ATE190074T1 - Härtungsinhibierte epoxidharzzusammensetzungen und daraus hergestellte laminate - Google Patents
Härtungsinhibierte epoxidharzzusammensetzungen und daraus hergestellte laminateInfo
- Publication number
- ATE190074T1 ATE190074T1 AT94931806T AT94931806T ATE190074T1 AT E190074 T1 ATE190074 T1 AT E190074T1 AT 94931806 T AT94931806 T AT 94931806T AT 94931806 T AT94931806 T AT 94931806T AT E190074 T1 ATE190074 T1 AT E190074T1
- Authority
- AT
- Austria
- Prior art keywords
- polyepoxide
- composition
- epoxy resin
- curing
- curing agent
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14665293A | 1993-11-02 | 1993-11-02 | |
PCT/US1994/011452 WO1995012627A1 (en) | 1993-11-02 | 1994-10-12 | Cure inhibited epoxy resin compositions and laminates prepared from the compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE190074T1 true ATE190074T1 (de) | 2000-03-15 |
Family
ID=22518357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT94931806T ATE190074T1 (de) | 1993-11-02 | 1994-10-12 | Härtungsinhibierte epoxidharzzusammensetzungen und daraus hergestellte laminate |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0729484B1 (de) |
JP (1) | JP3665070B2 (de) |
KR (1) | KR100332449B1 (de) |
CN (1) | CN1069658C (de) |
AT (1) | ATE190074T1 (de) |
DE (1) | DE69423234T2 (de) |
WO (1) | WO1995012627A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9421405D0 (en) † | 1994-10-21 | 1994-12-07 | Dow Chemical Co | Low voc laminating formulations |
US6613839B1 (en) | 1997-01-21 | 2003-09-02 | The Dow Chemical Company | Polyepoxide, catalyst/cure inhibitor complex and anhydride |
JP4080546B2 (ja) † | 1997-01-21 | 2008-04-23 | ダウ グローバル テクノロジーズ インコーポレイティド | エポキシ硬化系のための潜触媒 |
JP4797248B2 (ja) * | 2001-01-26 | 2011-10-19 | 日立化成工業株式会社 | プリント配線板用プリプレグおよびそれを用いた積層板 |
KR100431440B1 (ko) * | 2001-05-04 | 2004-05-14 | 주식회사 엘지화학 | 에폭시 수지 조성물 |
KR100431439B1 (ko) * | 2001-05-08 | 2004-05-14 | 주식회사 엘지화학 | 에폭시 수지 조성물 |
AU2002953099A0 (en) * | 2002-12-04 | 2002-12-19 | Australian Composites Pty Ltd | Reinforced polymer composition |
JP4490653B2 (ja) * | 2003-04-22 | 2010-06-30 | 財団法人川村理化学研究所 | 非ゲル状エポキシ樹脂組成物の製造方法 |
JP5114111B2 (ja) * | 2006-09-07 | 2013-01-09 | 日東シンコー株式会社 | 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート |
SG176923A1 (en) * | 2009-06-22 | 2012-01-30 | Dow Global Technologies Llc | Hardener composition for epoxy resins |
US9309381B2 (en) * | 2011-06-24 | 2016-04-12 | Air Products And Chemicals, Inc. | Epoxy resin compositions using solvated solids |
EP2695903B1 (de) | 2012-08-08 | 2018-09-26 | Siemens Aktiengesellschaft | Verfahren zum Modifizieren der Rate der Temperaturveränderung einer Expoxyharzzusammensetzung in einem Harzbehälter während eines Gussverfahrens |
WO2018030184A1 (ja) * | 2016-08-10 | 2018-02-15 | 株式会社スリーボンド | エポキシ樹脂組成物およびこれを含む導電性接着剤 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8304581D0 (en) * | 1983-02-18 | 1983-03-23 | Secr Defence | Curing agents for epoxy resins |
US4707518A (en) * | 1986-10-16 | 1987-11-17 | Shah Dilipkumar N | Rubber-modified epoxy adhesives |
GB9203416D0 (en) * | 1992-02-18 | 1992-07-22 | Pilkington Plc | Curing plastics resins |
-
1994
- 1994-10-12 AT AT94931806T patent/ATE190074T1/de active
- 1994-10-12 EP EP94931806A patent/EP0729484B1/de not_active Expired - Lifetime
- 1994-10-12 CN CN94194353A patent/CN1069658C/zh not_active Expired - Lifetime
- 1994-10-12 WO PCT/US1994/011452 patent/WO1995012627A1/en active IP Right Grant
- 1994-10-12 JP JP51321895A patent/JP3665070B2/ja not_active Expired - Lifetime
- 1994-10-12 KR KR1019960702283A patent/KR100332449B1/ko not_active IP Right Cessation
- 1994-10-12 DE DE69423234T patent/DE69423234T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH09504569A (ja) | 1997-05-06 |
JP3665070B2 (ja) | 2005-06-29 |
DE69423234T2 (de) | 2000-08-10 |
EP0729484A1 (de) | 1996-09-04 |
CN1136816A (zh) | 1996-11-27 |
DE69423234D1 (de) | 2000-04-06 |
WO1995012627A1 (en) | 1995-05-11 |
EP0729484B1 (de) | 2000-03-01 |
KR960705866A (ko) | 1996-11-08 |
KR100332449B1 (ko) | 2002-09-27 |
CN1069658C (zh) | 2001-08-15 |
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