KR940012509A - 전자기기용 칩(chip)의 보호막 제조방법 - Google Patents
전자기기용 칩(chip)의 보호막 제조방법 Download PDFInfo
- Publication number
- KR940012509A KR940012509A KR1019920022877A KR920022877A KR940012509A KR 940012509 A KR940012509 A KR 940012509A KR 1019920022877 A KR1019920022877 A KR 1019920022877A KR 920022877 A KR920022877 A KR 920022877A KR 940012509 A KR940012509 A KR 940012509A
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- manufacturing
- electronic device
- protection film
- protective film
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 230000001681 protective effect Effects 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims abstract 2
- 238000007650 screen-printing Methods 0.000 claims abstract 2
- 238000010923 batch production Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Printing Methods (AREA)
- Formation Of Insulating Films (AREA)
Abstract
본 발명은 전자기기에 사용되는 칩(CHIP)의 보호막을 형성시키는데 있어 실크스크린 인쇄방법으로 일괄제작하므로 생산성을 향상시킴은 물론 정밀성을 높일 수 있도록 한 유용한 발명인 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발며의 일예의 사용 상태도.
Claims (1)
- 웨이퍼(Waper)(2)의 상면에 다수의 칩(CHIP)(1)이 형성된 공지의 것에 있어서, 상기 다수의 칩(1)의 양측에 형성되는 보호막(3)을 실크스크린 인쇄방법으로 전체적으로 도포시키는 TV, VCR용 칩(CHIP)의 보호막 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920022877A KR960002068B1 (ko) | 1992-11-30 | 1992-11-30 | 전자기기용 칩(chip)의 보호막 제조방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019920022877A KR960002068B1 (ko) | 1992-11-30 | 1992-11-30 | 전자기기용 칩(chip)의 보호막 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940012509A true KR940012509A (ko) | 1994-06-23 |
| KR960002068B1 KR960002068B1 (ko) | 1996-02-10 |
Family
ID=19344331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920022877A KR960002068B1 (ko) | 1992-11-30 | 1992-11-30 | 전자기기용 칩(chip)의 보호막 제조방법 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR960002068B1 (ko) |
-
1992
- 1992-11-30 KR KR1019920022877A patent/KR960002068B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960002068B1 (ko) | 1996-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| G160 | Decision to publish patent application | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20020131 Year of fee payment: 9 |
|
| LAPS | Lapse due to unpaid annual fee |