KR940003006A - 다층 리드프레임용 플레인 지지체 - Google Patents

다층 리드프레임용 플레인 지지체 Download PDF

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Publication number
KR940003006A
KR940003006A KR1019930013644A KR930013644A KR940003006A KR 940003006 A KR940003006 A KR 940003006A KR 1019930013644 A KR1019930013644 A KR 1019930013644A KR 930013644 A KR930013644 A KR 930013644A KR 940003006 A KR940003006 A KR 940003006A
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South Korea
Prior art keywords
plane
support
lead frame
multilayer
lead
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KR1019930013644A
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English (en)
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KR970011622B1 (ko
Inventor
히로후미 후지이
요시끼 다께다
미쓰하루 시미즈
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이노우에 사다오
신꼬오 덴기 고오교오 가부시끼가이샤
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Publication of KR940003006A publication Critical patent/KR940003006A/ko
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Publication of KR970011622B1 publication Critical patent/KR970011622B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49534—Multi-layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49527—Additional leads the additional leads being a multilayer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

리드프레임에 대해서 전원플레인, 접지플레인등을 용이하게 또 확실하게 위치맞춤하여 효율적으로 또한 용이하게 다층리드프레임을 제조하는 것을 목적으로 하고, 그 구성은 복수의 리드프레임을 갖는 단책상으로 형성한 리드프레임 지지체와 위치맞춤하고 적층하여 서로 접합함으로써 다층으로 형성하는 다층리드프레임용 플레인 지지체 이고 상기 리드프레임 지지체에 형성한 각자의 리드프레임의 위치에 맞추어 전원플레인(14) 또는 접지플레인등의 다층리드프레임을 구성하는 플레인을 사이드레일(10a, 10b)로 지지하여 단책상으로 형성한 것을 특징으로 한다.

Description

다층 리드프레임용 플레인 지지체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 접지플레인 지지체의 일실시예를 나타낸 설명도,
제3도는 리드프레임 지지체의 일실시예를 나타낸 설명도.

Claims (12)

  1. 복수의 리드프레임을 갖는 단책상으로 형성한 리드프레임 지지체와 위치 맞춤하여 적층하여 서로 접합시킴으로써 다층으로 형성하는 다층리드프레임용 플레인 지지체이고 상기 리드프레임 지지체에 형성한 각각의 리드프레임의 위치에 맞추어 전원 플레인 또는 접지플레인등의 다층리드프레임을 구성하는 플레인을 사이드레일로 지지하여 단책상으로 형성한 것을 특징으로 하는 다층리드프레인용 플레인 지지체.
  2. 제1항에 있어서, 상기 플레인 지지체의 폭사이즈를 리드프레임 지지체의 폭사이즈 보다도 넓은 폭으로 형성한 것을 특징으로 하는 다층리드프레임용 플레인 지지체.
  3. 제1항 또는 제2항에 있어서, 상기 플레인을 서포트바아를 거쳐서 사이드레일에 연결하여 지지하고 상기 서포트바아에 사이드레일등의 불필요부를 븐러 제거하기 위한 절리부를 설비한 것을 특징으로 하는 다층리드프레임용 플레인 지지체.
  4. 제3항에 있어서, 상기 서포트바아차 플레인과의 연결부의 기부에 상기 플레인쪽이 凹요부로 되는 절결부를 설비하고 절리부의 절리위치와 상기 플레인의 외형선위치를 일치시킨 것을 특징으로 하는 다층리드 프레임용 플레인 지지체.
  5. 제1항 또는 제2항에 있어서, 상기 플레인을 서포트바아를 거쳐서 사이드레일에 연결하여 지지하는 동시에 인접하는 플레인간에서 사이드레일간에 걸치게 연결하는 섹션바아를 설비하고 상기 서포트바아와 섹션바아의 각각의 섹션바아, 사이드레일등의 불필요부를 분리제거하기 위한 절비루를 설비한 것을 특징으로 하는 다층리드프레임용 플레인 지지체.
  6. 제5항에 있어서, 상기 섹션바아의 절리부의 도중에 절리선 방향에 맞추어 슬롯구멍을 설비한 것을 특징으로 하는 다층리드프레임용 플레인 지지체.
  7. 제3항에 있어서, 상기 절리부가 하프 에칭 또는 하프컷에 의해서 가는 홈모양으로 형성된 것을 특징으로 하는 다층 리드프레임용 플레인 지지체.
  8. 제3항에 있어서, 상기 절리부가 리드 프레임 지지체로의 접합면과는 반대쪽의 한쪽면위에 형성된 것을 특징으로 하는 다층리드프레임용 플레인 지지체.
  9. 제1항에 있어서, 상기 전원플레인 또는 접지플레인등의 플레인에 리드프레임 지지체의 리드와 접속하기 위한 접속편을 설비한 것을 특징으로 하는 다층 리드 프레임용 플레인 지지체.
  10. 제1항에 있어서, 상기 전원플레인 또는 접지플레인등의 플레인에 층간을 전기적으로 절연하여 접합하기 위한 전기적 절연성을 갖는 접착테이프를 붙인 것을 특징으로 하는 다층리드프레임용 플레인 지지체.
  11. 제1항에 있어서, 상기 전원플레인 또는 접지플레인등의 플레인을 지지하는 사이드 레일에 리드프레임 지지체와 위치맞춤하기 위한 가이드홀을 설비한 것을 특징으로 하는 다층리드프레임용 플레임 지지체.
  12. 제11항에 있어서, 전기적 절연층을 갖는 접착테이프를 위치맞춤하여 붙이기 위한 가이드홀을 상기 리드프레임 지지 체와의 위치맞춤용 가이드홀과는 별개로 상기 사이드레일에 설비한 것을 특징으로 하는 다층리드프레임용 플레인 지지체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930013644A 1992-07-28 1993-07-20 다층 리드프레임용 플레인 지지체 KR970011622B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP92-221942 1992-07-28
JP4221942A JPH0653394A (ja) 1992-07-28 1992-07-28 多層リードフレーム用プレーン支持体

Publications (2)

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KR940003006A true KR940003006A (ko) 1994-02-19
KR970011622B1 KR970011622B1 (ko) 1997-07-12

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KR1019930013644A KR970011622B1 (ko) 1992-07-28 1993-07-20 다층 리드프레임용 플레인 지지체

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Country Link
US (1) US5410180A (ko)
EP (1) EP0581588B1 (ko)
JP (1) JPH0653394A (ko)
KR (1) KR970011622B1 (ko)
DE (1) DE69319283T2 (ko)

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JPH0653394A (ja) 1994-02-25
US5410180A (en) 1995-04-25
DE69319283D1 (de) 1998-07-30
EP0581588B1 (en) 1998-06-24
DE69319283T2 (de) 1998-11-05
EP0581588A1 (en) 1994-02-02
KR970011622B1 (ko) 1997-07-12

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