KR940001333A - 수지봉합형 고체촬상소자 패키지 및 그 제조방법 - Google Patents

수지봉합형 고체촬상소자 패키지 및 그 제조방법 Download PDF

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Publication number
KR940001333A
KR940001333A KR1019920010430A KR920010430A KR940001333A KR 940001333 A KR940001333 A KR 940001333A KR 1019920010430 A KR1019920010430 A KR 1019920010430A KR 920010430 A KR920010430 A KR 920010430A KR 940001333 A KR940001333 A KR 940001333A
Authority
KR
South Korea
Prior art keywords
lead
chip
resin
semiconductor chip
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019920010430A
Other languages
English (en)
Korean (ko)
Inventor
허기록
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019920010430A priority Critical patent/KR940001333A/ko
Priority to TW82103391A priority patent/TW222713B/zh
Priority to JP12603093A priority patent/JPH0653462A/ja
Priority to DE19934319786 priority patent/DE4319786A1/de
Publication of KR940001333A publication Critical patent/KR940001333A/ko
Priority to US08/337,016 priority patent/US5534725A/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019920010430A 1992-06-16 1992-06-16 수지봉합형 고체촬상소자 패키지 및 그 제조방법 Ceased KR940001333A (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1019920010430A KR940001333A (ko) 1992-06-16 1992-06-16 수지봉합형 고체촬상소자 패키지 및 그 제조방법
TW82103391A TW222713B (https=) 1992-06-16 1993-04-30
JP12603093A JPH0653462A (ja) 1992-06-16 1993-05-27 樹脂封合形固体撮像素子パッケージおよびその製造方法
DE19934319786 DE4319786A1 (de) 1992-06-16 1993-06-15 In Kunststoff gegossene CCD-Einheit und Verfahren zu deren Herstellung
US08/337,016 US5534725A (en) 1992-06-16 1994-11-07 Resin molded charge coupled device package and method for preparation thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920010430A KR940001333A (ko) 1992-06-16 1992-06-16 수지봉합형 고체촬상소자 패키지 및 그 제조방법

Publications (1)

Publication Number Publication Date
KR940001333A true KR940001333A (ko) 1994-01-11

Family

ID=19334753

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920010430A Ceased KR940001333A (ko) 1992-06-16 1992-06-16 수지봉합형 고체촬상소자 패키지 및 그 제조방법

Country Status (4)

Country Link
JP (1) JPH0653462A (https=)
KR (1) KR940001333A (https=)
DE (1) DE4319786A1 (https=)
TW (1) TW222713B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100806774B1 (ko) * 2007-05-16 2008-02-22 주식회사 펠릭스정보통신 Ａｃ/ｄｃ 변환기 및 이를 이용한 ａｃ/ｄｃ 변환 방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19816309B4 (de) * 1997-04-14 2008-04-03 CiS Institut für Mikrosensorik gGmbH Verfahren zur Direktmontage von Silizium-Sensoren und danach hergestellte Sensoren
DE19724026A1 (de) * 1997-06-06 1998-12-10 Siemens Ag Drucksensor-Bauelement und Verfahren zur Herstellung
US6274927B1 (en) 1999-06-03 2001-08-14 Amkor Technology, Inc. Plastic package for an optical integrated circuit device and method of making
KR100396702B1 (ko) * 2001-01-15 2003-09-03 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조방법
US6861720B1 (en) 2001-08-29 2005-03-01 Amkor Technology, Inc. Placement template and method for placing optical dies
US6784534B1 (en) 2002-02-06 2004-08-31 Amkor Technology, Inc. Thin integrated circuit package having an optically transparent window
EP1625627A2 (de) * 2003-05-19 2006-02-15 X-FAB Semiconductor Foundries AG Herstellen eines in kunststoff eingekapselten optoelektronischen bauelementes und zugehörige verfahren
DE10322751B3 (de) * 2003-05-19 2004-09-30 X-Fab Semiconductor Foundries Ag Verfahren zur Herstellung eines in Kunststoff verschlossenen optoelektronischen Bauelementes
GB0412436D0 (en) * 2004-06-04 2004-07-07 Melexis Nv Semiconductor package with transparent lid
WO2008082565A1 (en) * 2006-12-29 2008-07-10 Tessera, Inc. Microelectronic devices and methods of manufacturing such devices
US11699647B2 (en) 2021-04-15 2023-07-11 Infineon Technologies Ag Pre-molded lead frames for semiconductor packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812420A (en) * 1986-09-30 1989-03-14 Mitsubishi Denki Kabushiki Kaisha Method of producing a semiconductor device having a light transparent window
DE8808815U1 (de) * 1988-06-23 1988-09-15 Heimann Optoelectronics Gmbh, 65199 Wiesbaden Infrarotdetektor
JPH02143466A (ja) * 1988-11-25 1990-06-01 Mitsubishi Electric Corp 半導体装置の製造方法
KR930010072B1 (ko) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd패키지 및 그 제조방법
KR940002444B1 (ko) * 1990-11-13 1994-03-24 금성일렉트론 주식회사 반도체 소자의 패키지 어셈블리 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100806774B1 (ko) * 2007-05-16 2008-02-22 주식회사 펠릭스정보통신 Ａｃ/ｄｃ 변환기 및 이를 이용한 ａｃ/ｄｃ 변환 방법

Also Published As

Publication number Publication date
DE4319786A1 (de) 1993-12-23
TW222713B (https=) 1994-04-21
JPH0653462A (ja) 1994-02-25

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