KR940010173A - 웨이퍼 수납용기 및 웨이퍼 정렬장치 - Google Patents

웨이퍼 수납용기 및 웨이퍼 정렬장치 Download PDF

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Publication number
KR940010173A
KR940010173A KR1019930020485A KR930020485A KR940010173A KR 940010173 A KR940010173 A KR 940010173A KR 1019930020485 A KR1019930020485 A KR 1019930020485A KR 930020485 A KR930020485 A KR 930020485A KR 940010173 A KR940010173 A KR 940010173A
Authority
KR
South Korea
Prior art keywords
container
wafer
opening
disposed
side walls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019930020485A
Other languages
English (en)
Korean (ko)
Inventor
가쓰미 이시이
마사오 다키가와
Original Assignee
이노우에 아키라
도오교오 에레구토론 가부시끼가이샤
이노우에 다케시
도오교오 에레구토론 도오호쿠 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이노우에 아키라, 도오교오 에레구토론 가부시끼가이샤, 이노우에 다케시, 도오교오 에레구토론 도오호쿠 가부시끼가이샤 filed Critical 이노우에 아키라
Publication of KR940010173A publication Critical patent/KR940010173A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
KR1019930020485A 1992-10-05 1993-10-05 웨이퍼 수납용기 및 웨이퍼 정렬장치 Withdrawn KR940010173A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP92-288194 1992-10-05
JP92-288195 1992-10-05
JP28819492 1992-10-05
JP28819592 1992-10-05

Publications (1)

Publication Number Publication Date
KR940010173A true KR940010173A (ko) 1994-05-24

Family

ID=26557067

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930020485A Withdrawn KR940010173A (ko) 1992-10-05 1993-10-05 웨이퍼 수납용기 및 웨이퍼 정렬장치

Country Status (3)

Country Link
US (1) US5468112A (https=)
KR (1) KR940010173A (https=)
TW (1) TW245823B (https=)

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Publication number Priority date Publication date Assignee Title
US5636960A (en) * 1992-07-29 1997-06-10 Tokyo Electron Limited Apparatus for detecting and aligning a substrate
US5527390A (en) * 1993-03-19 1996-06-18 Tokyo Electron Kabushiki Treatment system including a plurality of treatment apparatus
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US6833035B1 (en) * 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
US5538385A (en) * 1994-06-24 1996-07-23 Kensington Laboratories, Inc. Specimen carrier holder and method of operating it
JPH08213446A (ja) * 1994-12-08 1996-08-20 Tokyo Electron Ltd 処理装置
DE59611078D1 (de) 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
JP3478364B2 (ja) * 1995-06-15 2003-12-15 株式会社日立国際電気 半導体製造装置
US6942738B1 (en) 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US6723174B2 (en) 1996-03-26 2004-04-20 Semitool, Inc. Automated semiconductor processing system
US5788304A (en) * 1996-05-17 1998-08-04 Micron Technology, Inc. Wafer carrier having both a rigid structure and resistance to corrosive environments
US6645355B2 (en) 1996-07-15 2003-11-11 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
US6091498A (en) * 1996-07-15 2000-07-18 Semitool, Inc. Semiconductor processing apparatus having lift and tilt mechanism
JPH10107122A (ja) * 1996-10-01 1998-04-24 Tokyo Electron Ltd 被処理基板カセットの搬入装置
US6395363B1 (en) * 1996-11-05 2002-05-28 Applied Materials, Inc. Sloped substrate support
JPH10147432A (ja) * 1996-11-20 1998-06-02 Tokyo Electron Ltd カセットチャンバ
US6540466B2 (en) * 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
JP3977485B2 (ja) * 1997-04-24 2007-09-19 東京エレクトロン株式会社 アームアクセス位置検出方法及び真空処理装置
US6133121A (en) * 1997-10-15 2000-10-17 Kabushiki Kaisha Toshiba Apparatus for supporting semiconductor wafers and semiconductor wafer processing method using supporting apparatus
US6079927A (en) * 1998-04-22 2000-06-27 Varian Semiconductor Equipment Associates, Inc. Automated wafer buffer for use with wafer processing equipment
US6053694A (en) * 1998-06-26 2000-04-25 H-Square Corporation Rotatable wafer handler with retractable stops
JP3664897B2 (ja) 1998-11-18 2005-06-29 東京エレクトロン株式会社 縦型熱処理装置
EP1332349A4 (en) * 2000-07-07 2008-12-17 Semitool Inc AUTOMATED PROCESSING SYSTEM
US6709522B1 (en) * 2000-07-11 2004-03-23 Nordson Corporation Material handling system and methods for a multichamber plasma treatment system
CN1608308A (zh) * 2001-11-13 2005-04-20 Fsi国际公司 微型电子基片的自动化加工用的减少占地的工具
US20030219986A1 (en) * 2002-05-22 2003-11-27 Applied Materials, Inc. Substrate carrier for processing substrates
US20030217693A1 (en) * 2002-05-22 2003-11-27 Applied Materials, Inc. Substrate support assembly having an edge protector
EP1548820B1 (en) * 2002-09-11 2010-12-15 Shin-Etsu Polymer Co., Ltd. Substrate-storing container
US7462011B2 (en) 2004-08-12 2008-12-09 Tokyo Electron Limited Substrate processing system, substrate processing method, sealed container storing apparatus, program for implementing the substrate processing method, and storage medium storing the program
JP2006237559A (ja) * 2005-01-28 2006-09-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4807579B2 (ja) * 2006-09-13 2011-11-02 株式会社ダイフク 基板収納設備及び基板処理設備
JP4756372B2 (ja) * 2006-09-13 2011-08-24 株式会社ダイフク 基板処理方法
JP2011035103A (ja) * 2009-07-31 2011-02-17 Tokyo Electron Ltd 搬送装置及び処理システム
JP6531642B2 (ja) * 2015-12-24 2019-06-19 株式会社ダイフク 物品搬送設備

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61273441A (ja) * 1985-05-23 1986-12-03 Canon Inc ウエハ搬送装置
JPS636857A (ja) * 1986-06-26 1988-01-12 Fujitsu Ltd ウエ−ハ移し替え装置
JPS6361140U (https=) * 1986-10-11 1988-04-22
JPS63140523A (ja) * 1986-12-03 1988-06-13 Hitachi Ltd 処理装置
US4895486A (en) * 1987-05-15 1990-01-23 Roboptek, Inc. Wafer monitoring device
US5064337A (en) * 1988-07-19 1991-11-12 Tokyo Electron Limited Handling apparatus for transferring carriers and a method of transferring carriers
JP2733674B2 (ja) * 1988-12-29 1998-03-30 株式会社ディスコ ウエーハ塔載フレームのプリアライメント方法
JP2905857B2 (ja) * 1989-08-11 1999-06-14 東京エレクトロン株式会社 縦型処理装置
US5183378A (en) * 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers
JP2694216B2 (ja) * 1990-03-20 1997-12-24 東京エレクトロン株式会社 ウエハ処理方法およびウエハ処理装置
US5181819A (en) * 1990-10-09 1993-01-26 Tokyo Electron Sagami Limited Apparatus for processing semiconductors
JPH04154144A (ja) * 1990-10-18 1992-05-27 Fujitsu Ltd 基板入出機構

Also Published As

Publication number Publication date
TW245823B (https=) 1995-04-21
US5468112A (en) 1995-11-21

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000