KR940012412A - 칩 배리스터 및 그 제조방법 - Google Patents

칩 배리스터 및 그 제조방법 Download PDF

Info

Publication number
KR940012412A
KR940012412A KR1019930025114A KR930025114A KR940012412A KR 940012412 A KR940012412 A KR 940012412A KR 1019930025114 A KR1019930025114 A KR 1019930025114A KR 930025114 A KR930025114 A KR 930025114A KR 940012412 A KR940012412 A KR 940012412A
Authority
KR
South Korea
Prior art keywords
pair
varistor
electrodes
varistor element
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1019930025114A
Other languages
English (en)
Korean (ko)
Inventor
슈이치 오나부타
Original Assignee
사토오 히로시
티 디 케이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4313441A external-priority patent/JPH06163208A/ja
Priority claimed from JP4313442A external-priority patent/JPH06163212A/ja
Application filed by 사토오 히로시, 티 디 케이 가부시키가이샤 filed Critical 사토오 히로시
Publication of KR940012412A publication Critical patent/KR940012412A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C10/00Adjustable resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102Varistor boundary, e.g. surface layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
KR1019930025114A 1992-11-24 1993-11-24 칩 배리스터 및 그 제조방법 Abandoned KR940012412A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP92-313442 1992-11-24
JP4313441A JPH06163208A (ja) 1992-11-24 1992-11-24 チップバリスタの製造方法
JP92-313441 1992-11-24
JP4313442A JPH06163212A (ja) 1992-11-24 1992-11-24 チップバリスタ

Publications (1)

Publication Number Publication Date
KR940012412A true KR940012412A (ko) 1994-06-23

Family

ID=26567560

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930025114A Abandoned KR940012412A (ko) 1992-11-24 1993-11-24 칩 배리스터 및 그 제조방법

Country Status (6)

Country Link
US (1) US5455555A (enExample)
EP (1) EP0603565B1 (enExample)
KR (1) KR940012412A (enExample)
CN (1) CN1035578C (enExample)
DE (1) DE69324896T2 (enExample)
TW (1) TW230255B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100747919B1 (ko) * 2000-03-07 2007-08-08 레이캡 코포레이션 배리스터 물질의 웨이퍼를 포함하는 과전압 방지 장치 및 하우징에 클립을 설치하는 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5742223A (en) 1995-12-07 1998-04-21 Raychem Corporation Laminar non-linear device with magnetically aligned particles
DE69703482T2 (de) * 1996-02-29 2001-05-03 The Whitaker Corp., Wilmington Nicht-ohmische energiekupplung zur reduzierung des übersprechens
US7705708B2 (en) * 2005-04-01 2010-04-27 Tdk Corporation Varistor and method of producing the same
CN102881389B (zh) * 2012-09-28 2015-07-08 广东风华高新科技股份有限公司 压敏电阻器及其制备方法
KR20200037511A (ko) * 2018-10-01 2020-04-09 삼성전기주식회사 바리스터

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013994B2 (enExample) * 1972-08-05 1975-05-23
JPS6032359B2 (ja) * 1980-08-27 1985-07-27 株式会社東芝 電荷転送デバイス
JPS58192745A (ja) * 1982-05-06 1983-11-10 Ngk Spark Plug Co Ltd セラミツク部品の研磨方法
JPS6048251A (ja) * 1983-08-24 1985-03-15 Tipton Mfg Corp 乾式バレル研磨法
JPS60143620A (ja) * 1983-12-29 1985-07-29 松下電器産業株式会社 積層セラミツク電子部品の製造法
JPS6237525A (ja) * 1985-08-09 1987-02-18 Fuji Tool & Die Co Ltd 液圧クラツチ装置のピストン機構
JPS62102968A (ja) * 1985-10-29 1987-05-13 Hitachi Shonan Denshi Kk 部品の面と角部仕上げ加工法
NL8503142A (nl) * 1985-11-15 1987-06-01 Philips Nv N-type geleidend keramisch elektrisch onderdeel met contactlagen.
JPS637264A (ja) * 1986-06-26 1988-01-13 Toshiba Corp セラミツクス部品の製造方法
US4706060A (en) * 1986-09-26 1987-11-10 General Electric Company Surface mount varistor
US4785276A (en) * 1986-09-26 1988-11-15 General Electric Company Voltage multiplier varistor
JPS63312809A (ja) * 1987-06-17 1988-12-21 Toshiba Corp セラミックス製品の製造方法
JPH01177967A (ja) * 1987-12-30 1989-07-14 Hoya Corp 無機硬質体のバレル研磨方法
JPH01234158A (ja) * 1988-03-16 1989-09-19 Matsushita Electric Ind Co Ltd 積層セラミック体の製造方法
JP2623657B2 (ja) * 1988-03-16 1997-06-25 松下電器産業株式会社 積層セラミック体の製造方法
JPH029566A (ja) * 1988-06-29 1990-01-12 Murata Mfg Co Ltd バレル研摩用メディアとそれを使用したセラミック成形体の研摩方法
DE3930000A1 (de) * 1988-09-08 1990-03-15 Murata Manufacturing Co Varistor in schichtbauweise
JPH0322883A (ja) * 1989-06-16 1991-01-31 Yoshiro Sato 磁力誘導型動力発生装置
JPH0322884A (ja) * 1989-06-19 1991-01-31 Tsuyoshi Tanaka 熱エネルギーを力学的エネルギーに変換する方法及び熱機関
JPH0426762A (ja) * 1990-05-17 1992-01-29 Rohm Co Ltd 真空容器における回転導入機構
JPH04118901A (ja) * 1990-09-10 1992-04-20 Komatsu Ltd 正特性サーミスタおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100747919B1 (ko) * 2000-03-07 2007-08-08 레이캡 코포레이션 배리스터 물질의 웨이퍼를 포함하는 과전압 방지 장치 및 하우징에 클립을 설치하는 방법

Also Published As

Publication number Publication date
CN1035578C (zh) 1997-08-06
DE69324896D1 (de) 1999-06-17
EP0603565B1 (en) 1999-05-12
EP0603565A2 (en) 1994-06-29
EP0603565A3 (en) 1995-04-12
US5455555A (en) 1995-10-03
CN1089056A (zh) 1994-07-06
TW230255B (enExample) 1994-09-11
DE69324896T2 (de) 1999-12-02

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19931124

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19970318

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19931124

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19990616

Patent event code: PE09021S01D

PC1902 Submission of document of abandonment before decision of registration
SUBM Surrender of laid-open application requested