KR950028576A - 전자-기계적 조인트 형성을 위한 구조체 및 방법 - Google Patents
전자-기계적 조인트 형성을 위한 구조체 및 방법 Download PDFInfo
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- KR950028576A KR950028576A KR1019950003829A KR19950003829A KR950028576A KR 950028576 A KR950028576 A KR 950028576A KR 1019950003829 A KR1019950003829 A KR 1019950003829A KR 19950003829 A KR19950003829 A KR 19950003829A KR 950028576 A KR950028576 A KR 950028576A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
- B29C66/1142—Single butt to butt joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
- B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
- B29C66/7232—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
- B29C66/72321—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7314—Electrical and dielectric properties
- B29C66/73141—Electrical conductivity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
본 발명은 단일 작업으로 다수의 전도성있게 코팅된 중합체를 상호 결합시키는 결합 방법에 관한 것이다.상기 방법은 높은 출력의 에너지원을 통한 열발생을 이용하고 있으며,상기 에너지원의 출력은 견고한 전기적 및 기계적 결합을 형성하기 위하여 각각의 접경면에서 금속 표면을 융합함과 동시에 중합체 표면을 융합할 수 있는 에너지 직사 방출기에 의해 집중(focus)된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 요철 조인트 설계를 위한 도금 형상을 설명하는 측면도,
제2도는 제1도와 유사한 도면이나,2개의 접속 표면이 서로 합쳐질 때 상기 표면들에 직사 에너지원을 인가하는 것을 특히 도시한 측면도,
제3도는 금속 및 중합체로 제조된 2개의 접속 표면이 하나의 일체형 구조체를 형성하도록 용융된 후의 최종 형상을 도시하고 있다는 점을 제외하고는 제2도와 유사한 측면도,
제4도는 제1도와 유사한 도면이나,본 발명에 보다 부합되도록 계단형 조인트 형상을 갖는 상이한 실시예를 특히 도시하는 측면도.
Claims (13)
- 기판을 결합하기 위한 방법에 있어서,전기적 결합이 형성되는 제1위치에서 상기 기판들 중의 각 기판 상에 전도성 층을 인가하고,상기 기판들 중의 각 기판 상에 기계적 결합이 형성되고 전도성 재료가 위치하지 않는 제2위치를 제공하는 단계와,기계적 결합이 형성되는 상기 제1위치들이 접촉하고 전기적 결합이 형성되는 상기 제2위치들이 접촉하는 형상으로 상기 기판들을 위치시키는 단계와,상기 전도성 층 및 상기 중합체 기판을 융합시 키도록 상기 기판들에 직사 에너지를 인가시키는 단계를 포함하는 것을 특징으로 하는 방법.
- 제1항에 있어서,상기 전도성 층은 상기 기판들 중의 각 기판 상에 인가되고,그리고 나서 기계적 결합이 형성되는 상기 제2위치로부터 제거되는 것을 특징으로 하는 방법.
- 제1항에 있어서,상기 직사 에너지가 초음파인 것을 특징으로 하는 방법.
- 제1항에 있어서,결합되는 기판들이 버트형(butt) 조인트 형상을 또한 구비하는 것을 특징으로 하는 방법.
- 제1항에 있어서,결합되는 표면들은 테이퍼진 단부(end)를 갖는 계단형 조인트 형상과 용융된 중합체 기판 재료가 기판 표면에 플래싱 되는 것을 방지하기 위한 포켓(pocket)을 또한 구비하는 것을 특징으로 하는 방법.
- 제1항에 있어서,결합되는 표면들은 테이퍼진 단부를 갖는 비트형 조인트 형상과 용융된 중합체 기판 재료가 기판 표면에 플래싱 되는 것을 방지하기 위한 포켓(pocket)을 또한 구비하는 것을 특징으로 하는 방법.
- 제1항에 있어서,전도성 층이 확산 결합(diffusion bonding)에 적절한 금속을 구비하는 것을 특징으로 하는 방법.
- 제1항에 있어서,상기 전도성 층은 니켈,구리 및 금으로 제조된 층들을 포함하는 것을 특징으로 하는 방법.
- 제1항에 있어서,각각의 중합체 기판 상의 상기 전도성 층은 측면간(side-by-side) 접촉 형태로 배치되는 것을 특징으로 하는 방법.
- 제1항에 있어서,상기 중합체 기판은 단부간(end-to-end) 접촉 형태로 배치되는 것을 특징으로 하는 방법.
- 제1항의 방법에 의해 제조되는 결합된 기판.
- 각각이 그 상에 전도성 층을 갖는 중합체 기판들의 조합체에 있어서,상기 중합체 기판들은 상호 융합되고 상기 전도성 층들 또한 상호 융합되는 것을 특징으로 하는 조합체.
- 적어도 2개의 전도성있게 코팅된 중합체 기판을 결합하기 위한 방법에 있어서,중합체 결합이 형성되는 위치들이 접촉하고 전기적 결합이 형성되는 위치들이 평행하게 접촉하도록 위치되는 형상으로 상기 기판들을 위치시키는 단계와,상기 전도성 코팅들과 상기 중합체 기판들을 융합시키기 위해 직사 에너지를 상기 기판들에 인가 시키는 단계를 구비하는 것을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/204,117 | 1994-03-01 | ||
US8/204,117 | 1994-03-01 | ||
US08/204,117 US5454506A (en) | 1994-03-01 | 1994-03-01 | Structure and process for electro/mechanical joint formation |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950028576A true KR950028576A (ko) | 1995-10-18 |
KR100187874B1 KR100187874B1 (ko) | 1999-06-01 |
Family
ID=22756704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950003829A KR100187874B1 (ko) | 1994-03-01 | 1995-02-27 | 전자-기계적조인트 형성을 위한 구조체 및 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5454506A (ko) |
JP (1) | JP2817772B2 (ko) |
KR (1) | KR100187874B1 (ko) |
CN (1) | CN1050941C (ko) |
GB (1) | GB2286989A (ko) |
MY (1) | MY115165A (ko) |
TW (1) | TW257707B (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6220777B1 (en) * | 1998-08-24 | 2001-04-24 | Lucent Technologies Inc. | Methods and apparatus for producing ultrasonic weld joints for injection molded plastic parts |
JP3860088B2 (ja) * | 2002-07-25 | 2006-12-20 | Necエレクトロニクス株式会社 | ボンディング方法及びボンディング装置 |
CA2584851C (en) | 2004-11-04 | 2015-04-07 | Microchips, Inc. | Compression and cold weld sealing methods and devices |
US7134201B2 (en) * | 2004-11-12 | 2006-11-14 | Agc Automotive Americas R&D, Inc. | Window pane and a method of bonding a connector to the window pane |
US7223939B2 (en) * | 2004-11-12 | 2007-05-29 | Agc Automotive Americas, R & D, Inc. | Electrical connector for a window pane of a vehicle |
US9088120B2 (en) * | 2011-06-28 | 2015-07-21 | GM Global Technology Operations LLC | Serviceable electrical connection and method |
CN103115722A (zh) * | 2013-02-27 | 2013-05-22 | 武汉元丰汽车电控系统有限公司 | 压力传感器复合式自填充凹槽耐高压密封接口 |
US9272371B2 (en) | 2013-05-30 | 2016-03-01 | Agc Automotive Americas R&D, Inc. | Solder joint for an electrical conductor and a window pane including same |
FR3041625B1 (fr) * | 2015-09-29 | 2021-07-30 | Tronics Microsystems | Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support |
US10356914B2 (en) * | 2016-04-04 | 2019-07-16 | Raytheon Company | Method of lamination of dielectric circuit materials using ultrasonic means |
US10263362B2 (en) | 2017-03-29 | 2019-04-16 | Agc Automotive Americas R&D, Inc. | Fluidically sealed enclosure for window electrical connections |
US10849192B2 (en) | 2017-04-26 | 2020-11-24 | Agc Automotive Americas R&D, Inc. | Enclosure assembly for window electrical connections |
CN108330433A (zh) * | 2018-01-31 | 2018-07-27 | 厦门建霖健康家居股份有限公司 | 一种塑料电镀工件的环保焊接方法 |
CN109757033B (zh) * | 2019-02-22 | 2020-07-10 | 皆利士多层线路版(中山)有限公司 | 电路板及其制作方法 |
CN111217325B (zh) * | 2019-12-06 | 2023-04-07 | 太原科技大学 | 一种超声辅助阳极键合方法及其超声辅助阳极键合系统 |
CN111674049A (zh) * | 2020-07-10 | 2020-09-18 | 埃维尔汽车部件(苏州)有限公司 | 一种喷漆面板和电镀面板的超声焊处理工艺 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3468731A (en) * | 1966-07-01 | 1969-09-23 | Branson Instr | Method and apparatus for sonically sealing the end portion of thermoplastic tubular containers |
US3728183A (en) * | 1971-03-19 | 1973-04-17 | Eastman Kodak Co | Method of and apparatus for ultrasonic splicing |
US3781596A (en) * | 1972-07-07 | 1973-12-25 | R Galli | Semiconductor chip carriers and strips thereof |
US4546409A (en) * | 1982-04-02 | 1985-10-08 | Mitsubishi Denki Kabushiki Kaisha | Device for cooling semiconductor elements |
US4648179A (en) * | 1983-06-30 | 1987-03-10 | International Business Machines Corporation | Process of making interconnection structure for semiconductor device |
US4589584A (en) * | 1985-01-31 | 1986-05-20 | International Business Machines Corporation | Electrical connection for polymeric conductive material |
US5031308A (en) * | 1988-12-29 | 1991-07-16 | Japan Radio Co., Ltd. | Method of manufacturing multilayered printed-wiring-board |
US5326412A (en) * | 1992-12-22 | 1994-07-05 | Hughes Aircraft Company | Method for electrodepositing corrosion barrier on isolated circuitry |
US5303862A (en) * | 1992-12-31 | 1994-04-19 | International Business Machines Corporation | Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures |
-
1994
- 1994-03-01 US US08/204,117 patent/US5454506A/en not_active Expired - Fee Related
- 1994-10-21 TW TW083109762A patent/TW257707B/zh active
- 1994-12-16 MY MYPI94003385A patent/MY115165A/en unknown
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1995
- 1995-02-01 CN CN95101665A patent/CN1050941C/zh not_active Expired - Fee Related
- 1995-02-23 GB GB9503632A patent/GB2286989A/en not_active Withdrawn
- 1995-02-27 KR KR1019950003829A patent/KR100187874B1/ko not_active IP Right Cessation
- 1995-02-28 JP JP7039505A patent/JP2817772B2/ja not_active Expired - Fee Related
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JP2817772B2 (ja) | 1998-10-30 |
US5454506A (en) | 1995-10-03 |
JPH07288268A (ja) | 1995-10-31 |
CN1117211A (zh) | 1996-02-21 |
GB9503632D0 (en) | 1995-04-12 |
MY115165A (en) | 2003-04-30 |
GB2286989A (en) | 1995-09-06 |
TW257707B (ko) | 1995-09-21 |
KR100187874B1 (ko) | 1999-06-01 |
CN1050941C (zh) | 2000-03-29 |
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