KR960026071A - 세라믹 다층 기판과 이것의 제조방법 - Google Patents
세라믹 다층 기판과 이것의 제조방법 Download PDFInfo
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- KR960026071A KR960026071A KR1019950053709A KR19950053709A KR960026071A KR 960026071 A KR960026071 A KR 960026071A KR 1019950053709 A KR1019950053709 A KR 1019950053709A KR 19950053709 A KR19950053709 A KR 19950053709A KR 960026071 A KR960026071 A KR 960026071A
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Abstract
본 발명의 목적은 세라믹 다층 기판과 다른 세라믹 기판의 적층시 또는, 이후의 히트쇼크에 의한 크랙의 발생을 방지할 수 있으며, 내습성, 절연특성이 향상되고, 신뢰성이 높은 세라믹 다층 기판의 제조방법을 제공하는 것이다.
열팽창 계수가 다른 두개의 세라믹 기판을 포함하는 세라믹 다층 기판은 두개의 세라믹 기판의 열팽창 계수 사이에서 서로 상이한 열팽창 계수를 갖는 적어도 두개 이상의 유리층으로 적층해서 전기한 두개의 세라믹 기판 사이에서 열팽창 계수가 단계적으로 변화하도록 한다. 세라믹 기판과 인접한 유리층 사이의 열팽창 계수의 차, 또는 서로 인접한 유리층들 끼리의 열팽창 계수의 차는 1×10-6/℃ 이하가 바람직하다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 구현예에 따른 세라믹 다층 기판의 단면도이다.
Claims (19)
- 열팽창 계수가 다른 제1세라믹 기판과 제2세라믹 기판을 포함하며, 전기한 두개의 세라믹 기판의 열팽창 계수 사이에서 서로 상이한 열팽창 계수를 갖는 적어도 두개 이상의 유리층이, 전기한 두개의 세라믹 기판 사이에서, 열팽창 계수가 단계적으로 변화하도록 적층되어 있는 것을 특징으로 하는 세라믹 다층 기판.
- 제1항에 있어서, 상기한 제1세라믹 기판은, 기판의 내부에 형성되고 도선에 의해 표면에 접속되어 있는 수동소자(passive element)와, 표면에 형성되어 있는 후막회로(thick film circuit)를 구비하며, 상기한 제2세라믹 기판은, 기판의 내부에 형성되고, 도선에 의해 표면에 접속되어 있는 수동소자와, 표면에 형성되어 있는 후막회로를 구비하며, 제1세라믹 기판과는 다른 열팽창 계수를 가지며, 전기한 두 개의 기판에 형성된 대향하는 도체들이 유리층 내부에 형성된 바이아 도체(via coductor)에 의해 접속되어 있음을 특징으로 하는 세라믹 다층 기판.
- 제2항에 있어서, 상기한 제1세라믹 기판 또는 제2세라믹 기판의 표면에 전자부품이 장착되는 것을 특징으로 하는 세라믹 다층 기판.
- 제3항에 있어서, 싱가한 세라믹 기판과 인접한 유리층 사이의 열팽창 계수의 차, 또는 서로 인접한 유리층들 사이의 열팽창 계수의 차가 1×10-6/℃ 이하 임을 특징으로 하는 세라믹 다층 기판.
- 제4항에 있어서, 상기한 열팽창 계수에 있어서 단계적 변화를 각각 동일하게 함을 특징으로 하는 세라믹 다층 기판.
- 제1항에 있어서, 상기한 열팽창 계수에 있어서 단계적 변화를 각각 동일하게 함을 특징으로 하는 세라믹 다층 기판.
- 제6항에 있어서, 상기한 세라믹 기판과 인접한 유리층 사이의 열팽창 계수의 차, 또는 서로 인접한 유리층들 사이의 열팽창 계수의 차가 1×10-6/℃ 이하 임을 특징으로 하는 세라믹 다층 기판.
- 제1항에 있어서, 상기한 세라믹 기판과 인접한 유리층 사이의 열팽창 계수의 차 또는 서로 인접한 유리층들 사이의 열팽창 계수의 차가 1×10-6/℃ 이하 임을 특징으로 하는 세라믹 다층 기판.
- 세라믹 다층 기판의 제조방법에 있어서; 열팽창 계푸가 다른 제1세라믹 기판과 제2세라믹 기판의 사이에, 전기한 두개의 세라믹 기판의 열팽창 계수 사이에서 서로 상이한 열팽창 계수를 갖는 적어도 두개 이상의 유리층을 전기한 두개의 세라믹 기판 사이에서, 전기한 열팽창 계수가 단계적으로 변화하도록 적층하는 공정; 및 제1세라믹 기판과 제2세라믹 기판을 열처리에 의해 그들 사이의 유리층에 접합시켜 적층하는 공정; 을 포함하는 것을 특징으로 하는 세라믹 다층 기판의 제조방법.
- 제9항에 있어서, 상기한 제1세라믹 기판은, 기판의 내부에 형성되고 도선에 의해 표면에 접속되어 있는 수동소자와, 표면에 형성되어 있는 후막회로를 구비하며, 상기한 제2세라믹 기판은, 기판의 내부에 형성되고, 도선에 의해 표면에 접속되어 있는 수동소자와, 표면에 형성되어 있는 후막회로를 구비하여, 제1세라믹 기판과는 다른 열팽창 계수를 갖고, 전기한 두 개의 기판에 형성된 대향하는 도체들이 유리층 내부에 형성된 바이아 도체에 의해 접속되어 있음을 특징으로 하는 세라믹 다층 기판.
- 제10항에 있어서, 상기한 제1세라믹 기판 또는 제2세라믹 기판의 표면에 전자부품을 장착하는 것을 특징으로 하는 세라믹 다층 기판의 제조방법.
- 제11항에 있어서, 전기한 유리들은 세라믹 기판과 인접한 유리층 사이의 열팽창 계수의 차, 또는 서로 인접한 유리층들 사이의 열팽창 계수의 차가 1×10-6/℃이하가 되도록 선정됨을 특징으로 하는 세라믹 다층 기판의 제조방법.
- 제12항에 있어서, 전기한 유리들은 상기한 열팽창 계수에 있어서의 단계적 변화 각각이 동일하도록 선정됨을 특징으로 하는 세라믹 다층 기판의 제조방법.
- 제9항에 있어서, 전기한 유리들은 세라믹 기판과 인접한 유리층 사이의 열팽창 계수의 차, 또는 서로 인접한 유리층들 사이의 열팽창 계수의 차가 10×10-6/℃이하가 되도록 선정됨을 특징으로 하는 세라믹 다층 기판의 제조방법.
- 제9항에 있어서, 제1열팽창 계수를 갖는 제1세라믹 기판을 형성하는 공정; 제2열팽창 계수를 갖는 제2세라믹 기판을 형성하는 공정; 전기한 제1열팽창 계수와 제2열팽창 계수의 사이에 있는 제3열팽창 계수를 갖는 제1유리 페이스트를 형성하는 공정; 및 전기한 제1열팽창 계수와 제2열팽창 계수의 사이에 있는 제4열팽창계수를 갖는 제2유리 페이스트를 형성하는 공정을 더 포함하는 것을 특징으로 하는 세라믹 다층 기판의 제조방법.
- 제15항에 있어서, 상기한 유리 페이스트가 적층되기 전에 열처리됨을 특징으로 하는 세라믹 다층 기판의 제조방법.
- 제15항에 있어서, 상기한 제1유리 페이스트가 제1세라믹 기판 위에 적층되며, 상기한 제2유리 페이스트가 전기한 제1유리 페이스트 위에 적층되고, 그런 다음 상기한 제2세라믹 기판이 전기한 유리 페이스트에 적층되며, 전기한 제1유리 페이스트 및 전기한 제2유리 페이스트 중 적어도 하나를 적층하여 얻은 복합체는 전기한 제2세라믹 기판이 적층되기 전에 가열되어 전기한 제1의 페이스트 또는 제2페이스트 또는 그 둘다에서 유기성분이 제거됨을 특징으로 하는 세라믹 다층 기판의 제조방법.
- 제1항에 있어서, 상기한 유리층이 붕규산 납(lead borosilicate) 유리, 붕규산 비스므트 유리 및 붕규산 아연 유리에서 선정된 복수의 유리 원료를 포함함을 특징으로 하는 세라믹 다층 기판.
- 제9항에 있어서, 상기한 유리층이 붕규산 납(lead borosilicate) 유리, 붕규산 비스므트 유리 및 붕규산 아연 유리에서 선정된 복수의 유리 원료를 포함함을 특징으로 하는 세라믹 다층 기판의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
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JP1994-318666 | 1994-12-21 | ||
JP6318666A JPH08181443A (ja) | 1994-12-21 | 1994-12-21 | セラミック多層基板およびその製造方法 |
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KR0174635B1 KR0174635B1 (ko) | 1999-04-01 |
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US (2) | US5827605A (ko) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6080468A (en) * | 1997-02-28 | 2000-06-27 | Taiyo Yuden Co., Ltd. | Laminated composite electronic device and a manufacturing method thereof |
JP2000151114A (ja) * | 1998-11-11 | 2000-05-30 | Sony Corp | 多層基板及びその製造方法 |
JP3601679B2 (ja) | 1999-07-27 | 2004-12-15 | 株式会社村田製作所 | 複合積層体の製造方法 |
JP2001047423A (ja) * | 1999-08-09 | 2001-02-20 | Murata Mfg Co Ltd | 複合積層体およびその製造方法 |
JP3666321B2 (ja) * | 1999-10-21 | 2005-06-29 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法 |
DE19961842B4 (de) * | 1999-12-21 | 2008-01-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mehrschichtleiterplatte |
JP2001244376A (ja) * | 2000-02-28 | 2001-09-07 | Hitachi Ltd | 半導体装置 |
TW526693B (en) * | 2000-06-15 | 2003-04-01 | Murata Manufacturing Co | Multilayer circuit component and method for manufacturing the same |
JP3680713B2 (ja) * | 2000-07-21 | 2005-08-10 | 株式会社村田製作所 | 絶縁体磁器、セラミック多層基板、セラミック電子部品及び積層セラミック電子部品 |
JP3669255B2 (ja) * | 2000-09-19 | 2005-07-06 | 株式会社村田製作所 | セラミック多層基板の製造方法および未焼成セラミック積層体 |
US6676784B2 (en) | 2001-07-17 | 2004-01-13 | International Business Machines Corporation | Process for the manufacture of multilayer ceramic substrates |
JP2003332749A (ja) * | 2002-01-11 | 2003-11-21 | Denso Corp | 受動素子内蔵基板、その製造方法及び受動素子内蔵基板形成用素板 |
US20060113639A1 (en) * | 2002-10-15 | 2006-06-01 | Sehat Sutardja | Integrated circuit including silicon wafer with annealed glass paste |
US7253495B2 (en) * | 2002-10-15 | 2007-08-07 | Marvell World Trade Ltd. | Integrated circuit package with air gap |
US7768360B2 (en) * | 2002-10-15 | 2010-08-03 | Marvell World Trade Ltd. | Crystal oscillator emulator |
US7760039B2 (en) * | 2002-10-15 | 2010-07-20 | Marvell World Trade Ltd. | Crystal oscillator emulator |
US7791424B2 (en) * | 2002-10-15 | 2010-09-07 | Marvell World Trade Ltd. | Crystal oscillator emulator |
TW573444B (en) * | 2003-04-22 | 2004-01-21 | Ind Tech Res Inst | Substrate having organic and inorganic functional package |
KR100546832B1 (ko) * | 2003-08-21 | 2006-01-26 | 삼성전자주식회사 | 임베디드 pcb 기판을 사용한 듀플렉서 및 그 제조 방법 |
JP4572759B2 (ja) * | 2005-07-06 | 2010-11-04 | セイコーエプソン株式会社 | 半導体装置及び電子機器 |
TW200746306A (en) * | 2005-09-06 | 2007-12-16 | Marvell World Trade Ltd | Integrated circuit including silicon wafer with annealed glass paste |
JP2009170753A (ja) * | 2008-01-18 | 2009-07-30 | Panasonic Corp | 多層プリント配線板とこれを用いた実装体 |
DE102010004051B9 (de) * | 2010-01-05 | 2023-06-07 | Tdk Electronics Ag | Formkörper, Heizungsvorrichtung und Verfahren zur Herstellung eines Formkörpers |
TWI571979B (zh) * | 2014-11-25 | 2017-02-21 | 彭賢斌 | 整合式被動模組、半導體裝置及其製作方法 |
JP6493560B2 (ja) * | 2015-11-30 | 2019-04-03 | 株式会社村田製作所 | 多層セラミック基板及び電子部品 |
CN109156083B (zh) * | 2016-05-17 | 2021-04-02 | 株式会社村田制作所 | 多层陶瓷基板及电子装置 |
CN112321163B (zh) * | 2020-10-28 | 2021-06-15 | 中国科学院上海硅酸盐研究所 | 一种高强度ltcc基板材料及其制备方法 |
Family Cites Families (5)
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JPS6014494A (ja) * | 1983-07-04 | 1985-01-25 | 株式会社日立製作所 | セラミツク多層配線基板およびその製造方法 |
JPS62265796A (ja) * | 1986-05-14 | 1987-11-18 | 株式会社住友金属セラミックス | セラミツク多層配線基板およびその製造法 |
JP2551224B2 (ja) * | 1990-10-17 | 1996-11-06 | 日本電気株式会社 | 多層配線基板および多層配線基板の製造方法 |
JP2924177B2 (ja) * | 1990-11-30 | 1999-07-26 | 株式会社村田製作所 | 傾斜機能型回路用基板 |
DE69300506T2 (de) * | 1992-04-06 | 1996-04-04 | Nec Corp | Herstellungsverfahren von mehrlagigen keramischen Substraten. |
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1994
- 1994-12-21 JP JP6318666A patent/JPH08181443A/ja active Pending
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1995
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- 1995-12-21 KR KR1019950053709A patent/KR0174635B1/ko not_active IP Right Cessation
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US5827605A (en) | 1998-10-27 |
US5896650A (en) | 1999-04-27 |
KR0174635B1 (ko) | 1999-04-01 |
JPH08181443A (ja) | 1996-07-12 |
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