HK148995A - Hot-press head for connection of electrodes - Google Patents
Hot-press head for connection of electrodesInfo
- Publication number
- HK148995A HK148995A HK148995A HK148995A HK148995A HK 148995 A HK148995 A HK 148995A HK 148995 A HK148995 A HK 148995A HK 148995 A HK148995 A HK 148995A HK 148995 A HK148995 A HK 148995A
- Authority
- HK
- Hong Kong
- Prior art keywords
- electrodes
- hot
- connection
- press head
- press
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988068285U JPH055675Y2 (xx) | 1988-05-24 | 1988-05-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK148995A true HK148995A (en) | 1995-09-29 |
Family
ID=13369341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK148995A HK148995A (en) | 1988-05-24 | 1995-09-21 | Hot-press head for connection of electrodes |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH055675Y2 (xx) |
KR (1) | KR950008482B1 (xx) |
GB (1) | GB2218932B (xx) |
HK (1) | HK148995A (xx) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3233195B2 (ja) * | 1996-07-02 | 2001-11-26 | 信越ポリマー株式会社 | 半導体素子検査用ソケット |
DE10352754B3 (de) * | 2003-11-12 | 2005-06-30 | Bachmann Kunststoff Technologien Gmbh | Heiss-Pressvorrichtung mit einem Pressblech und mindestens einem elastischen Belag |
JP2009188114A (ja) * | 2008-02-05 | 2009-08-20 | Three M Innovative Properties Co | フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器 |
CN101870179B (zh) * | 2010-05-26 | 2012-01-25 | 太原重工股份有限公司 | 一种炭素和电极压机的恒温压头 |
CN103200780A (zh) * | 2012-01-09 | 2013-07-10 | 苏州世鼎电子有限公司 | 铜箔线路与罩体基板的热压贴合方法 |
JP5628460B1 (ja) * | 2013-03-28 | 2014-11-19 | 東芝ホクト電子株式会社 | 発光装置、その製造方法、および発光装置使用装置 |
CN103538126A (zh) * | 2013-10-22 | 2014-01-29 | 昆山市联昆热压板有限公司 | 一种改进型热压板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB565998A (en) * | 1943-06-03 | 1944-12-07 | British Tyre & Rubber Company | Improvements in or relating to press tools |
US3664902A (en) * | 1970-01-09 | 1972-05-23 | Bell Telephone Labor Inc | Nonuniform pressure bonding method |
JPS63114087A (ja) * | 1986-10-29 | 1988-05-18 | 松下電器産業株式会社 | 熱圧着方法 |
-
1988
- 1988-05-24 JP JP1988068285U patent/JPH055675Y2/ja not_active Expired - Lifetime
-
1989
- 1989-05-11 GB GB8910827A patent/GB2218932B/en not_active Expired - Lifetime
- 1989-05-22 KR KR1019890006844A patent/KR950008482B1/ko not_active IP Right Cessation
-
1995
- 1995-09-21 HK HK148995A patent/HK148995A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2218932A (en) | 1989-11-29 |
JPH01170981U (xx) | 1989-12-04 |
JPH055675Y2 (xx) | 1993-02-15 |
GB8910827D0 (en) | 1989-06-28 |
KR950008482B1 (ko) | 1995-07-31 |
GB2218932B (en) | 1992-10-28 |
KR890017073A (ko) | 1989-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PE | Patent expired |
Effective date: 20090510 |