TW347571B - Device for indexing magazine compartments and wafer-shaped objects in the compartments - Google Patents

Device for indexing magazine compartments and wafer-shaped objects in the compartments

Info

Publication number
TW347571B
TW347571B TW083101720A TW83101720A TW347571B TW 347571 B TW347571 B TW 347571B TW 083101720 A TW083101720 A TW 083101720A TW 83101720 A TW83101720 A TW 83101720A TW 347571 B TW347571 B TW 347571B
Authority
TW
Taiwan
Prior art keywords
compartments
magazine
disc
shaped objects
manipulating
Prior art date
Application number
TW083101720A
Other languages
English (en)
Inventor
Birkner Andreas
Lahne Berndt
Schultz Kiaus
Original Assignee
Jenoptik Jena Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena Gmbh filed Critical Jenoptik Jena Gmbh
Application granted granted Critical
Publication of TW347571B publication Critical patent/TW347571B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW083101720A 1993-03-05 1994-02-28 Device for indexing magazine compartments and wafer-shaped objects in the compartments TW347571B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4306957A DE4306957C1 (de) 1993-03-05 1993-03-05 Einrichtung zur Indexierung von Magazinfächern eines Magazins und darin enthaltenen scheibenförmigen Objekten

Publications (1)

Publication Number Publication Date
TW347571B true TW347571B (en) 1998-12-11

Family

ID=6482045

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083101720A TW347571B (en) 1993-03-05 1994-02-28 Device for indexing magazine compartments and wafer-shaped objects in the compartments

Country Status (9)

Country Link
US (1) US5605428A (zh)
EP (1) EP0639293B1 (zh)
JP (1) JP3585490B2 (zh)
KR (1) KR0156481B1 (zh)
AT (1) ATE175053T1 (zh)
DE (1) DE4306957C1 (zh)
SG (1) SG46592A1 (zh)
TW (1) TW347571B (zh)
WO (1) WO1994020979A1 (zh)

Families Citing this family (30)

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DE4425208C2 (de) * 1994-07-16 1996-05-09 Jenoptik Technologie Gmbh Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen
DE59611078D1 (de) 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
DE19535871C2 (de) * 1995-09-27 2000-02-10 Jenoptik Jena Gmbh Indexer für Magazinfächer eines Magazins und darin enthaltene scheibenförmige Objekte
DE19537734C2 (de) * 1995-10-10 1999-09-09 Apt Sauer & Dietz Gmbh Vorrichtung zur Aufnahme, Halterung und Positionierung eines Wafers zum Zwecke einer elektronischen Qualitätsprüfung
JP3287768B2 (ja) * 1996-05-24 2002-06-04 株式会社新川 マガジン用エレベータ装置の上下動作データ設定方法
TW344847B (en) * 1996-08-29 1998-11-11 Tokyo Electron Co Ltd Substrate treatment system, substrate transfer system, and substrate transfer method
US6082949A (en) * 1996-10-11 2000-07-04 Asyst Technologies, Inc. Load port opener
US5829942A (en) * 1997-02-10 1998-11-03 Automation Technologies Industries Apparatus for loading and unloading circuit boards along a conveyor system
US6390754B2 (en) * 1997-05-21 2002-05-21 Tokyo Electron Limited Wafer processing apparatus, method of operating the same and wafer detecting system
DE19728478C2 (de) * 1997-07-03 2003-08-21 Brooks Pri Automation Germany Verfahren zur optoelektronischen Erkennung von scheibenförmigen Objekten unter Nutzung derer Stirnseiten
US6213853B1 (en) * 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
DE19752510B4 (de) * 1997-11-27 2005-11-24 Brooks Automation (Germany) Gmbh Einrichtung und Verfahren zur Erkennung und Unterscheidung geometrisch verschiedener Arten von fächerbildenden Auflagen in Kassetten und darauf abgelegten scheibenförmigen Objekten
DE19813684C2 (de) * 1998-03-27 2001-08-16 Brooks Automation Gmbh Einrichtung zur Aufnahme von Transportbehältern an einer Be- und Entladestation
DE19853446C2 (de) * 1998-11-19 2002-08-08 Infineon Technologies Ag Vorrichtung und Verfahren zur Waferfehlpositionierungserkennung sowie Waferbearbeitungsvorrichtung
US6763281B2 (en) * 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
US6135698A (en) * 1999-04-30 2000-10-24 Asyst Technologies, Inc. Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications
DE19958082A1 (de) * 1999-12-02 2001-06-07 Logitex Reinstmedientechnik Gm Überwachungssystem für eine Transportvorrichtung von Flachteilen, insbesondere Wafer-Scheiben
US6856863B1 (en) * 2000-07-27 2005-02-15 Applied Materials, Inc. Method and apparatus for automatic calibration of robots
CN1191215C (zh) * 2000-08-18 2005-03-02 三菱化学株式会社 生产苯乙烯的方法
DE10143722C2 (de) * 2001-08-31 2003-07-03 Infineon Technologies Ag Verfahren und Vorrichtung zur Sortierung von Wafern
TWI258831B (en) 2001-12-31 2006-07-21 Applied Materials Inc Cassette and workpiece handler characterization tool
JP4118592B2 (ja) * 2002-04-22 2008-07-16 富士通株式会社 ロードポート及び半導体製造装置
US6869263B2 (en) 2002-07-22 2005-03-22 Brooks Automation, Inc. Substrate loading and unloading station with buffer
US7677859B2 (en) * 2002-07-22 2010-03-16 Brooks Automation, Inc. Substrate loading and uploading station with buffer
US7572092B2 (en) 2002-10-07 2009-08-11 Brooks Automation, Inc. Substrate alignment system
DE10250353B4 (de) * 2002-10-25 2008-04-30 Brooks Automation (Germany) Gmbh Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten
US6984839B2 (en) * 2002-11-22 2006-01-10 Tdk Corporation Wafer processing apparatus capable of mapping wafers
US20050012938A1 (en) * 2003-07-18 2005-01-20 Jun-Ming Chen Apparatus and method for detecting wafer position
CN111867298A (zh) * 2020-08-12 2020-10-30 福建江夏学院 一种建筑物内部缺陷无损检测仪

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Publication number Priority date Publication date Assignee Title
US3902615A (en) * 1973-03-12 1975-09-02 Computervision Corp Automatic wafer loading and pre-alignment system
US4458152A (en) * 1982-05-10 1984-07-03 Siltec Corporation Precision specular proximity detector and article handing apparatus employing same
JPS61273441A (ja) * 1985-05-23 1986-12-03 Canon Inc ウエハ搬送装置
JPH0611069B2 (ja) * 1985-11-05 1994-02-09 キヤノン株式会社 ウエハ整列装置
JPH07115773B2 (ja) * 1986-01-29 1995-12-13 株式会社ニコン 基板搬送装置
US4765793A (en) * 1986-02-03 1988-08-23 Proconics International, Inc. Apparatus for aligning circular objects
US4895486A (en) * 1987-05-15 1990-01-23 Roboptek, Inc. Wafer monitoring device
US4954721A (en) * 1988-03-30 1990-09-04 Tel Sagami Limited Apparatus for detecting an array of wafers
US5003188A (en) * 1988-11-18 1991-03-26 Tokyo Aircraft Instrument Co., Ltd. Semiconductor waxer detection system
FR2644237B1 (fr) * 1989-03-07 1991-06-14 Doeuvre Jean Pierre Appareil automatique de controle dimensionnel de nacelles porte-plaquettes
US5044752A (en) * 1989-06-30 1991-09-03 General Signal Corporation Apparatus and process for positioning wafers in receiving devices
WO1992005920A1 (en) * 1990-09-27 1992-04-16 Genmark Automation Scanning end effector assembly
US5291025A (en) * 1992-11-30 1994-03-01 Advanced Micro Devices, Inc. In-line non-contact wafer boat inspection apparatus

Also Published As

Publication number Publication date
JP3585490B2 (ja) 2004-11-04
SG46592A1 (en) 1998-02-20
JPH07506940A (ja) 1995-07-27
KR0156481B1 (ko) 1998-12-01
WO1994020979A1 (de) 1994-09-15
US5605428A (en) 1997-02-25
ATE175053T1 (de) 1999-01-15
KR950701453A (ko) 1995-03-23
EP0639293A1 (de) 1995-02-22
EP0639293B1 (de) 1998-12-23
DE4306957C1 (de) 1994-06-01

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Legal Events

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