KR890017073A - 전극 접속용 가열 가압 압압자 - Google Patents

전극 접속용 가열 가압 압압자 Download PDF

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Publication number
KR890017073A
KR890017073A KR1019890006844A KR890006844A KR890017073A KR 890017073 A KR890017073 A KR 890017073A KR 1019890006844 A KR1019890006844 A KR 1019890006844A KR 890006844 A KR890006844 A KR 890006844A KR 890017073 A KR890017073 A KR 890017073A
Authority
KR
South Korea
Prior art keywords
pad member
heated pressure
hot plate
presser
heated
Prior art date
Application number
KR1019890006844A
Other languages
English (en)
Other versions
KR950008482B1 (ko
Inventor
도시유끼 가와구찌
Original Assignee
이이지마 아쓰시
신에쓰 폴리머 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이이지마 아쓰시, 신에쓰 폴리머 가부시끼가이샤 filed Critical 이이지마 아쓰시
Publication of KR890017073A publication Critical patent/KR890017073A/ko
Application granted granted Critical
Publication of KR950008482B1 publication Critical patent/KR950008482B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Resistance Heating (AREA)

Abstract

내용 없음

Description

전극 접속용 가열 가압 압압자
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 가열 가압에 사용되는 장치의 개략도, 제2a,2b, 및 2c도는 각각 종래 가열 가압 압압자(헤드)의 각 단면도, 제3a 및 3b도는 압압자의 세로 방향에 수직인 평면의 절단으로서의 본 발명에 따른 가열 가압 압압자의 각 단면도.

Claims (6)

  1. (a)적어도 하나의 오목부와 돌출부를 가진 금속으로 만들어진 열판과 ; (b) 자유롭게 탈착할 수 있는 식으로 열판에 부착된 패드부재를 지지하는 열판의 오목부 또는 돌출부에 각각 계합되는 적어도 하나의 오목부 또는 돌출부를 가지는 패드 부재를 포함하며, 상기 패드 부재는 JIS K 6301에 규정된 경도 스케일에 따라 50내지 80의 범위내의 경도를 갖는 고무 재료로 만들어지는 가열가압 압압자.
  2. 제 1항에 있어서, 돌출부 또는 오목부가 세장 리브 또는 세장 그루우브 형태인 가열 가압 압압자
  3. 제 1항에 있어서, 패드 부재가 실리콘 고무로 만들어지는 가열 가압 압압자.
  4. 제 1항에 있어서, 패드 부재가 0.5 내지 3mm범위의 두께를 가지는 가열 가압 압압자.
  5. 제 1항에 있어서, 고무 재료가 열전도 개량제를 20 내지 60체적% 함유하는 가열 가압 압압자.
  6. 제 5항에 있어서, 열전도 개량제가 금속 또는 유기 산화물의 분말인 가열 가압 압압자.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890006844A 1988-05-24 1989-05-22 전극 접속용 가열 가압 압압자 KR950008482B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP88-68285 1988-05-24
JP1988068285U JPH055675Y2 (ko) 1988-05-24 1988-05-24
JP63-68285 1988-05-24

Publications (2)

Publication Number Publication Date
KR890017073A true KR890017073A (ko) 1989-12-15
KR950008482B1 KR950008482B1 (ko) 1995-07-31

Family

ID=13369341

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890006844A KR950008482B1 (ko) 1988-05-24 1989-05-22 전극 접속용 가열 가압 압압자

Country Status (4)

Country Link
JP (1) JPH055675Y2 (ko)
KR (1) KR950008482B1 (ko)
GB (1) GB2218932B (ko)
HK (1) HK148995A (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3233195B2 (ja) * 1996-07-02 2001-11-26 信越ポリマー株式会社 半導体素子検査用ソケット
DE10352754B3 (de) * 2003-11-12 2005-06-30 Bachmann Kunststoff Technologien Gmbh Heiss-Pressvorrichtung mit einem Pressblech und mindestens einem elastischen Belag
JP2009188114A (ja) * 2008-02-05 2009-08-20 Three M Innovative Properties Co フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器
CN101870179B (zh) * 2010-05-26 2012-01-25 太原重工股份有限公司 一种炭素和电极压机的恒温压头
CN103200780A (zh) * 2012-01-09 2013-07-10 苏州世鼎电子有限公司 铜箔线路与罩体基板的热压贴合方法
EP2980870B1 (en) * 2013-03-28 2018-01-17 Toshiba Hokuto Electronics Corporation Light-emitting device, production method therefor, and device using light-emitting device
CN103538126A (zh) * 2013-10-22 2014-01-29 昆山市联昆热压板有限公司 一种改进型热压板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB565998A (en) * 1943-06-03 1944-12-07 British Tyre & Rubber Company Improvements in or relating to press tools
US3664902A (en) * 1970-01-09 1972-05-23 Bell Telephone Labor Inc Nonuniform pressure bonding method
JPS63114087A (ja) * 1986-10-29 1988-05-18 松下電器産業株式会社 熱圧着方法

Also Published As

Publication number Publication date
KR950008482B1 (ko) 1995-07-31
HK148995A (en) 1995-09-29
GB2218932A (en) 1989-11-29
GB2218932B (en) 1992-10-28
JPH01170981U (ko) 1989-12-04
GB8910827D0 (en) 1989-06-28
JPH055675Y2 (ko) 1993-02-15

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