에 있어서, 억제제가 임의로 보로옥심, 산화붕소, 알킬 보레이트 또는 할로겐화 아연인 조성물.
  5. 제1항 내지 제4항 중의 어느 한 항에 있어서, 조성물이 폴리에폭사이드 1당량당 촉매를 20 내지 50meq 함유하는 조성물.
  6. 제1항 내지 제5항 중의 어느 한 항에 있어서, 억제제 대 촉매의 몰 비가 0.6:1 내지 3:1인 조성물.
  7. 제1항 내지 제6항 중의 어느 한 항에 있어서, 촉매가 이미다졸 화합물이고, 조성물이 에폭시 수지 100중량부당 촉매를 0.3 내지 1중량부 함유하는 조성물.
  8. 기질을 제1항 내지 제7항 중의 어느 한 항에서 청구한 경화성 조성물로 함침시키는 단계(1), 조성물로부터 용매를 배출하고, 100 내지 190℃의 온도에서 조성물을 부분 경화시켜 B-스테이지 프리프레그를 형성하는 단계(2) 및 B -스테이지 프리프레그를 50℃ 미만의 온도에서 냉각시키고 저장하는 단계(3)로 이루어진 공정으로 B-스테이지 프리프레그를 제조하기 위한, 제1항 내지 제7항 중의 어느 한 항에서 청구한 조성물의 용도.
  9. 제8항에 있어서, 1개 이상의 B-스테이지 프리프레그를 1개 이상의 도전재료 시이트와 함께 가압하여 적층물을 형성하고, 적층물 중의 경화성 조성물을 경화시키는 단계(4)를 추가로 포함하는 용도.
  10. 섬유 함유 기질(1)과 기질에 접착된 제1항 내지 제7항 중의 어느 한 항에서 청구한 부분 경화된 경화성 조성물(2)을 포함하는 프리프레그.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960702283A 1993-11-02 1994-10-12 경화억제된에폭시수지조성물,이를포함하는프리프레그및당해프리프레그의제조방법 KR100332449B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14665293A 1993-11-02 1993-11-02
US08/146,652 1993-11-02
US08/146652 1993-11-02
PCT/US1994/011452 WO1995012627A1 (en) 1993-11-02 1994-10-12 Cure inhibited epoxy resin compositions and laminates prepared from the compositions

Publications (2)

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KR960705866A true KR960705866A (ko) 1996-11-08
KR100332449B1 KR100332449B1 (ko) 2002-09-27

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EP (1) EP0729484B1 (ko)
JP (1) JP3665070B2 (ko)
KR (1) KR100332449B1 (ko)
CN (1) CN1069658C (ko)
AT (1) ATE190074T1 (ko)
DE (1) DE69423234T2 (ko)
WO (1) WO1995012627A1 (ko)

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GB9421405D0 (en) † 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
JP4080546B2 (ja) † 1997-01-21 2008-04-23 ダウ グローバル テクノロジーズ インコーポレイティド エポキシ硬化系のための潜触媒
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
JP4797248B2 (ja) * 2001-01-26 2011-10-19 日立化成工業株式会社 プリント配線板用プリプレグおよびそれを用いた積層板
KR100431440B1 (ko) * 2001-05-04 2004-05-14 주식회사 엘지화학 에폭시 수지 조성물
KR100431439B1 (ko) * 2001-05-08 2004-05-14 주식회사 엘지화학 에폭시 수지 조성물
AU2002953099A0 (en) * 2002-12-04 2002-12-19 Australian Composites Pty Ltd Reinforced polymer composition
JP4490653B2 (ja) * 2003-04-22 2010-06-30 財団法人川村理化学研究所 非ゲル状エポキシ樹脂組成物の製造方法
JP5114111B2 (ja) * 2006-09-07 2013-01-09 日東シンコー株式会社 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
KR20120040153A (ko) * 2009-06-22 2012-04-26 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지용 경화제 조성물
US9309381B2 (en) * 2011-06-24 2016-04-12 Air Products And Chemicals, Inc. Epoxy resin compositions using solvated solids
DK2695903T3 (en) 2012-08-08 2019-01-14 Siemens Ag Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process
KR102312045B1 (ko) * 2016-08-10 2021-10-12 가부시끼가이샤 쓰리본드 에폭시 수지 조성물 및 이를 포함하는 도전성 접착제

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GB8304581D0 (en) * 1983-02-18 1983-03-23 Secr Defence Curing agents for epoxy resins
US4707518A (en) * 1986-10-16 1987-11-17 Shah Dilipkumar N Rubber-modified epoxy adhesives
GB9203416D0 (en) * 1992-02-18 1992-07-22 Pilkington Plc Curing plastics resins

Also Published As

Publication number Publication date
EP0729484B1 (en) 2000-03-01
CN1136816A (zh) 1996-11-27
CN1069658C (zh) 2001-08-15
JPH09504569A (ja) 1997-05-06
DE69423234T2 (de) 2000-08-10
JP3665070B2 (ja) 2005-06-29
KR100332449B1 (ko) 2002-09-27
ATE190074T1 (de) 2000-03-15
WO1995012627A1 (en) 1995-05-11
DE69423234D1 (de) 2000-04-06
EP0729484A1 (en) 1996-09-04

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