KR950028576A - 전자-기계적 조인트 형성을 위한 구조체 및 방법 - Google Patents

전자-기계적 조인트 형성을 위한 구조체 및 방법 Download PDF

Info

Publication number
KR950028576A
KR950028576A KR1019950003829A KR19950003829A KR950028576A KR 950028576 A KR950028576 A KR 950028576A KR 1019950003829 A KR1019950003829 A KR 1019950003829A KR 19950003829 A KR19950003829 A KR 19950003829A KR 950028576 A KR950028576 A KR 950028576A
Authority
KR
South Korea
Prior art keywords
substrates
polymer
conductive layer
conductive
substrate
Prior art date
Application number
KR1019950003829A
Other languages
English (en)
Other versions
KR100187874B1 (ko
Inventor
마이클 죠드하모 죠지
해리 윌쯔 루이스
Original Assignee
윌리엄 티. 엘리스
인터내셔널 비지네스 머신즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윌리엄 티. 엘리스, 인터내셔널 비지네스 머신즈 코포레이션 filed Critical 윌리엄 티. 엘리스
Publication of KR950028576A publication Critical patent/KR950028576A/ko
Application granted granted Critical
Publication of KR100187874B1 publication Critical patent/KR100187874B1/ko

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114Single butt joints
    • B29C66/1142Single butt to butt joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/302Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B29C66/7232General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer
    • B29C66/72321General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered comprising a non-plastics layer consisting of metals or their alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7314Electrical and dielectric properties
    • B29C66/73141Electrical conductivity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832Reciprocating joining or pressing tools
    • B29C66/8322Joining or pressing tools reciprocating along one axis
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/119Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09045Locally raised area or protrusion of insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/065Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

본 발명은 단일 작업으로 다수의 전도성있게 코팅된 중합체를 상호 결합시키는 결합 방법에 관한 것이다.상기 방법은 높은 출력의 에너지원을 통한 열발생을 이용하고 있으며,상기 에너지원의 출력은 견고한 전기적 및 기계적 결합을 형성하기 위하여 각각의 접경면에서 금속 표면을 융합함과 동시에 중합체 표면을 융합할 수 있는 에너지 직사 방출기에 의해 집중(focus)된다.

Description

전자-기계적 조인트 형성을 위한 구조체 및 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 요철 조인트 설계를 위한 도금 형상을 설명하는 측면도,
제2도는 제1도와 유사한 도면이나,2개의 접속 표면이 서로 합쳐질 때 상기 표면들에 직사 에너지원을 인가하는 것을 특히 도시한 측면도,
제3도는 금속 및 중합체로 제조된 2개의 접속 표면이 하나의 일체형 구조체를 형성하도록 용융된 후의 최종 형상을 도시하고 있다는 점을 제외하고는 제2도와 유사한 측면도,
제4도는 제1도와 유사한 도면이나,본 발명에 보다 부합되도록 계단형 조인트 형상을 갖는 상이한 실시예를 특히 도시하는 측면도.

Claims (13)

  1. 기판을 결합하기 위한 방법에 있어서,전기적 결합이 형성되는 제1위치에서 상기 기판들 중의 각 기판 상에 전도성 층을 인가하고,상기 기판들 중의 각 기판 상에 기계적 결합이 형성되고 전도성 재료가 위치하지 않는 제2위치를 제공하는 단계와,기계적 결합이 형성되는 상기 제1위치들이 접촉하고 전기적 결합이 형성되는 상기 제2위치들이 접촉하는 형상으로 상기 기판들을 위치시키는 단계와,상기 전도성 층 및 상기 중합체 기판을 융합시 키도록 상기 기판들에 직사 에너지를 인가시키는 단계를 포함하는 것을 특징으로 하는 방법.
  2. 제1항에 있어서,상기 전도성 층은 상기 기판들 중의 각 기판 상에 인가되고,그리고 나서 기계적 결합이 형성되는 상기 제2위치로부터 제거되는 것을 특징으로 하는 방법.
  3. 제1항에 있어서,상기 직사 에너지가 초음파인 것을 특징으로 하는 방법.
  4. 제1항에 있어서,결합되는 기판들이 버트형(butt) 조인트 형상을 또한 구비하는 것을 특징으로 하는 방법.
  5. 제1항에 있어서,결합되는 표면들은 테이퍼진 단부(end)를 갖는 계단형 조인트 형상과 용융된 중합체 기판 재료가 기판 표면에 플래싱 되는 것을 방지하기 위한 포켓(pocket)을 또한 구비하는 것을 특징으로 하는 방법.
  6. 제1항에 있어서,결합되는 표면들은 테이퍼진 단부를 갖는 비트형 조인트 형상과 용융된 중합체 기판 재료가 기판 표면에 플래싱 되는 것을 방지하기 위한 포켓(pocket)을 또한 구비하는 것을 특징으로 하는 방법.
  7. 제1항에 있어서,전도성 층이 확산 결합(diffusion bonding)에 적절한 금속을 구비하는 것을 특징으로 하는 방법.
  8. 제1항에 있어서,상기 전도성 층은 니켈,구리 및 금으로 제조된 층들을 포함하는 것을 특징으로 하는 방법.
  9. 제1항에 있어서,각각의 중합체 기판 상의 상기 전도성 층은 측면간(side-by-side) 접촉 형태로 배치되는 것을 특징으로 하는 방법.
  10. 제1항에 있어서,상기 중합체 기판은 단부간(end-to-end) 접촉 형태로 배치되는 것을 특징으로 하는 방법.
  11. 제1항의 방법에 의해 제조되는 결합된 기판.
  12. 각각이 그 상에 전도성 층을 갖는 중합체 기판들의 조합체에 있어서,상기 중합체 기판들은 상호 융합되고 상기 전도성 층들 또한 상호 융합되는 것을 특징으로 하는 조합체.
  13. 적어도 2개의 전도성있게 코팅된 중합체 기판을 결합하기 위한 방법에 있어서,중합체 결합이 형성되는 위치들이 접촉하고 전기적 결합이 형성되는 위치들이 평행하게 접촉하도록 위치되는 형상으로 상기 기판들을 위치시키는 단계와,상기 전도성 코팅들과 상기 중합체 기판들을 융합시키기 위해 직사 에너지를 상기 기판들에 인가 시키는 단계를 구비하는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950003829A 1994-03-01 1995-02-27 전자-기계적조인트 형성을 위한 구조체 및 방법 KR100187874B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/204,117 1994-03-01
US8/204,117 1994-03-01
US08/204,117 US5454506A (en) 1994-03-01 1994-03-01 Structure and process for electro/mechanical joint formation

Publications (2)

Publication Number Publication Date
KR950028576A true KR950028576A (ko) 1995-10-18
KR100187874B1 KR100187874B1 (ko) 1999-06-01

Family

ID=22756704

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950003829A KR100187874B1 (ko) 1994-03-01 1995-02-27 전자-기계적조인트 형성을 위한 구조체 및 방법

Country Status (7)

Country Link
US (1) US5454506A (ko)
JP (1) JP2817772B2 (ko)
KR (1) KR100187874B1 (ko)
CN (1) CN1050941C (ko)
GB (1) GB2286989A (ko)
MY (1) MY115165A (ko)
TW (1) TW257707B (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6220777B1 (en) * 1998-08-24 2001-04-24 Lucent Technologies Inc. Methods and apparatus for producing ultrasonic weld joints for injection molded plastic parts
JP3860088B2 (ja) * 2002-07-25 2006-12-20 Necエレクトロニクス株式会社 ボンディング方法及びボンディング装置
CA2584851C (en) 2004-11-04 2015-04-07 Microchips, Inc. Compression and cold weld sealing methods and devices
US7134201B2 (en) * 2004-11-12 2006-11-14 Agc Automotive Americas R&D, Inc. Window pane and a method of bonding a connector to the window pane
US7223939B2 (en) * 2004-11-12 2007-05-29 Agc Automotive Americas, R & D, Inc. Electrical connector for a window pane of a vehicle
US9088120B2 (en) * 2011-06-28 2015-07-21 GM Global Technology Operations LLC Serviceable electrical connection and method
CN103115722A (zh) * 2013-02-27 2013-05-22 武汉元丰汽车电控系统有限公司 压力传感器复合式自填充凹槽耐高压密封接口
US9272371B2 (en) 2013-05-30 2016-03-01 Agc Automotive Americas R&D, Inc. Solder joint for an electrical conductor and a window pane including same
FR3041625B1 (fr) * 2015-09-29 2021-07-30 Tronics Microsystems Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support
US10356914B2 (en) * 2016-04-04 2019-07-16 Raytheon Company Method of lamination of dielectric circuit materials using ultrasonic means
US10263362B2 (en) 2017-03-29 2019-04-16 Agc Automotive Americas R&D, Inc. Fluidically sealed enclosure for window electrical connections
US10849192B2 (en) 2017-04-26 2020-11-24 Agc Automotive Americas R&D, Inc. Enclosure assembly for window electrical connections
CN108330433A (zh) * 2018-01-31 2018-07-27 厦门建霖健康家居股份有限公司 一种塑料电镀工件的环保焊接方法
CN109757033B (zh) * 2019-02-22 2020-07-10 皆利士多层线路版(中山)有限公司 电路板及其制作方法
CN111217325B (zh) * 2019-12-06 2023-04-07 太原科技大学 一种超声辅助阳极键合方法及其超声辅助阳极键合系统
CN111674049A (zh) * 2020-07-10 2020-09-18 埃维尔汽车部件(苏州)有限公司 一种喷漆面板和电镀面板的超声焊处理工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3468731A (en) * 1966-07-01 1969-09-23 Branson Instr Method and apparatus for sonically sealing the end portion of thermoplastic tubular containers
US3728183A (en) * 1971-03-19 1973-04-17 Eastman Kodak Co Method of and apparatus for ultrasonic splicing
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US4546409A (en) * 1982-04-02 1985-10-08 Mitsubishi Denki Kabushiki Kaisha Device for cooling semiconductor elements
US4648179A (en) * 1983-06-30 1987-03-10 International Business Machines Corporation Process of making interconnection structure for semiconductor device
US4589584A (en) * 1985-01-31 1986-05-20 International Business Machines Corporation Electrical connection for polymeric conductive material
US5031308A (en) * 1988-12-29 1991-07-16 Japan Radio Co., Ltd. Method of manufacturing multilayered printed-wiring-board
US5326412A (en) * 1992-12-22 1994-07-05 Hughes Aircraft Company Method for electrodepositing corrosion barrier on isolated circuitry
US5303862A (en) * 1992-12-31 1994-04-19 International Business Machines Corporation Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures

Also Published As

Publication number Publication date
JP2817772B2 (ja) 1998-10-30
US5454506A (en) 1995-10-03
JPH07288268A (ja) 1995-10-31
CN1117211A (zh) 1996-02-21
GB9503632D0 (en) 1995-04-12
MY115165A (en) 2003-04-30
GB2286989A (en) 1995-09-06
TW257707B (ko) 1995-09-21
KR100187874B1 (ko) 1999-06-01
CN1050941C (zh) 2000-03-29

Similar Documents

Publication Publication Date Title
KR950028576A (ko) 전자-기계적 조인트 형성을 위한 구조체 및 방법
US4547652A (en) Process for the laser soldering of flexible wiring
KR20010051540A (ko) 다층구조의 플렉시블 배선판과 그 제조방법
US5511719A (en) Process of joining metal members
JP2004505457A (ja) フレキシブルなプリント配線板をコンタクトパートナとコンタクトするための方法およびフレキシブルなプリント配線板とコンタクトパートナとから成るユニット
JP4524570B2 (ja) 半導体装置
JP3456921B2 (ja) 金属箔の接合方法並びに超音波溶接具
KR20070049964A (ko) 전력용 반도체 모듈
JPH0778932A (ja) 半導体装置の製造方法
RU98122063A (ru) Способ изготовления электрически проводящих соединений между двумя или несколькими проводящими структурами
JP2002141052A (ja) リード接合方法及びこれを用いた電池電源装置
JP3179002B2 (ja) 導体間の接合方法及び導体間の接合構造
KR101921053B1 (ko) 통전압접장치 및 통전압접방법
JPH09314353A (ja) 抵抗溶接方法及び被溶接体の構造
TW200302772A (en) Procedure for the electrical contacting of two metal structures
WO2003012883A3 (en) Method for contacting thin-film electrodes
JP3943838B2 (ja) 金属同士の接合方法
JP2005294092A (ja) 発熱体
JP2000135559A (ja) 面接合方法及びヒ―トシンク
JPH0817498A (ja) 複合バンプ接合
JPH1065084A (ja) リードフレーム
JPS6418245A (en) Ceramic substrate having metal pin and its manufacture
JPH08340176A (ja) リード線の接続方法
JP4132990B2 (ja) 電気的接合構造
JP2004537779A (ja) 圧着接続部によって互いに接続される製造物サブパーツを有する製造物

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
G170 Publication of correction
FPAY Annual fee payment

Payment date: 20011107

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee