KR950701453A - 메거진의 격실과 그의 내부에 삽입된 판형가공물의 인덱싱 장치 - Google Patents
메거진의 격실과 그의 내부에 삽입된 판형가공물의 인덱싱 장치Info
- Publication number
- KR950701453A KR950701453A KR1019940703853A KR19940703853A KR950701453A KR 950701453 A KR950701453 A KR 950701453A KR 1019940703853 A KR1019940703853 A KR 1019940703853A KR 19940703853 A KR19940703853 A KR 19940703853A KR 950701453 A KR950701453 A KR 950701453A
- Authority
- KR
- South Korea
- Prior art keywords
- magazine
- plate
- measuring beam
- reference plane
- compartments
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
매거진 격실과 격실내 반도체 박판형의 물체를 인덱싱 하기 위한 인덱싱 장치가 설명되어 있다. 발명의 목적은 장탈착장치가 치수공차에 무관하게 어떤 주어진 평면내에서 매거진에 정확히 접근하도록 하자는데 있다. 발명은 발신기(7)와 수신기(8)로 구성된 광전자 센서의 측정빔(10)을 요하는데 이것은 물체(13)의 위치 뿐만 아니라 격실의 위치(12)까지도 기준면에 대하여 결정하는데 사용되는바 그의 위치는 탈착과 이송을 위한 핸들링면(H-H)에 대해서 정해진다. 매거진의 높이(11)는 지지판(2)과 물체의 장탈착을 하게하는 리프트에 의해서 변경이 가능하다.
본 발명은 집적회로부착 및 특히 반도체칩 형상의 물체를 취급하는데 적용하기 위한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 판핸들링장치 단면의 일부,
제2도는 매거진 단면과 더불어 위치한 광전자센서의 레이아웃,
제3도는 측정빔의 단면도 해설을 포함한 매거진의 전면도,
제4도는 삽입된 판형 물체와 매거진격실단면과 광전자센서로 탐지된 단면도와의 상호관계 설명,
제5도는 이차 센서와 판송장치를 포함한 매거진의 상면도,
제6도는 발명의 요지를 설명하기 위한 블록회로도로 제어, 가공, 평가장치와 기타 장치와의 상관관계.
Claims (3)
- 판형물체 가공에 있어서 매거진(11)은 판핸들링장치의 매거진 홀다(2)에의 해서 매거진리프트로 일차 핸들링면(H-H)에 대한 높이를 측정가능하게 하여 로딩과 이송을 위한 조정이 될 수 있도록하며, 발신기(7)와 수신기(8)로 구성되어 있는 광전자센서가 구비되어 그의 측정빔(10)으로 판형물체(13)의 기준면(E-kE)에 대한 그의 상대위치를 파악하게 되는 매거진의 매거진격실와 그안에 들어 있는 판형물체 특히 반도체판과 템프레이트의인덱상장치에 있어서, 측정빔(10)이 기준면(E-E)에 대한 상대적 매거진격실(12)의 위치를 감지하게 되고 판핸들링장치내에서의 기준면(E-E)은 구조상 일차 핸들링면(H-H)과 일정한 관계를 유지하는 것을 특징으로 하는 장치.
- 제1항에 있어서, 발신기(7)에서 나오는 중간빔으로서 서로 마주하고 있는 개거진격실(12)를 포함하고 잇는 벽들(14,15)을 통과하게 되고 측정빔(10)에 투영되어 있는 매거진(11)내부의 벽들중 어느 하나의 격실을 형성하고 있는 돌기(17)에 이르게 도며 이것들은 판형물체의 베이스 역활을 하게되며, 그리고 연이어 위치한 매거진격실 방향에서 높이를 조정하여 상호 기준면(E-E)과 공동위치를 취하게 되며 매거진격실(12)의 복사는 물론이고 또한 그안에 들어있는 판상물체(13)의 복사도 측정빔(10)의 변조에 의해서 행해지는 것을 특징으로 하는 장치.
- 제2항에 있어서, 매거진(11)에서 튀어나온 판상물체(20)의 위치를 잡아주기 위해서는 찬반송장치(21)가 일차핸들링면(H-H)에 평행한 이차핸들링면에서 준비해야하며 그의 기능은 이차센서(24)의 신호에 연계되어 있어서 그의 측정빔은 판상물체(13,20)에 평행하게 되고 매거진(11)의 높이를 조정할때에는 그의 언로딩과 이송의 구실을 하는면이 직접 인접하여 있는 것을 특징으로 하는 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4306957.6 | 1993-03-05 | ||
DE4306957A DE4306957C1 (de) | 1993-03-05 | 1993-03-05 | Einrichtung zur Indexierung von Magazinfächern eines Magazins und darin enthaltenen scheibenförmigen Objekten |
PCT/EP1994/000620 WO1994020979A1 (de) | 1993-03-05 | 1994-03-03 | Einrichtung zur Indexierung von Magazinfächern eines Magazins und darin enthaltenen scheibenförmigen Objekten |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950701453A true KR950701453A (ko) | 1995-03-23 |
KR0156481B1 KR0156481B1 (ko) | 1998-12-01 |
Family
ID=6482045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940703853A KR0156481B1 (ko) | 1993-03-05 | 1994-03-03 | 매거진의 격실와 그의 내부에 삽입된 판형가공물의 인덱싱 장치 |
Country Status (9)
Country | Link |
---|---|
US (1) | US5605428A (ko) |
EP (1) | EP0639293B1 (ko) |
JP (1) | JP3585490B2 (ko) |
KR (1) | KR0156481B1 (ko) |
AT (1) | ATE175053T1 (ko) |
DE (1) | DE4306957C1 (ko) |
SG (1) | SG46592A1 (ko) |
TW (1) | TW347571B (ko) |
WO (1) | WO1994020979A1 (ko) |
Families Citing this family (30)
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DE4425208C2 (de) * | 1994-07-16 | 1996-05-09 | Jenoptik Technologie Gmbh | Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen |
EP0735573B1 (de) | 1995-03-28 | 2004-09-08 | BROOKS Automation GmbH | Be- und Entladestation für Halbleiterbearbeitungsanlagen |
DE19535871C2 (de) * | 1995-09-27 | 2000-02-10 | Jenoptik Jena Gmbh | Indexer für Magazinfächer eines Magazins und darin enthaltene scheibenförmige Objekte |
DE19537734C2 (de) * | 1995-10-10 | 1999-09-09 | Apt Sauer & Dietz Gmbh | Vorrichtung zur Aufnahme, Halterung und Positionierung eines Wafers zum Zwecke einer elektronischen Qualitätsprüfung |
JP3287768B2 (ja) * | 1996-05-24 | 2002-06-04 | 株式会社新川 | マガジン用エレベータ装置の上下動作データ設定方法 |
TW344847B (en) * | 1996-08-29 | 1998-11-11 | Tokyo Electron Co Ltd | Substrate treatment system, substrate transfer system, and substrate transfer method |
US6082949A (en) * | 1996-10-11 | 2000-07-04 | Asyst Technologies, Inc. | Load port opener |
US5829942A (en) * | 1997-02-10 | 1998-11-03 | Automation Technologies Industries | Apparatus for loading and unloading circuit boards along a conveyor system |
US6390754B2 (en) * | 1997-05-21 | 2002-05-21 | Tokyo Electron Limited | Wafer processing apparatus, method of operating the same and wafer detecting system |
DE19728478C2 (de) * | 1997-07-03 | 2003-08-21 | Brooks Pri Automation Germany | Verfahren zur optoelektronischen Erkennung von scheibenförmigen Objekten unter Nutzung derer Stirnseiten |
US6213853B1 (en) * | 1997-09-10 | 2001-04-10 | Speedfam-Ipec Corporation | Integral machine for polishing, cleaning, rinsing and drying workpieces |
DE19752510B4 (de) * | 1997-11-27 | 2005-11-24 | Brooks Automation (Germany) Gmbh | Einrichtung und Verfahren zur Erkennung und Unterscheidung geometrisch verschiedener Arten von fächerbildenden Auflagen in Kassetten und darauf abgelegten scheibenförmigen Objekten |
DE19813684C2 (de) * | 1998-03-27 | 2001-08-16 | Brooks Automation Gmbh | Einrichtung zur Aufnahme von Transportbehältern an einer Be- und Entladestation |
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DE19958082A1 (de) * | 1999-12-02 | 2001-06-07 | Logitex Reinstmedientechnik Gm | Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben |
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JP4118592B2 (ja) * | 2002-04-22 | 2008-07-16 | 富士通株式会社 | ロードポート及び半導体製造装置 |
US6869263B2 (en) | 2002-07-22 | 2005-03-22 | Brooks Automation, Inc. | Substrate loading and unloading station with buffer |
US7677859B2 (en) | 2002-07-22 | 2010-03-16 | Brooks Automation, Inc. | Substrate loading and uploading station with buffer |
US7572092B2 (en) * | 2002-10-07 | 2009-08-11 | Brooks Automation, Inc. | Substrate alignment system |
DE10250353B4 (de) * | 2002-10-25 | 2008-04-30 | Brooks Automation (Germany) Gmbh | Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten |
US6984839B2 (en) * | 2002-11-22 | 2006-01-10 | Tdk Corporation | Wafer processing apparatus capable of mapping wafers |
US20050012938A1 (en) * | 2003-07-18 | 2005-01-20 | Jun-Ming Chen | Apparatus and method for detecting wafer position |
CN111867298A (zh) * | 2020-08-12 | 2020-10-30 | 福建江夏学院 | 一种建筑物内部缺陷无损检测仪 |
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US4458152A (en) * | 1982-05-10 | 1984-07-03 | Siltec Corporation | Precision specular proximity detector and article handing apparatus employing same |
JPS61273441A (ja) * | 1985-05-23 | 1986-12-03 | Canon Inc | ウエハ搬送装置 |
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1993
- 1993-03-03 US US08/331,523 patent/US5605428A/en not_active Expired - Lifetime
- 1993-03-05 DE DE4306957A patent/DE4306957C1/de not_active Expired - Fee Related
-
1994
- 1994-02-28 TW TW083101720A patent/TW347571B/zh not_active IP Right Cessation
- 1994-03-03 WO PCT/EP1994/000620 patent/WO1994020979A1/de active IP Right Grant
- 1994-03-03 EP EP94909106A patent/EP0639293B1/de not_active Expired - Lifetime
- 1994-03-03 JP JP51956794A patent/JP3585490B2/ja not_active Expired - Lifetime
- 1994-03-03 AT AT94909106T patent/ATE175053T1/de not_active IP Right Cessation
- 1994-03-03 KR KR1019940703853A patent/KR0156481B1/ko not_active IP Right Cessation
- 1994-03-03 SG SG1996006402A patent/SG46592A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO1994020979A1 (de) | 1994-09-15 |
KR0156481B1 (ko) | 1998-12-01 |
JP3585490B2 (ja) | 2004-11-04 |
EP0639293A1 (de) | 1995-02-22 |
ATE175053T1 (de) | 1999-01-15 |
SG46592A1 (en) | 1998-02-20 |
JPH07506940A (ja) | 1995-07-27 |
DE4306957C1 (de) | 1994-06-01 |
EP0639293B1 (de) | 1998-12-23 |
TW347571B (en) | 1998-12-11 |
US5605428A (en) | 1997-02-25 |
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