KR950704527A - 전기 전자부품용 구리합금(copper alloy for electric and electronic components) - Google Patents
전기 전자부품용 구리합금(copper alloy for electric and electronic components)Info
- Publication number
- KR950704527A KR950704527A KR1019950702188A KR19950702188A KR950704527A KR 950704527 A KR950704527 A KR 950704527A KR 1019950702188 A KR1019950702188 A KR 1019950702188A KR 19950702188 A KR19950702188 A KR 19950702188A KR 950704527 A KR950704527 A KR 950704527A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- copper
- electronic components
- copper alloy
- electric
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
전기, 전자부품용 구리합금은 1.8-2.0중량%의 철, 0.025-0.040중량%의 인, 1.7-1.9중량%의 아연, 0.40-1.0중량%의 주석, 0.0001-0.01중량%의 칼슘을 함유하고 나머지는 구리와 불가피한 불순물로 이루어진다.
합금은 0.001-0.01중량%의 크롬과 0.001-0.01중량%의 마그네슘에서 선택된 적어도 한 원소를 총량 0.001-0.01중량%로 더 함유할 수도 있다.
이 합금은 열간가공공정의 가열중 또는 열간가공중에 잉곳 균열이 일어나기 쉬웠던 이러한 종래기술의 문제를 해결하고 고밀도 전기, 전자부품을 향한 경향이 증가됨에 따라 종종 일어나는 구리이동으로 말미암는 단락을 방지하고, 금형의 공구수명(내마모성)을 개선하며, 재조비용을 절감하기 위해 제공된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 최대 누설전류를 측정하는 실험장치의 평면도,
제2도는 최대 누설전류를 측정하는 실험장치의 평면도,
제3도는 공구내마모 시험장치의 개략도,
제4도는 공구내마모 시험의 조건과 볼의 마모량을 측정하는 방법을 나타내는 개략도이다.
Claims (2)
1.8-2.0중량%의 Fe, 0.025-0.040중량%의 P, 1.7-1.9중량%의 Zn, 0.40-1.0중량%의 Sn, 및 0.0001-0.01중량%의 Ca를 함유하며, 나머지는 Cu 및 불가피한 불순물로 이루어지는 것을 특징으로 하는 전기 전자 부품용 구리합금.
1.8-2.0중량%의 Fe, 0.025-0.040중량%의 P, 1.7-1.9중량%의 Zn, 0.40-1.0중량%의 Sn, 및 0.0001-0.01중량%의 Ca를 함유하며, 0.001-0.01중량%의 Cr과 0.001-0.01중량%의 Mg로 부터 선택되는 1종 또는 2종의 원소를 총량 0.001-0.01중량%로 함유하며, 나머지는 Cu 및 불가피한 불순물로 이루어지는 것을 특징으로 하는 전기 전자부품용 구리합금.
※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5245470A JP2950715B2 (ja) | 1993-09-30 | 1993-09-30 | 電気・電子部品用銅合金 |
JP93-245470 | 1993-09-30 | ||
PCT/JP1994/001636 WO1995009252A1 (fr) | 1993-09-30 | 1994-09-30 | Alliage de cuivre pour composants electriques et electroniques |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950704527A true KR950704527A (ko) | 1995-11-20 |
KR100238957B1 KR100238957B1 (ko) | 2000-01-15 |
Family
ID=17134143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950702188A KR100238957B1 (ko) | 1993-09-30 | 1994-09-30 | 전기 전자부품용 구리합금 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5624506A (ko) |
JP (1) | JP2950715B2 (ko) |
KR (1) | KR100238957B1 (ko) |
DE (2) | DE4497281T1 (ko) |
WO (1) | WO1995009252A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6679956B2 (en) | 1997-09-16 | 2004-01-20 | Waterbury Rolling Mills, Inc. | Process for making copper-tin-zinc alloys |
US6695934B1 (en) | 1997-09-16 | 2004-02-24 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
US6455937B1 (en) | 1998-03-20 | 2002-09-24 | James A. Cunningham | Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects |
US6551872B1 (en) | 1999-07-22 | 2003-04-22 | James A. Cunningham | Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby |
US6521532B1 (en) | 1999-07-22 | 2003-02-18 | James A. Cunningham | Method for making integrated circuit including interconnects with enhanced electromigration resistance |
US6344171B1 (en) | 1999-08-25 | 2002-02-05 | Kobe Steel, Ltd. | Copper alloy for electrical or electronic parts |
US6441492B1 (en) | 1999-09-10 | 2002-08-27 | James A. Cunningham | Diffusion barriers for copper interconnect systems |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5940897B2 (ja) * | 1982-06-11 | 1984-10-03 | 古河電気工業株式会社 | 配線接続用銅合金 |
JPS6338543A (ja) * | 1986-08-05 | 1988-02-19 | Furukawa Electric Co Ltd:The | 電子機器用銅合金とその製造法 |
JPS63266053A (ja) * | 1987-04-24 | 1988-11-02 | Furukawa Electric Co Ltd:The | 高力銅基合金の製造法 |
JPH01168830A (ja) * | 1987-12-25 | 1989-07-04 | Nippon Mining Co Ltd | 通電材料 |
JP2585347B2 (ja) * | 1988-02-18 | 1997-02-26 | 株式会社神戸製鋼所 | 耐マイグレーション性に優れた高導電性銅合金の製造方法 |
JPH02111833A (ja) * | 1988-10-20 | 1990-04-24 | Sumitomo Metal Mining Co Ltd | リードフレーム用銅合金 |
JPH02145737A (ja) * | 1988-11-24 | 1990-06-05 | Dowa Mining Co Ltd | 高強度高導電性銅基合金 |
JPH0331437A (ja) * | 1989-06-27 | 1991-02-12 | Furukawa Electric Co Ltd:The | 耐熱性と耐摩耗性に優れた摺動通電用銅合金とその製造方法 |
JP2977839B2 (ja) * | 1989-09-07 | 1999-11-15 | 株式会社神戸製鋼所 | 耐マイグレーション性に優れる高導電性電気・電子部品用銅合金 |
JPH03285053A (ja) * | 1990-03-30 | 1991-12-16 | Furukawa Electric Co Ltd:The | 電子機器用銅合金の製造方法 |
JPH0586428A (ja) * | 1991-09-27 | 1993-04-06 | Kobe Steel Ltd | ヒユーズ端子用銅合金 |
-
1993
- 1993-09-30 JP JP5245470A patent/JP2950715B2/ja not_active Expired - Lifetime
-
1994
- 1994-09-30 US US08/424,524 patent/US5624506A/en not_active Expired - Lifetime
- 1994-09-30 DE DE4497281T patent/DE4497281T1/de active Granted
- 1994-09-30 WO PCT/JP1994/001636 patent/WO1995009252A1/ja active Application Filing
- 1994-09-30 DE DE4497281A patent/DE4497281C2/de not_active Expired - Lifetime
- 1994-09-30 KR KR1019950702188A patent/KR100238957B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE4497281C2 (de) | 1999-06-17 |
JP2950715B2 (ja) | 1999-09-20 |
US5624506A (en) | 1997-04-29 |
DE4497281T1 (de) | 1995-10-19 |
WO1995009252A1 (fr) | 1995-04-06 |
JPH0797645A (ja) | 1995-04-11 |
KR100238957B1 (ko) | 2000-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5487867A (en) | Copper-bismuth casting alloys | |
US5942056A (en) | Plumbing fixtures and fittings employing copper-bismuth casting alloys | |
CA1126056A (en) | Copper-nickel-silicon-chromium alloy having improved electrical conductivity | |
KR100706054B1 (ko) | 전기 전도성 금속 스트립 및 이것으로 제조된 커넥터 | |
KR950704527A (ko) | 전기 전자부품용 구리합금(copper alloy for electric and electronic components) | |
US4260435A (en) | Copper-nickel-silicon-chromium alloy having improved electrical conductivity | |
JP7126359B2 (ja) | アルミニウムへの耐接触腐食性に優れた銅合金材及び端子 | |
JPH06228684A (ja) | Cu合金製電気電子機器用コネクタ | |
JPS572849A (en) | Copper alloy for electronic parts | |
US4990309A (en) | High strength copper-nickel-tin-zinc-aluminum alloy of excellent bending processability | |
JPS55154540A (en) | Electrically-conductive wear-resistant copper alloy and its manufacture | |
EP0501438B1 (en) | Copper based alloy sheet material for electrical and electronic parts, having the effect of restraining wear of blanking die | |
JPS57114632A (en) | High-strength copper alloy with superior wear resistance | |
KR100429109B1 (ko) | 전기적도전성이좋고연화온도가높은전자회로부품용지지대및그제조방법 | |
JPS61264144A (ja) | 半田耐熱剥離性に優れた高力高導電銅合金 | |
ATE353981T1 (de) | Kupferlegierung, die exzellente korrosionsbeständigkeit und entzinkungsbeständigkeit aufweist, und eine methode zu deren herstellung | |
GB2109813A (en) | Anti-corrosion copper alloys | |
JPS6218617B2 (ko) | ||
JPS6411932A (en) | High pure oxygen-free copper and its use | |
US4392302A (en) | Method of manufacturing a movable contact member | |
JPS5579849A (en) | Copper alloy with superior corrosion resistance and solderability | |
JPS54148126A (en) | Copper alloy for radiator | |
JPH04165037A (ja) | CrとSnを含有したバッキングプレート用銅合金 | |
JPS6283443A (ja) | 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金 | |
Yezhov | Effect of Copper on Structure and Properties of Mg--Al--Zn Alloy System |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120924 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20130924 Year of fee payment: 15 |
|
EXPY | Expiration of term |