KR950006025A - 구리 및 구리합금 표면처리 조성물 및 상기 표면처리 방법 - Google Patents
구리 및 구리합금 표면처리 조성물 및 상기 표면처리 방법 Download PDFInfo
- Publication number
- KR950006025A KR950006025A KR1019940019531A KR19940019531A KR950006025A KR 950006025 A KR950006025 A KR 950006025A KR 1019940019531 A KR1019940019531 A KR 1019940019531A KR 19940019531 A KR19940019531 A KR 19940019531A KR 950006025 A KR950006025 A KR 950006025A
- Authority
- KR
- South Korea
- Prior art keywords
- acid
- alkynyl
- aryl
- alkyl
- aralkyl
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
- C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
- C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
- C07D235/04—Benzimidazoles; Hydrogenated benzimidazoles
- C07D235/06—Benzimidazoles; Hydrogenated benzimidazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
- C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
- C07D235/04—Benzimidazoles; Hydrogenated benzimidazoles
- C07D235/06—Benzimidazoles; Hydrogenated benzimidazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
- C07D235/08—Radicals containing only hydrogen and carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
- C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
- C07D235/04—Benzimidazoles; Hydrogenated benzimidazoles
- C07D235/06—Benzimidazoles; Hydrogenated benzimidazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
- C07D235/10—Radicals substituted by halogen atoms or nitro radicals
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
- C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
- C07D235/04—Benzimidazoles; Hydrogenated benzimidazoles
- C07D235/18—Benzimidazoles; Hydrogenated benzimidazoles with aryl radicals directly attached in position 2
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D235/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
- C07D235/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
- C07D235/04—Benzimidazoles; Hydrogenated benzimidazoles
- C07D235/20—Two benzimidazolyl-2 radicals linked together directly or via a hydrocarbon or substituted hydrocarbon radical
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
본 발명은 특정 이미다졸과 물, 및 산 또는 수용성 용매를 함유하는 구리 및 구리 합금의 표면 처리 조성물을 개시한다. 이 조성물은 구리 또는 구리 합금의 표면에 사용될 때, 우수한 땜납성을 갖은 내열 유기 필름을 형성한다. 특히, 프린트 배선판의 부식 방지에 유용하다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (8)
- 하기 일반식(1) 내지 (6) 즉,(식중, A1은 알킬, 알케닐, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, R1은 할로겐 원자를 갖는 알킬, 알케닐, 알키닐 또는 아릴기이고 a는 0 내지 4의 정수이다.)(식중, R1는 알킬렌, 알케닐렌, 알키닐렌 또는 알릴렌이고, A2는 수소, 알킬, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, b는 0 또는 1이고, A1및 a는 상기 정의한 바와 같다.)(식중, A3는 알킬, 알케닐, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, R3는 알킬렌, 알케닐렌, 알키닐렌, 또는 아릴렌이고, c는 0 내지 7의 정수이고, A1,a 및 b는 상기 정의한 바와 같다.)(식중, A4는 알케닐, 알키닐, 아릴 또는 아르알킬이고, A5는 알킬, 알케닐, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, R4는 알킬렌, 알케닐렌, 알키닐렌 또는 알릴렌이고, d는 0 내지 5의 정수이고, a는 상기 정의한 바와 같다.)(식중, A6은 개별적으로 알킬, 알케닐, 알키닐, 아릴, 아르알킬 또는 페닐카르보닐이다.)(식중, A7은 수소, 저급알킬 또는 할로겐이고, A8은 알킬, 알케닐, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, e는 0내지 6의 정수이다)의 이미다졸 유도체 또는 그의 염을 1종 이상 함유하는 구리 및 구리합금표면처리 조성물.
- 제1항에 있어서, 부가적으로 산을 함유하는 조성물.
- 제2항에 있어서, 상기 산은 포름산, 아세트산, 프로피온산, 글리콜산, n-부티르산, 이소부티르산, 아크릴산, 크로톤산, 이소크로톤산, 발레르산, 3-메릴부티르산, 2-메틸부티르산, 카프론산, 엔안토산, 카프릴산, 트랜스-2-메틸-2-펜테논산, 페닐아세트산, 5-페닐발레르산, 4-페닐발레르산, 벤조산, ω-시클로헥실부티르산, α-나프탈렌아세트산, 티페닐아세트산, 옥살산, 말론산, 숙신산, 아디프산, 말레산, 아세틸산, 디카르복실산, 피멜산, 수베르산, 2-n-부틸말론산, 프탈산, 모노클로로아세트산, 트리클로로아세트산, 모노브로모아세트산, 트리브로모아세트산, 3-클로로프로피온산, 2-클로로프로피온산, 2-클로로부티르산, 2-클로로발레르산, 2-클로로카프론산, 2-클로로엔안트산, 2-클로로카프릴산, 2-브로모프로피온산, 3-브로모프로피온산, 4-브로모부티르산, 2-브로모발레르산, 5-브로모발레르산, 2-브로모카프론산, 6-브로모카프론산, 2-브로모엔안트산, 7-브로모엔안트산, p-클로로페닐아세트산, p-브로모페닐아세트산, 락트산, 옥시부티르산, 글리세르산, 타르타르산, 말산, 시트르산, 염산, 황산,질산 및 인산으로 구성되는 군으로부터 선택되는 조성물.
- 제1항에 있어서, 부가적으로 수용성 용매를 함유하는 조성물.
- 제4항에 있어서, 상기 수용성 용매는 메탄올, 에탄올, 이소프로판올, 에틸렌 클리콜 모노메틸 에테르 및 에틸렌 클리콜 모노에틸 에테르로 구성되는 군으로부터 선택되는 조성물.
- 하기 일반식 (1) 내지 (6)즉,(식중, A1은 알킬, 알케닐, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, R1은 할로겐 원자를 갖는 알킬, 알케닐, 알키닐 또는 아릴기이고 a는 0내지 4의 정수이다.)(식중, R2는 알킬렌, 알케닐렌, 알키닐렌 또는 아릴렌이고, A2는 수소, 알킬, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, b는 0 또는 1이고, A1및 a는 상기 정의한 바와 같다.)(식중, A3는 알킬, 알케닐, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, R3는 알킬렌, 알케닐렌, 알키닐렌 또는 아릴렌이고, c는 0내지 7의 정수이고, A1,a 및 b는 상기 정의한 바와 같다.)(식중, A4는 알케닐, 알키닐, 아릴 또는 아르알킬이고, A5는 알킬, 알케닐, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, R4는 알킬렌, 알케닐렌 또는 아릴렌이고, d는 0 내지 5의 정수이고, a는 상기 정의한 바와 같다.)(식중, A6는 개별적으로 알킬, 알케닐, 알키닐, 아릴, 아르알킬 또는 페닐카르보닐이다.)(식중, A7은 수소, 저급알킬 또는 할로겐이고, A8은 알킬, 알케닐, 알키닐, 아릴, 아르알킬, 페닐카르보닐 또는 할로겐이고, e는 0 내지 6의 정수이다.)의 이미다졸 유도체 또는 그의 염을 1종 이상 함유하는 수용액 또는 수분산액을 적용시킴을 특징으로 하는 구리 및 구리합금 표면처리 방법.
- 제6항에 있어서, 상기 수용액 또는 수분산액은 부가적으로 포름산, 아세트산, 프로피온산, 글리콜산, n-부티르산, 이소부티르산, 아크릴산, 크로톤산, 이소크로톤산, 발레르산, 3-메릴부티르산, 2-메틸브티르산, 카프론산, 엔안트산, 카프릴산, 트랜스-2-메틸-2-펜테논산, 페닐아세트산, 5-페닐발레르산, 4-페닐발레르산, 벤조산, ω-시클로헥실부티르산, α-나프탈렌아세트산, 티페닐아세트산, 옥살산, 말론산, 숙신산, 아디프산, 말레산, 아세틸산, 디카르복실산, 피멜산, 수베르산, 2-n-부틸말론산, 프탈산, 모노클로로아세트산, 트리클로로아세트산, 모노브로모아세트산, 트리브로모아세트산, 3-클로로프로피온산, 2-클로로프로피온산, 2-클로로부티르산, 2-클로로발레르산, 2-클로로카프론산, 2-클로로엔안트산, 2-클로로카프릴산, 2-브로모프로피온산, 3-브로모프로피온산, 4-브로모부티르산, 2-브로모발레르산, 5-브로모발레르산, 2-브로모카프론산, 6-브로모카프론산, 2-브로모엔안트산, 7-브로모엔안트산, p-클로로페닐아세트산, p-브로모페닐아세트산, 락트산, 옥시부티르산, 글리세르산, 타르타르산, 말산, 시트르산, 염산, 황산,질산 및 인산으로 구성되는 군으로부터 선택되는 조성물.
- 제8항에 있어서, 상기 수용액 또는 수분산액을 부가적으로 메탄올, 에탄올, 이소프로판올, 에틸렌 글리콜 모노메틸 에테르 및 에틸렌 글리콜 모노에틸 에테르로 구성되는 군으로부터 선택된 수용성 용매를 함유하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21794893A JP2923596B2 (ja) | 1993-08-11 | 1993-08-11 | イミダゾール系化合物を用いた銅および銅合金の表面処理剤 |
JP217948/1993 | 1993-08-11 | ||
JP246194/1993 | 1993-09-07 | ||
JP24619493A JPH0779061A (ja) | 1993-09-07 | 1993-09-07 | 銅および銅合金の表面処理剤 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950006025A true KR950006025A (ko) | 1995-03-20 |
Family
ID=26522303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940019531A KR950006025A (ko) | 1993-08-11 | 1994-08-08 | 구리 및 구리합금 표면처리 조성물 및 상기 표면처리 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5496590A (ko) |
EP (2) | EP0818562B1 (ko) |
KR (1) | KR950006025A (ko) |
CN (1) | CN1163552C (ko) |
DE (1) | DE69423660T2 (ko) |
TW (1) | TW263534B (ko) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2923524B2 (ja) * | 1995-08-01 | 1999-07-26 | メック株式会社 | 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法 |
JP3547028B2 (ja) * | 1996-02-26 | 2004-07-28 | 四国化成工業株式会社 | 銅及び銅合金の表面処理剤 |
CN1095623C (zh) * | 1996-04-18 | 2002-12-04 | 国际商业机器公司 | 用于含铜金属的复合涂料组合物 |
US7534752B2 (en) * | 1996-07-03 | 2009-05-19 | Advanced Technology Materials, Inc. | Post plasma ashing wafer cleaning formulation |
JP3909920B2 (ja) * | 1997-07-24 | 2007-04-25 | メック株式会社 | 銅および銅合金の表面処理法 |
GB2336378A (en) | 1998-04-17 | 1999-10-20 | Ibm | Protective treatment of a zinc or zinc alloy surface with an alcoholic solution of an azole |
US6036758A (en) * | 1998-08-10 | 2000-03-14 | Pmd (U.K.) Limited | Surface treatment of copper |
US6524644B1 (en) | 1999-08-26 | 2003-02-25 | Enthone Inc. | Process for selective deposition of OSP coating on copper, excluding deposition on gold |
JP2001084729A (ja) * | 1999-09-14 | 2001-03-30 | Fuji Photo Film Co Ltd | フロッピーディスク |
TWI252249B (en) * | 1999-11-12 | 2006-04-01 | Yasuo Fukutani | Rust preventive |
JP4309602B2 (ja) | 2001-04-25 | 2009-08-05 | メック株式会社 | 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体 |
JP2004047827A (ja) * | 2002-07-12 | 2004-02-12 | Mec Kk | プリント回路板の製造方法 |
US7232478B2 (en) * | 2003-07-14 | 2007-06-19 | Enthone Inc. | Adhesion promotion in printed circuit boards |
TWI362415B (en) | 2003-10-27 | 2012-04-21 | Wako Pure Chem Ind Ltd | Novel detergent and method for cleaning |
JP3952410B2 (ja) * | 2004-02-10 | 2007-08-01 | タムラ化研株式会社 | 金属の表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法 |
EP1861750A4 (en) * | 2005-03-25 | 2010-10-06 | Fujifilm Electronic Materials | PRETREATMENT COMPOSITIONS |
EP1861749A4 (en) * | 2005-03-25 | 2010-10-06 | Fujifilm Electronic Materials | NEW PHOTOSENSITIVE RESIN COMPOSITIONS |
TWI402616B (zh) * | 2005-06-03 | 2013-07-21 | Fujifilm Electronic Materials | 新穎的光敏性樹脂組成物 |
TW200702913A (en) * | 2005-06-03 | 2007-01-16 | Fujifilm Electronic Materials | Pretreatment compositions |
US7794531B2 (en) * | 2007-01-08 | 2010-09-14 | Enthone Inc. | Organic solderability preservative comprising high boiling temperature alcohol |
KR101749634B1 (ko) | 2010-06-18 | 2017-06-21 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 구리층 및 몰리브덴층을 포함하는 다층 구조막용 에칭액 |
CN102775351B (zh) * | 2011-05-12 | 2015-09-30 | 比亚迪股份有限公司 | 一种二咪唑类化合物及其制备方法和一种有机助焊剂处理液 |
CN102432542B (zh) * | 2011-09-09 | 2014-04-09 | 深圳市板明科技有限公司 | 咪唑化合物及其制备方法和应用、有机防焊保护剂 |
CN104471108B (zh) * | 2012-07-09 | 2020-05-05 | 四国化成工业株式会社 | 铜覆膜形成剂及铜覆膜的形成方法 |
CN102993878B (zh) * | 2012-11-01 | 2016-03-09 | 安徽荣达阀门有限公司 | 一种含有二乙酰柠檬酸三乙酯的金属防锈剂 |
JP6218000B2 (ja) * | 2016-02-19 | 2017-10-25 | メック株式会社 | 銅のマイクロエッチング剤および配線基板の製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3645772A (en) * | 1970-06-30 | 1972-02-29 | Du Pont | Process for improving bonding of a photoresist to copper |
US4098720A (en) * | 1973-10-25 | 1978-07-04 | Chemed Corporation | Corrosion inhibition |
US4074046A (en) * | 1974-01-21 | 1978-02-14 | American Cyanamid Company | Process for azoles (ring closure of nitro compounds) |
US4057425A (en) * | 1975-07-16 | 1977-11-08 | Polaroid Corporation | 2-Substituted benzimidazoles in multicolor diffusion transfer |
GB8313320D0 (en) * | 1983-05-14 | 1983-06-22 | Ciba Geigy Ag | Coating compositions |
GB8707799D0 (en) * | 1987-04-01 | 1987-05-07 | Ici Plc | Metal treatment |
US4812363A (en) * | 1987-10-26 | 1989-03-14 | Bell James P | Polymeric coupling agent |
JPH03124395A (ja) * | 1989-10-03 | 1991-05-27 | Hideyuki Kawai | はんだ付け用プレフラックス |
KR960008153B1 (ko) * | 1989-10-03 | 1996-06-20 | 다찌바나 다이끼찌 | 금속 공작용 표면 처리제 |
US5089304A (en) * | 1990-03-07 | 1992-02-18 | Hoechst Celanese Corp. | Method for producing a corrosion resistant article by applying a polybenzimidazole coating |
US5478607A (en) * | 1991-05-17 | 1995-12-26 | Hitachi Telecon Technologies Ltd. | Method for use of preflux, printed wiring board, and method for production thereof |
JP3112744B2 (ja) * | 1991-09-12 | 2000-11-27 | タムラ化研株式会社 | プリント配線板用表面保護剤 |
JPH05156475A (ja) * | 1991-12-02 | 1993-06-22 | Hideaki Yamaguchi | 金属の表面処理方法 |
TW217426B (ko) * | 1992-01-08 | 1993-12-11 | Mekku Kk | |
US5211881A (en) * | 1992-01-30 | 1993-05-18 | Elf Atochem North America, Inc. | Methods and compositions for treating metals by means of water-borne polymeric films |
US5275694A (en) * | 1992-03-24 | 1994-01-04 | Sanwa Laboratory Ltd. | Process for production of copper through-hole printed wiring boards |
-
1993
- 1993-11-08 TW TW082109327A patent/TW263534B/zh active
-
1994
- 1994-07-15 CN CNB941085325A patent/CN1163552C/zh not_active Expired - Fee Related
- 1994-08-08 KR KR1019940019531A patent/KR950006025A/ko not_active Application Discontinuation
- 1994-08-10 DE DE69423660T patent/DE69423660T2/de not_active Expired - Fee Related
- 1994-08-10 EP EP97116962A patent/EP0818562B1/en not_active Expired - Lifetime
- 1994-08-10 EP EP94112532A patent/EP0643154A3/en not_active Withdrawn
- 1994-08-11 US US08/289,271 patent/US5496590A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0818562B1 (en) | 2000-03-22 |
DE69423660T2 (de) | 2000-07-27 |
US5496590A (en) | 1996-03-05 |
CN1163552C (zh) | 2004-08-25 |
EP0643154A2 (en) | 1995-03-15 |
DE69423660D1 (de) | 2000-04-27 |
EP0818562A1 (en) | 1998-01-14 |
TW263534B (ko) | 1995-11-21 |
EP0643154A3 (en) | 1995-04-26 |
CN1106849A (zh) | 1995-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR950006025A (ko) | 구리 및 구리합금 표면처리 조성물 및 상기 표면처리 방법 | |
US5439783A (en) | Composition for treating copper or copper alloys | |
KR100263516B1 (ko) | 벤즈이미다졸 유도체 및 이를 함유하는 동 및 동합금의 표면처리 조성물 | |
EP0627499B1 (en) | Agent for treating surfaces of copper and copper alloys | |
JP4883996B2 (ja) | 水溶性プレフラックス及びその利用 | |
JP5313044B2 (ja) | 銅または銅合金の表面処理剤及びその利用 | |
KR880001457B1 (ko) | 구리 기질로 부터 땜납을 제거하는 조성물 | |
JP2001300766A (ja) | 回路基板はんだ付用フラックス及び回路基板 | |
BR0105903A (pt) | Método e composição para limpeza de um componente de motor de turbina | |
KR100402899B1 (ko) | 구리또는구리합금의부식방지법 | |
KR920700187A (ko) | 카르복실산의 제조방법 | |
EP0753989A1 (en) | Coatings and methods, especially for circuit boards | |
DE59610445D1 (de) | Drahtbeschichtungsmittel sowie verfahren zu dessen herstellung | |
KR930004239A (ko) | 카르보닐 화합물의 수소화에 의한 알코올 제조방법 | |
KR960008153B1 (ko) | 금속 공작용 표면 처리제 | |
US20030118742A1 (en) | Method for enhancing the solderability of a surface | |
KR20100014302A (ko) | 구리 표면 처리제 및 표면 처리 방법 | |
JPH0779061A (ja) | 銅および銅合金の表面処理剤 | |
US5741432A (en) | Stabilized nitric acid compositions | |
JP2692029B2 (ja) | はんだ付用フラックス | |
JPH0525407A (ja) | プリント配線板用表面保護剤 | |
JP3677990B2 (ja) | 封孔処理剤 | |
JPH0871787A (ja) | 液状フラックス及びはんだ付け方法 | |
JP2003129254A (ja) | 銅及び銅合金の表面処理剤 | |
JPH05230674A (ja) | 金属の表面処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |