CN1117211A - 用于电/机械连接结构的装置和方法 - Google Patents

用于电/机械连接结构的装置和方法 Download PDF

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CN1117211A
CN1117211A CN95101665A CN95101665A CN1117211A CN 1117211 A CN1117211 A CN 1117211A CN 95101665 A CN95101665 A CN 95101665A CN 95101665 A CN95101665 A CN 95101665A CN 1117211 A CN1117211 A CN 1117211A
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G·M·乔达莫
L·H·韦尔茨
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Abstract

一种连接方法能够在一个单一的操作中把许多带有导电涂层的聚合物连接在一起，此方法通过一个高能能量源放热，此能源的输出由一个能量定向器聚焦，该能量定向器在他们的界面分别引起聚合物表面融化的同时引起金属表面的融化从而形成一个牢固的电和机械连接。

Description

用于电/机械连接结构的装置和方法
本发明涉及一些方法和装置通过应用定向的能量如超声波能量同时把电的或其他部件连接在一起。更具体地说，本发明着眼于通过应用定向能量，特别是超声能量所产生的电/机械连接结构以便同时把聚合物基底和出现在单独的基底上的导电涂层的金属电路图案连接在一起。
超声波连接方法用于永久地连接两个或多个由聚合物材料组成的部分，特别是在不适于使用粘合剂的时候或场合。当连接暴露在某些化合物、溶剂、压力和温度的地方，使用粘合剂会对机械连接的强度产生不利的影响。另外，超声波连接要求少量或不要求表面处理，此连接非常牢固、迅速而且容易自动化，当该过程完成以后，部件不要求固定或处理的时间。
金属的超声波连接已经是公知的。永久性的连接避免了必须用机械的固定器如螺钉、螺栓或铆钉，并且不必使用其他一些方法如钎焊或焊接。金属超声波连接一般产生一种改进了的电连接，这是由于两个连接部件之间的界面实际上被消除了。
在某些应用中，提供一种具有机械牢固性和导电性的连接是必须的或者是希望的。希望利用超声波连接所提供的这种独特性质的优点，然而到现在为止，还不知道如何在一个传导涂层的塑料部件上获得上述性质。每一个连接的操作能分别进行，如上所述，然而同时连接是困难的。原因之一是对于聚合物与聚合物的超声连接，超声波能量应用到每一个部件上以便使得一个部件相对于另一个部件的移动是一个定向的冲击运动(锤型的移动)。然而，对于金属与金属超声连接，一个部件相对另一个部件的移动是垂直的(一个部件相对于另一个滑动)。因此，所希望的聚合物和金属的连接的运动的方向是不同的并且看起来是不相容的。
传导涂层的聚合物表面的连接在许多应用中是有用的，其中有，(1)用于控制电磁干扰(eleclromagnetic interference-EMI)的外壳的密封；(2)静电放电(ESD)场合中电气组件的保护；以及(3)把表面支承件固定在热型的电路板上；
美国专利4,546,409中指出了在多表面之间的金属与金属连接可以应用超声波能量。然而，在该专利中讨论的方法是具体的用在半导体装置中的。
类似的，美国专利4468731揭示的仅仅是聚合物与聚合物的超声连接。这里很明显没有讨论金属表面或传电涂层聚合物表面的连接。
美国专利4589584看来是应用超声波连接了一个填充聚合物和另一个填充聚合物，同时也连接了一个未填充聚合物和另一个未填充聚合物。通过在填充聚合物中加入导电填充物获得一个导电连接。例如在一个热塑基质中加入银颗粒。许多其它被发现的可以应用的填充物包括玻璃、云母和矿物质。然而这些填充物不能提供特殊的电连接，并且实际上破坏了聚合物基底或电路板所希望的绝缘性能。
本发明的一个目的在于提供一种通过把定向能量应用于要结合的对象而把多个导电涂层聚合物基底彼此由一个单一的操作连接起来的方法。
本发明的另一个目的在于通过选择适当的连接的几何形状、冶金结构和金属的位置获得一个结构强的机械连接和一个低阻抗的电连接。根据连接所要求的机械和电性质，示出了各种连接形状，包括对接、舌榫和槽连接以及阶梯连接。
本发明再一个目的在于当为某些电路装置同时形成一个电连接时，其中包括、但不限于设置在技术装置上的表面，对插入在一个部件与基底之间的粘结剂提供一种非化学的、非溶解的反应或处理。
本发明还有一个目的在于提供一种无特殊连接方法要求的装置，并且容易适合于传统的连接设备，如超声波连接中所应用的。
本发明涉及一种连接至少两个导电涂层的聚合物基底的方法，特别是在导电涂层已经有选择地绘上了图案的地方。一个导电层出现在形成电连接的区域的基底上。在形成机械连接的那些区域上不存在导电涂层。然后基底以一种配置放置，以便使形成机械连接的部位相互接触，并且形成电连接的部件也相互接触。然后给基底加定向能量是为了同时分别使导电涂层和聚合物基底融合在一起。
一旦能量源应用在要连接的表面上，金属和金属以及聚合物和聚合物连接就在同一个操作中产生。要连接的部分提供一个特殊的几何形状，此几何形状保证了能量传递的发生能够以一有利的方式检测，以便同时确保聚合物材料的端与端接触和金属部分的面面接触。
下列专业术语在这里和权利要求中用到：
聚合物是用在两个或多个要连接的表面上的任何一种不导电物质，此物质将融解并融合在一起。不导电物质包括塑料、聚合物和热塑料，但不限于此。
“连接”是指任何一种连接多个表面的方法，它包括但不限于使用一个定向高能的能量源。一个连接是多个表面的永久性连接。
“导电涂层”是指任何一种适合于用来作为聚合物材料上的一个涂层的导电物质。“金属化”是指具有一个永久地覆盖一种导电材料的表面。“金属”是指任何一种适合于用来作为其他材料上的一个涂层的导电材料。
一个机械连接是一种相应于拉力和垂直力的连接以便确保装置的结构完整性。一个电连接提供一个低阻抗的电路径。
“烧化(flash)”是指融化的聚合物对金属部分的挤压，它一般对导电性有不利的影响。定向能量是任何一种高能能量源，包括但不限于超声波能量。
在说明书的结论部分中具体地指出了被认为是本发明的主题，并提出了权利要求。然而本发明作为实际应用的组织和方法，再加上本发明的进一步目的和优点，通过结合附图的以下描述可以更好地理解。
图1是根据本发明的一个榫舌和槽连接设计的平面几何形状的侧视图。
图2是与图1相似的侧视图，但是它更具体的示出了当两个表面连在一起时定向能量源在两个连接表面的应用。
图3是与图2相似的侧视图，不同的是它示出了两个金属和聚合物表面融合在一起形成一个整体的结构之后的总的几何形状。
图4是与图1相似的侧视图，但它更具体地表示了根据本发明的具有一个阶梯连接的几何形状的不同的实施例。
图5是与图1相似的侧视图，它表示了一个变化的几何形状。
根据本发明的原理，图1显示了应用一个榫舌和槽连接设计的一平面几何形状。为了得到一个电-机械连接，首先一个导电涂层施加在所被选择的形成电连接的区域。金属涂层不施加在形成机械连接的区域。金属涂层在一些区域的出现以及在其他区域的不出现使得在形成金属和金属连接的同时获得聚合物与聚合物的连接。很明显，此方法对已经配置了适当的金属图案的部分也是适用的。金属涂层可以容易地通过选择的蚀刻、机械磨损或其他方法从任何一个区域除去。
图1中所示的连接结构的方法表示了要连接的两个连接部分10和20。每一个相连的部分包括导电涂层30。榫舌零件50包括无金属涂层或在连接前把金属除去的能量导向器40。然后金属60保留在榫舌50的侧壁。部件20的连接部分10有槽结构70。槽70的大小用于接受榫舌50。槽70在其槽底部区域没有涂导电材料，或在连接前除去此区域的金属。金属100保留在槽70的侧壁。
在最佳实施例中的冶金结构包括涂在聚合物基底上的许多导电层。冶金结构最好分别包括无电/电镀铜110、电镀镍120和电镀金130。铜、镍和金涂层的厚度大约分别为1000微英寸、85微英寸和30微英寸。
为了获得牢固的电-机械连接，如图2所示两个连接部分放在一个卡具或定位器250上，并且应用标准的超声波连接方法进行超声波连接。
图2和3分别是对两个要连接的部分200和300应用一个超声波能量源150以及一个以榫舌和槽的连接的组合的几何形状的更进一步的表示。图3具体地说明了完成了的聚合物连接210和金属连接350的一般形状。夹紧压力、连接时间和供给的能量都可变化，它们可根据连接所希望的性质而改变。在一个实施例中所用的超声波能量在40-300瓦秒(Ws-Watt-Seconds)范围内，夹紧压力在10-30磅/平方英寸，所施加的能量脉冲的时间范围为0.1秒到0.5秒之间。
上述连接结构使用在许多不同的场合中，其中将两个或更多的部件连接形成一个机械牢固的结构，同时在连接部分的导电图形(pattern)之间获得一个低阻抗的电连接。一些应用包括壳层但不限于壳层(连接器、局部装配)、热塑印刷电路板(2维和3维)和印刷电路板和其它基底上的附加部件。
另外，虽然上面描述了一个桦舌和槽连接结构，其它的结构也可以应用。图4表示了另一个能应用的几何形状。图4表示了两个要连接的连接部分400和410。每一个连接部件400和410分别包括导电涂层区域440和450。连接部件4 00包括能量导向器430，此处没有涂金属(或在连接前除去此处的金属)。为了避免烧化(flashing)，设置这种几何形状以便使得当连接的两个部分440和450连接时，每个连接件400和410的两侧面460和470不连接并且有一空间或间隙留在两个侧面460和470之间。
类似的，表5还表示了另一种可能的连接设计。图5也表示了两个要连接的连接部分500和510，以及其中一个连接部分包括一个能量导向器530，该导向器没有涂层(或在连接前去除此处金属层)。导电材料540和550分别位于连接部分500和510上。连接部件之一(这里是510)的一个侧面有一个从顶部表面的缩陷560，以减少或排除烧化(flashing)问题。
虽然根据这里的某些较佳实施例，仔细地描述了本发明，但那些在本领域的有关技术人员可以对其进行许多改进和改变。因此，通过附加的权利要求确定包括全部的这些改进和改变都是处于本发明的实际的精神和范围之内。

Claims (13)

1.  一种连接基底的方法，所述方法包括：
在所述基底中的每一个上，在要形成电连接的第一个位置上施加一个导电层，并且在所述基底中的每一个上提供第二个位置，该位置无导电材料，而且在该位置要形成一个机械连接；
把该基底放在一个配置中，其中形成机械连接的第一个位置处于相接触状态，并且形成电连接的位置处于相接触状态；
为了融解所述导电层和所述聚合物基底，对所述基底施加定向能量。
2.  根据权利要求1所述的方法，其特征在于所述导电层施加在所述的每一个基底上；然后将所述导电层从要形成机械连接的所述第二个位置上除去。
3.  根据权利要求1所述的方法，其特征在于，该定向能量是超声波。
4.  根据权利要求1所述的方法，其特征在于，要连接的基底还包括一个对接连接结构。
5.  根据权利要求1所述的方法，其特征在于，要连接的表面还包括一个具有渐缩的端部的阶梯连接结构和一个防止融化的聚合物基底材料在基底表面上产生烧化的槽(pocket)。
6.  根据权利要求1所述的方法，其特征在于，要连接的表面还包括一个具有渐缩的端部的对接连接结构和一个防止融化的聚合物基底材料在基底表面上产生烧化的槽。
7.  根据权利要求1所述的方法，其特征在于，导电层包括适于扩散连接的金属。
8.  根据权利要求1所述的方法，其特征在于，所述导电层包括镍层、铜层和金层。
9.  根据权利要求1所述的方法，其特征在于，它们相应的聚合物基底上面的所述导电层是以面靠面的关系构成的。
10.  根据权利要求1所述的方法，其特征在于，所述聚合物基底是以端靠端的关系构成的。
11.  根据权利要求1实现基底的连接。
12.  一个聚合物基底的连接，每一个基底有一个导电层，其中所述聚合物基底融合在一起并且在其上的导电层也融合在一起。
13.  至少两个涂有导电层的聚合物基底的连接方法，该方法包括：
放置该基底于一个配置中，其中要形成的聚合物连接位置相接触地放置，并且要形成的电连接的连接位置面靠面地接触放置；
为了融化所述导电涂层和所述聚合物基底对所述基底施加定向能量。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102856688A (zh) * 2011-06-28 2013-01-02 通用汽车环球科技运作有限责任公司 可维护电连接件和方法
CN108330433A (zh) * 2018-01-31 2018-07-27 厦门建霖健康家居股份有限公司 一种塑料电镀工件的环保焊接方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6220777B1 (en) * 1998-08-24 2001-04-24 Lucent Technologies Inc. Methods and apparatus for producing ultrasonic weld joints for injection molded plastic parts
JP3860088B2 (ja) * 2002-07-25 2006-12-20 Ｎｅｃエレクトロニクス株式会社 ボンディング方法及びボンディング装置
CA2584851C (en) 2004-11-04 2015-04-07 Microchips, Inc. Compression and cold weld sealing methods and devices
US7134201B2 (en) * 2004-11-12 2006-11-14 Agc Automotive Americas R&D, Inc. Window pane and a method of bonding a connector to the window pane
US7223939B2 (en) * 2004-11-12 2007-05-29 Agc Automotive Americas, R & D, Inc. Electrical connector for a window pane of a vehicle
CN103115722A (zh) * 2013-02-27 2013-05-22 武汉元丰汽车电控系统有限公司 压力传感器复合式自填充凹槽耐高压密封接口
US9272371B2 (en) 2013-05-30 2016-03-01 Agc Automotive Americas R&D, Inc. Solder joint for an electrical conductor and a window pane including same
FR3041625B1 (fr) * 2015-09-29 2021-07-30 Tronics Microsystems Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support
US10356914B2 (en) * 2016-04-04 2019-07-16 Raytheon Company Method of lamination of dielectric circuit materials using ultrasonic means
US10263362B2 (en) 2017-03-29 2019-04-16 Agc Automotive Americas R&D, Inc. Fluidically sealed enclosure for window electrical connections
US10849192B2 (en) 2017-04-26 2020-11-24 Agc Automotive Americas R&D, Inc. Enclosure assembly for window electrical connections
CN109757033B (zh) * 2019-02-22 2020-07-10 皆利士多层线路版(中山)有限公司 电路板及其制作方法
CN111217325B (zh) * 2019-12-06 2023-04-07 太原科技大学 一种超声辅助阳极键合方法及其超声辅助阳极键合系统
CN111674049A (zh) * 2020-07-10 2020-09-18 埃维尔汽车部件(苏州)有限公司 一种喷漆面板和电镀面板的超声焊处理工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3468731A (en) * 1966-07-01 1969-09-23 Branson Instr Method and apparatus for sonically sealing the end portion of thermoplastic tubular containers
US3728183A (en) * 1971-03-19 1973-04-17 Eastman Kodak Co Method of and apparatus for ultrasonic splicing
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US4546409A (en) * 1982-04-02 1985-10-08 Mitsubishi Denki Kabushiki Kaisha Device for cooling semiconductor elements
US4648179A (en) * 1983-06-30 1987-03-10 International Business Machines Corporation Process of making interconnection structure for semiconductor device
US4589584A (en) * 1985-01-31 1986-05-20 International Business Machines Corporation Electrical connection for polymeric conductive material
US5031308A (en) * 1988-12-29 1991-07-16 Japan Radio Co., Ltd. Method of manufacturing multilayered printed-wiring-board
US5326412A (en) * 1992-12-22 1994-07-05 Hughes Aircraft Company Method for electrodepositing corrosion barrier on isolated circuitry
US5303862A (en) * 1992-12-31 1994-04-19 International Business Machines Corporation Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102856688A (zh) * 2011-06-28 2013-01-02 通用汽车环球科技运作有限责任公司 可维护电连接件和方法
CN102856688B (zh) * 2011-06-28 2015-10-28 通用汽车环球科技运作有限责任公司 可维护电连接件和方法
CN108330433A (zh) * 2018-01-31 2018-07-27 厦门建霖健康家居股份有限公司 一种塑料电镀工件的环保焊接方法

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