KR960009111B1 - Hybrid ic structure - Google Patents

Hybrid ic structure Download PDF

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Publication number
KR960009111B1
KR960009111B1 KR93019488A KR930019488A KR960009111B1 KR 960009111 B1 KR960009111 B1 KR 960009111B1 KR 93019488 A KR93019488 A KR 93019488A KR 930019488 A KR930019488 A KR 930019488A KR 960009111 B1 KR960009111 B1 KR 960009111B1
Authority
KR
South Korea
Prior art keywords
hybrid
heat sink
reliability
leads
substrate
Prior art date
Application number
KR93019488A
Other languages
Korean (ko)
Other versions
KR950010046A (en
Inventor
Won-Jo Lee
Original Assignee
Lg Electronic Components Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Electronic Components Co filed Critical Lg Electronic Components Co
Priority to KR93019488A priority Critical patent/KR960009111B1/en
Publication of KR950010046A publication Critical patent/KR950010046A/en
Application granted granted Critical
Publication of KR960009111B1 publication Critical patent/KR960009111B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The structure of hybrid IC is provided to increase productivity and reliability by forming a heat sink projection, and comprises several heat sink projections(4) below the substrate(1) on which a component(2) and leads(3) are fixed.
KR93019488A 1993-09-23 1993-09-23 Hybrid ic structure KR960009111B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR93019488A KR960009111B1 (en) 1993-09-23 1993-09-23 Hybrid ic structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR93019488A KR960009111B1 (en) 1993-09-23 1993-09-23 Hybrid ic structure

Publications (2)

Publication Number Publication Date
KR950010046A KR950010046A (en) 1995-04-26
KR960009111B1 true KR960009111B1 (en) 1996-07-10

Family

ID=19364409

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93019488A KR960009111B1 (en) 1993-09-23 1993-09-23 Hybrid ic structure

Country Status (1)

Country Link
KR (1) KR960009111B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3368451B2 (en) * 1995-03-17 2003-01-20 富士通株式会社 Circuit board manufacturing method and circuit inspection device

Also Published As

Publication number Publication date
KR950010046A (en) 1995-04-26

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