KR940006228A - 와이어 본딩장치의 모터제어회로 - Google Patents

와이어 본딩장치의 모터제어회로 Download PDF

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Publication number
KR940006228A
KR940006228A KR1019930014424A KR930014424A KR940006228A KR 940006228 A KR940006228 A KR 940006228A KR 1019930014424 A KR1019930014424 A KR 1019930014424A KR 930014424 A KR930014424 A KR 930014424A KR 940006228 A KR940006228 A KR 940006228A
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South Korea
Prior art keywords
motor
wire bonding
control circuit
motor control
bonding device
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KR1019930014424A
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English (en)
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KR960015926B1 (ko
Inventor
도오루 모치다
요시미츠 데라카도
히지리 하야시
Original Assignee
아라이 가주오
가부시키가이샤 신가와 아라이 가즈오
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Publication of KR940006228A publication Critical patent/KR940006228A/ko
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Publication of KR960015926B1 publication Critical patent/KR960015926B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Control Of Stepping Motors (AREA)

Abstract

동작상태가 변화하여도 모터를 원할하게 또한 안정하게 동작제어시킬 수가 있고, 품질의 안정된 와이어본딩을 행할수가 있다.
Z축모터(15)를 구동하는 합성 신호(g')의 피이드백제어를 행하는 피이드백게인회로(47)를 설치하고, 이 피이드백게인회로(45)의 게인 값을 컴퓨터(47)에 의하여 제어한다(제1도).

Description

와이어 본딩장치의 모터제어회로
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 와이어 본딩장치의 Z축 모터제어회로의 일실시예를 도시한 회로블록도,
제2도(a)는 Z축 모터를 회전시키는 Z축 속도지령 곡선도, (b)는 캐필러리의 Z축의 궤적도, (c)는 Z축 하중을 도시한도, (d)이상 상태에 있어서 엔코우더의 출력 파형도, (e)는 종래예의 경우의 엔코우더의 출력 파형도, (f)는 본 실시예의 경우의 엔코우더의 출력 파형도,
제4도는 (a)내지 (g)는 일반적인 와이어본딩 방법의 공정도,
제5도는 와이어 본딩장치의 일예를 도시한 측면도.

Claims (1)

  1. Z축 모터에 의하여 캐필러리를 상하로 구동시키며, 또 X축 모터 및 Y축모터에 의하여 XY테이블을 구동시켜서 캐필러리를 XY방향으로 이동시키는 와이어 본딩장치에 있어서, Z축모터 또는 X축모터와 Y축모터의 적어도 한쪽의 모터를 구동하는 펄스신호의 피이드백제어를 행하는 피이드백게인회로를 설치하고, 이 피이드벡게인회로의 게인 값을 컴퓨터에 의하여 제어하는 것을 특징으로 하는 와이어 본딩장치의 모터제어회로.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930014424A 1992-08-04 1993-07-28 와이어 본딩장치의 모터제어회로 KR960015926B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-227974 1992-08-04
JP4227974A JP3005781B2 (ja) 1992-08-04 1992-08-04 ワイヤボンデイング装置のモータ制御回路

Publications (2)

Publication Number Publication Date
KR940006228A true KR940006228A (ko) 1994-03-23
KR960015926B1 KR960015926B1 (ko) 1996-11-23

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Application Number Title Priority Date Filing Date
KR1019930014424A KR960015926B1 (ko) 1992-08-04 1993-07-28 와이어 본딩장치의 모터제어회로

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US (1) US5485063A (ko)
JP (1) JP3005781B2 (ko)
KR (1) KR960015926B1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10268939A (ja) * 1997-03-24 1998-10-09 Shinkawa Ltd Ｄｃモータ位置制御回路及びその方法
JP2001156103A (ja) * 1999-11-30 2001-06-08 Shinkawa Ltd ワイヤボンディング装置
US7513537B2 (en) * 2003-10-22 2009-04-07 Frank's Casing Crew & Rental Tools, Inc. Tubular connection with slotted threads

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH596940A5 (ko) * 1976-10-01 1978-03-31 Charmilles Sa Ateliers
US4817848A (en) * 1988-05-12 1989-04-04 Hughes Aircraft Company Compliant motion servo
JP2755667B2 (ja) * 1989-03-27 1998-05-20 株式会社東芝 モータ駆動回路及びワイヤボンディング装置
JPH081920B2 (ja) * 1990-06-08 1996-01-10 株式会社東芝 ワイヤボンディング装置
JP2549191B2 (ja) * 1990-09-10 1996-10-30 株式会社日立製作所 ワイヤボンディング方法、およびその装置
JP2558976B2 (ja) * 1991-11-08 1996-11-27 松下電器産業株式会社 電子部品の電極とリードとの接合方法
US5238174A (en) * 1991-11-15 1993-08-24 Kulicke And Soffa Investments, Inc. Smart indexing head for universal lead frame work station
JP2990550B2 (ja) * 1991-12-10 1999-12-13 株式会社新川 ボンデイングワイヤ検査装置
US5310982A (en) * 1993-04-26 1994-05-10 Hobart Brothers Company T-joint welding fixture

Also Published As

Publication number Publication date
KR960015926B1 (ko) 1996-11-23
US5485063A (en) 1996-01-16
JPH0661294A (ja) 1994-03-04
JP3005781B2 (ja) 2000-02-07

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