KR950008482B1 - 전극 접속용 가열 가압 압압자 - Google Patents

전극 접속용 가열 가압 압압자 Download PDF

Info

Publication number
KR950008482B1
KR950008482B1 KR1019890006844A KR890006844A KR950008482B1 KR 950008482 B1 KR950008482 B1 KR 950008482B1 KR 1019890006844 A KR1019890006844 A KR 1019890006844A KR 890006844 A KR890006844 A KR 890006844A KR 950008482 B1 KR950008482 B1 KR 950008482B1
Authority
KR
South Korea
Prior art keywords
hot plate
rubber
rubber pad
protrusions
hot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019890006844A
Other languages
English (en)
Korean (ko)
Other versions
KR890017073A (ko
Inventor
도시유끼 가와구찌
Original Assignee
신에쓰 폴리머 가부시끼가이샤
이이지마 아쓰시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쓰 폴리머 가부시끼가이샤, 이이지마 아쓰시 filed Critical 신에쓰 폴리머 가부시끼가이샤
Publication of KR890017073A publication Critical patent/KR890017073A/ko
Application granted granted Critical
Publication of KR950008482B1 publication Critical patent/KR950008482B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
  • Combinations Of Printed Boards (AREA)
  • Resistance Heating (AREA)
KR1019890006844A 1988-05-24 1989-05-22 전극 접속용 가열 가압 압압자 Expired - Lifetime KR950008482B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP88-68285 1988-05-24
JP1988068285U JPH055675Y2 (https=) 1988-05-24 1988-05-24
JP63-68285 1988-05-24

Publications (2)

Publication Number Publication Date
KR890017073A KR890017073A (ko) 1989-12-15
KR950008482B1 true KR950008482B1 (ko) 1995-07-31

Family

ID=13369341

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890006844A Expired - Lifetime KR950008482B1 (ko) 1988-05-24 1989-05-22 전극 접속용 가열 가압 압압자

Country Status (4)

Country Link
JP (1) JPH055675Y2 (https=)
KR (1) KR950008482B1 (https=)
GB (1) GB2218932B (https=)
HK (1) HK148995A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3233195B2 (ja) * 1996-07-02 2001-11-26 信越ポリマー株式会社 半導体素子検査用ソケット
DE10352754B3 (de) * 2003-11-12 2005-06-30 Bachmann Kunststoff Technologien Gmbh Heiss-Pressvorrichtung mit einem Pressblech und mindestens einem elastischen Belag
JP2009188114A (ja) * 2008-02-05 2009-08-20 Three M Innovative Properties Co フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器
CN101870179B (zh) * 2010-05-26 2012-01-25 太原重工股份有限公司 一种炭素和电极压机的恒温压头
CN103200780A (zh) * 2012-01-09 2013-07-10 苏州世鼎电子有限公司 铜箔线路与罩体基板的热压贴合方法
CN108922959B (zh) * 2013-03-28 2022-07-29 日亚化学工业株式会社 发光装置、及使用发光装置的装置
CN103538126A (zh) * 2013-10-22 2014-01-29 昆山市联昆热压板有限公司 一种改进型热压板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB565998A (en) * 1943-06-03 1944-12-07 British Tyre & Rubber Company Improvements in or relating to press tools
US3664902A (en) * 1970-01-09 1972-05-23 Bell Telephone Labor Inc Nonuniform pressure bonding method
JPS63114087A (ja) * 1986-10-29 1988-05-18 松下電器産業株式会社 熱圧着方法

Also Published As

Publication number Publication date
JPH01170981U (https=) 1989-12-04
HK148995A (en) 1995-09-29
KR890017073A (ko) 1989-12-15
GB2218932A (en) 1989-11-29
GB8910827D0 (en) 1989-06-28
JPH055675Y2 (https=) 1993-02-15
GB2218932B (en) 1992-10-28

Similar Documents

Publication Publication Date Title
US20090230171A1 (en) Device for mounting electric component
KR950008482B1 (ko) 전극 접속용 가열 가압 압압자
JP3763607B2 (ja) 液晶表示装置の製造方法及び液晶表示装置
US7250960B2 (en) Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same
JP3317226B2 (ja) 熱圧着装置
CN216357503U (zh) 一种功率半导体器件安装结构
JP5125062B2 (ja) プリント配線板
CN107069434B (zh) 一种机械连接的半导体激光器叠阵
JPH044713B2 (https=)
JPH10112584A (ja) 回路基板の接続方法、回路基板の接続構造及びその構造を用いた液晶装置
TWI420995B (zh) 電氣元件之構裝方法
CN220639269U (zh) 防溢胶压着不良的热敏打印头
CN114871561B (zh) 热压焊头及热压焊设备
CN222655403U (zh) 顶部增加补强焊盘的fpc及热敏打印头
JPH07212036A (ja) 超音波溶着による回路接続方法
JPH0671026B2 (ja) 半導体実装方法
JP2007220704A (ja) 半導体装置
JP3187687B2 (ja) サーマルプリントヘッドの構造
JPH0817559A (ja) ヒータ
JP2728230B2 (ja) リードの接合法
JP3063443B2 (ja) ヒートシール方法
JPH0429560Y2 (https=)
JP4599719B2 (ja) 熱電半導体の製造方法
JPH06169098A (ja) 太陽電池の製造方法
JPH01175186A (ja) 熱接着用プレス装置における熱加圧具

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19890522

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19911018

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19890522

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19941213

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 19950328

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 19941213

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

J2X1 Appeal (before the patent court)

Free format text: APPEAL AGAINST DECISION TO DECLINE REFUSAL

PJ2001 Appeal

Appeal kind category: Appeal against decision to decline refusal

Decision date: 19951025

Appeal identifier: 1995201000855

Request date: 19950428

PB0901 Examination by re-examination before a trial

Comment text: Request for Trial against Decision on Refusal

Patent event date: 19950428

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 19950213

Patent event code: PB09011R02I

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

Comment text: Decision on Publication of Application

Patent event code: PG16051S01I

Patent event date: 19950705

B701 Decision to grant
PB0701 Decision of registration after re-examination before a trial

Patent event date: 19951025

Comment text: Decision to Grant Registration

Patent event code: PB07012S01D

Patent event date: 19950616

Comment text: Transfer of Trial File for Re-examination before a Trial

Patent event code: PB07011S01I

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 19951204

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 19951204

End annual number: 3

Start annual number: 1

PR1001 Payment of annual fee

Payment date: 19980714

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 19990716

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20000726

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20010725

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20020722

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20030722

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20040723

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20050722

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20060725

Start annual number: 12

End annual number: 12

PR1001 Payment of annual fee

Payment date: 20070723

Start annual number: 13

End annual number: 13

PR1001 Payment of annual fee

Payment date: 20080721

Start annual number: 14

End annual number: 14

FPAY Annual fee payment

Payment date: 20090724

Year of fee payment: 15

PR1001 Payment of annual fee

Payment date: 20090724

Start annual number: 15

End annual number: 15

EXPY Expiration of term
PC1801 Expiration of term