KR960009147A - 전자 메모리와 이의 제조 및 사용 방법 - Google Patents

전자 메모리와 이의 제조 및 사용 방법 Download PDF

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Publication number
KR960009147A
KR960009147A KR1019950024512A KR19950024512A KR960009147A KR 960009147 A KR960009147 A KR 960009147A KR 1019950024512 A KR1019950024512 A KR 1019950024512A KR 19950024512 A KR19950024512 A KR 19950024512A KR 960009147 A KR960009147 A KR 960009147A
Authority
KR
South Korea
Prior art keywords
manufacture
electronic memory
electronic
memory
Prior art date
Application number
KR1019950024512A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960009147A publication Critical patent/KR960009147A/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/565Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using capacitive charge storage elements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/404Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/014Capacitor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/903FET configuration adapted for use as static memory cell
KR1019950024512A 1994-08-10 1995-08-09 전자 메모리와 이의 제조 및 사용 방법 KR960009147A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/288,580 US5452244A (en) 1994-08-10 1994-08-10 Electronic memory and methods for making and using the same

Publications (1)

Publication Number Publication Date
KR960009147A true KR960009147A (ko) 1996-03-22

Family

ID=23107731

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950024512A KR960009147A (ko) 1994-08-10 1995-08-09 전자 메모리와 이의 제조 및 사용 방법

Country Status (4)

Country Link
US (3) US5452244A (ko)
EP (1) EP0697701A3 (ko)
JP (1) JPH08191108A (ko)
KR (1) KR960009147A (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960006068A (ko) * 1994-07-29 1996-02-23 가네꼬 히사시 반도체 장치 및 이의 제조 방법
JP2783271B2 (ja) * 1995-01-30 1998-08-06 日本電気株式会社 半導体記憶装置
US5701143A (en) * 1995-01-31 1997-12-23 Cirrus Logic, Inc. Circuits, systems and methods for improving row select speed in a row select memory device
JPH08250674A (ja) * 1995-03-15 1996-09-27 Toshiba Microelectron Corp 半導体記憶装置
JP3400181B2 (ja) * 1995-04-25 2003-04-28 ローム株式会社 半導体装置およびその製造方法
KR0168355B1 (ko) * 1995-11-02 1999-02-01 김광호 반도체장치의 배선 형성방법
US5585285A (en) * 1995-12-06 1996-12-17 Micron Technology, Inc. Method of forming dynamic random access memory circuitry using SOI and isolation trenches
KR100248205B1 (ko) * 1997-06-25 2000-03-15 김영환 반도체 메모리 디바이스 및 그 형성방법
US5918124A (en) * 1997-10-06 1999-06-29 Vanguard International Semiconductor Corporation Fabrication process for a novel multi-storage EEPROM cell
US5956286A (en) * 1997-10-28 1999-09-21 International Business Machines Corporation Data processing system and method for implementing a multi-port memory cell
US5870349A (en) * 1997-10-28 1999-02-09 International Business Machines Corporation Data processing system and method for generating memory control signals with clock skew tolerance
US5877976A (en) * 1997-10-28 1999-03-02 International Business Machines Corporation Memory system having a vertical bitline topology and method therefor
US5907508A (en) * 1997-10-28 1999-05-25 International Business Machines Corporation Method and apparatus for single clocked, non-overlapping access in a multi-port memory cell
US6261934B1 (en) 1998-03-31 2001-07-17 Texas Instruments Incorporated Dry etch process for small-geometry metal gates over thin gate dielectric
US6137739A (en) * 1998-06-29 2000-10-24 Hyundai Electronics Industries Co., Ltd. Multilevel sensing circuit and method thereof
KR100309077B1 (ko) * 1999-07-26 2001-11-01 윤종용 삼중 금속 배선 일 트랜지스터/일 커패시터 및 그 제조 방법
JP4686189B2 (ja) 2002-10-24 2011-05-18 パラテック ファーマシューティカルズ インコーポレイテッド Rnaを調節するための置換テトラサイクリン化合物の使用方法
US6809977B1 (en) * 2003-04-02 2004-10-26 Reflectivity, Inc Method for reading and writing memory cells of spatial light modulators used in display systems
JP2005313627A (ja) * 2004-03-31 2005-11-10 Seiko Epson Corp 液体噴射装置及び液体噴射装置の液体吐出方法
JP2010093288A (ja) * 2009-12-18 2010-04-22 Renesas Technology Corp 半導体装置
JP5666162B2 (ja) * 2010-04-14 2015-02-12 ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. 半導体装置
US10956432B2 (en) * 2017-08-30 2021-03-23 Gsi Technology Inc. One by one selection of items of a set

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6055386A (ja) * 1983-09-07 1985-03-30 日本電気株式会社 半導体メモリ
JPH0460984A (ja) * 1990-06-25 1992-02-26 Matsushita Electron Corp 半導体記憶装置
JPH07122989B2 (ja) * 1990-06-27 1995-12-25 株式会社東芝 半導体記憶装置
JP2660111B2 (ja) * 1991-02-13 1997-10-08 株式会社東芝 半導体メモリセル
JP3181311B2 (ja) * 1991-05-29 2001-07-03 株式会社東芝 半導体記憶装置
JP3464803B2 (ja) * 1991-11-27 2003-11-10 株式会社東芝 半導体メモリセル
KR930015002A (ko) * 1991-12-18 1993-07-23 김광호 반도체 메모리 장치 및 그 제조방법
DE4321638A1 (de) * 1992-09-19 1994-03-24 Samsung Electronics Co Ltd Halbleiterspeicherbauelement mit einem Kondensator und Verfahren zu seiner Herstellung
TW227628B (ko) * 1992-12-10 1994-08-01 Samsung Electronics Co Ltd
KR960006718B1 (ko) * 1992-12-31 1996-05-22 현대전자산업주식회사 반도체 기억장치의 커패시터 및 그 제조방법

Also Published As

Publication number Publication date
EP0697701A2 (en) 1996-02-21
US5452244A (en) 1995-09-19
US5529945A (en) 1996-06-25
US5567963A (en) 1996-10-22
JPH08191108A (ja) 1996-07-23
EP0697701A3 (en) 1996-12-04

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
J201 Request for trial against refusal decision
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 19991124

Effective date: 20001130