KR930008193A - 실리콘 괴(塊)의 세정방법 - Google Patents
실리콘 괴(塊)의 세정방법 Download PDFInfo
- Publication number
- KR930008193A KR930008193A KR1019920020055A KR920020055A KR930008193A KR 930008193 A KR930008193 A KR 930008193A KR 1019920020055 A KR1019920020055 A KR 1019920020055A KR 920020055 A KR920020055 A KR 920020055A KR 930008193 A KR930008193 A KR 930008193A
- Authority
- KR
- South Korea
- Prior art keywords
- cleaning
- silicon ingot
- acid
- silicon
- pickling
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract 19
- 229910052710 silicon Inorganic materials 0.000 title claims abstract 19
- 239000010703 silicon Substances 0.000 title claims abstract 19
- 238000000034 method Methods 0.000 title claims abstract 11
- 238000004821 distillation Methods 0.000 claims abstract description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract 12
- 239000007788 liquid Substances 0.000 claims abstract 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract 6
- 239000002253 acid Substances 0.000 claims abstract 6
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract 6
- 239000002699 waste material Substances 0.000 claims abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract 4
- 238000005406 washing Methods 0.000 claims abstract 4
- 238000001816 cooling Methods 0.000 claims abstract 3
- 238000001556 precipitation Methods 0.000 claims abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract 2
- 239000000377 silicon dioxide Substances 0.000 claims abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 6
- 238000005554 pickling Methods 0.000 claims 5
- 239000012498 ultrapure water Substances 0.000 claims 2
- 230000000717 retained effect Effects 0.000 claims 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/08—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02046—Dry cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Silicon Compounds (AREA)
- Heat Treatment Of Water, Waste Water Or Sewage (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 발명은, 산세정액으로 실리콘괴를 세정하는 방법에 있어서, 질산과 불화수소산의 혼합산으로 이루어지는 세정액을 증류공정에 도입하고, 증류냉각부에 불화수소산을 도입하여 이산규소의 석출을 방지하는 것에 의해 세정폐액으로부터 질산을 증류회수해서 실리콘괴를 세정하는 방법을 개시한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명을 실시하는 증류장치의 한가지 예를 나타내는 개략단면도.
Claims (6)
- 질산과 불화수소산의 혼합산으로 이루어지는 세정액을 사용하여 실리콘괴를 산세정하는 방법에 있어서, 상기한 세정액에 의한 세정 후에 세정폐액을 증류공정으로 도입하고, 증류냉각부에 불화수소산을 도입하여 이산화규소의 석출을 방지하는 것에 의해 상기한 세정페액으로 부터 질산을 증류회수해서 실리콘괴를 세정하는 실리콘괴의 세정방법.
- 제1항에 있어서, 세정폐액으로부터 회수한 질산을 상기한 세정액에 첨가하여 재사용하는 실리콘괴의 세정방법.
- 제1항에 있어서, 상기한 증류냉각부에 소량의 불화수소산을 연속적으로 유입시키면서 세정폐액을 연속적으로 증류하는 실리콘괴의 세정방법.
- 제1항에 있어서, 상기한 산세정의 후에, 세정폐액을 증류공정으로 도입하는 한편, 세정한 실리콘괴를 고순도의 수증기중에 보전유지하면서 그 실리콘괴 표면에 생간 응결수에 의해 그 실리콘괴 표면에 잔류한 산을 세정 제거하는 실리콘괴의 세정방법.
- 질산과 불화수소산의 혼합산으로 이루어지는 세정액을 사용하여 실리콘괴를 산세정하는 방법에 있어서, 산세정의 후에, 세정한 실리콘괴를 고순도의 수증기중에 보전유지하여서 그 실리콘괴 표면에 생긴 응결수에 의해 그 실리콘괴 표면에 잔류한 산을 세정제거하는 실리콘괴의 세정방법.
- 제1항에 있어서, 상기한 산세정 후, 세정한 실리콘괴를 예비세정공정으로 도입해서, 그 예비세정공정에서 그 실리콘괴를 순수로 침지하고, 이어서 세정한 실리콘괴를 고순도의 수증기중에 보정유지하여서 그 실리콘괴 표면에 생긴 응결수에 의해 그 실리콘괴 표면에 잔류한 산을 세정제거하는 실리콘괴의 세정방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3308268A JPH05121390A (ja) | 1991-10-29 | 1991-10-29 | 酸の除去方法 |
JP91-308268 | 1991-10-29 | ||
JP31148491A JP2949207B2 (ja) | 1991-10-31 | 1991-10-31 | シリコン処理廃液から硝酸を回収、再利用する方法 |
JP91-311484 | 1991-10-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930008193A true KR930008193A (ko) | 1993-05-21 |
KR100230979B1 KR100230979B1 (ko) | 1999-11-15 |
Family
ID=26565475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920020055A KR100230979B1 (ko) | 1991-10-29 | 1992-10-29 | 실리콘괴(塊)의 세정방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5346557A (ko) |
EP (1) | EP0548504B1 (ko) |
JP (1) | JPH05121390A (ko) |
KR (1) | KR100230979B1 (ko) |
DE (1) | DE69217024T2 (ko) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6350425B2 (en) * | 1994-01-07 | 2002-02-26 | Air Liquide America Corporation | On-site generation of ultra-high-purity buffered-HF and ammonium fluoride |
US5846386A (en) * | 1994-01-07 | 1998-12-08 | Startec Ventures, Inc. | On-site ammonia purification for semiconductor manufacture |
WO1996039266A1 (en) * | 1995-06-05 | 1996-12-12 | Startec Ventures, Inc. | On-site generation of ultra-high-purity buffered-hf for semiconductor processing |
US5785820A (en) * | 1994-01-07 | 1998-07-28 | Startec Ventures, Inc. | On-site manufacture of ultra-high-purity hydrofluoric acid for semiconductor processing |
US5496778A (en) * | 1994-01-07 | 1996-03-05 | Startec Ventures, Inc. | Point-of-use ammonia purification for electronic component manufacture |
US5722442A (en) * | 1994-01-07 | 1998-03-03 | Startec Ventures, Inc. | On-site generation of ultra-high-purity buffered-HF for semiconductor processing |
US5846387A (en) * | 1994-01-07 | 1998-12-08 | Air Liquide Electronics Chemicals & Services, Inc. | On-site manufacture of ultra-high-purity hydrochloric acid for semiconductor processing |
DE19522525A1 (de) * | 1994-10-04 | 1996-04-11 | Kunze Concewitz Horst Dipl Phy | Verfahren und Vorrichtung zum Feinstreinigen von Oberflächen |
AU6161896A (en) * | 1995-06-05 | 1997-01-09 | Startec Ventures, Inc. | On-site manufacture of ultra-high-purity hydrofluoric acid f or semiconductor processing |
AU6329096A (en) * | 1995-06-05 | 1996-12-24 | Startec Ventures, Inc. | On-site ammonia purification for semiconductor manufacture |
JPH11506411A (ja) * | 1995-06-05 | 1999-06-08 | スターテック・ベンチャーズ・インコーポレーテッド | 電子部品製造の場合の使用現場でのアンモニアの精製 |
WO1996039264A1 (en) * | 1995-06-05 | 1996-12-12 | Startec Ventures, Inc. | On-site manufacture of ultra-high-purity hydrochloric acid for semiconductor processing |
US6001223A (en) * | 1995-07-07 | 1999-12-14 | Air Liquide America Corporation | On-site ammonia purification for semiconductor manufacture |
US5753567A (en) * | 1995-08-28 | 1998-05-19 | Memc Electronic Materials, Inc. | Cleaning of metallic contaminants from the surface of polycrystalline silicon with a halogen gas or plasma |
US6214173B1 (en) | 1996-06-05 | 2001-04-10 | Air Liquide Electronics Chemicals & Services, Inc. | On-site manufacture of ultra-high-purity nitric acid |
US5843322A (en) * | 1996-12-23 | 1998-12-01 | Memc Electronic Materials, Inc. | Process for etching N, P, N+ and P+ type slugs and wafers |
DE19741465A1 (de) | 1997-09-19 | 1999-03-25 | Wacker Chemie Gmbh | Polykristallines Silicium |
SG92720A1 (en) | 1999-07-14 | 2002-11-19 | Nisso Engineering Co Ltd | Method and apparatus for etching silicon |
TW511180B (en) * | 2000-07-31 | 2002-11-21 | Mitsubishi Chem Corp | Mixed acid solution in etching process, process for producing the same, etching process using the same and process for producing semiconductor device |
JP4826882B2 (ja) * | 2005-05-18 | 2011-11-30 | 株式会社 アイアイエスマテリアル | スクラップシリコンの選別及び分析方法 |
DE102006040830A1 (de) * | 2006-08-31 | 2008-03-06 | Wacker Chemie Ag | Verfahren zur Aufarbeitung einer Ätzmischung, die bei der Herstellung von hochreinem Silicium anfällt |
DE102007031471A1 (de) * | 2007-07-05 | 2009-01-08 | Schott Solar Gmbh | Verfahren zur Aufbereitung von Siliciummaterial |
DE102007039626A1 (de) * | 2007-08-22 | 2009-02-26 | Wacker Chemie Ag | Verfahren zum Reinigen von polykristallinem Silicium |
JP4941415B2 (ja) * | 2007-09-04 | 2012-05-30 | 三菱マテリアル株式会社 | クリーンベンチ |
DE102009054525A1 (de) | 2009-12-10 | 2011-06-16 | Wacker Chemie Ag | Verfahren zur Entfernung von Stickoxiden und Hydrogennitrit aus Säuregemischen |
DE102010040836A1 (de) | 2010-09-15 | 2012-03-15 | Wacker Chemie Ag | Verfahren zur Herstellung von Silicium-Dünnstäben |
DE102010042869A1 (de) | 2010-10-25 | 2012-04-26 | Wacker Chemie Ag | Verfahren zur Herstellung von polykristallinen Siliciumstäben |
CN102134077B (zh) * | 2011-01-25 | 2012-09-05 | 云南乾元光能产业有限公司 | 一种湿法提纯多晶硅的方法 |
CN103215593A (zh) * | 2012-01-19 | 2013-07-24 | 库特勒自动化系统(苏州)有限公司 | 用于处理酸性蚀刻废物体系的回收系统及回收方法 |
DE102013225146A1 (de) | 2013-12-06 | 2014-04-24 | Wacker Chemie Ag | Verfahren zur Herstellung eines Silicium-Dünnstabs |
CN107117753A (zh) * | 2016-02-24 | 2017-09-01 | 浙江东氟塑料科技有限公司 | 一种硅太阳能电池制绒废液回收利用的方法 |
EP3427007B1 (en) * | 2016-03-10 | 2021-11-10 | Defelsko Corporation | Method and system for testing surfaces for contaminants |
KR102415059B1 (ko) * | 2017-04-24 | 2022-06-30 | 가부시키가이샤 도쿠야마 | 다결정 실리콘 파쇄물의 제조 방법 및 다결정 실리콘 파쇄물의 표면 금속 농도를 관리하는 방법 |
EP3901089A4 (en) | 2019-01-25 | 2022-09-28 | Tokuyama Corporation | LUMP OF POLYCRYSTALLINE SILICON, PACKAGING BODY THEREOF AND METHOD FOR ITS MANUFACTURE |
CN111170320B (zh) * | 2019-12-27 | 2021-01-19 | 苏州晶洲装备科技有限公司 | 一种用于多晶硅制绒废酸液回收利用装置和方法 |
CN112537814B (zh) * | 2020-12-31 | 2024-07-23 | 江苏电科环保有限公司 | 含氟硝酸废液的处理系统 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2992080A (en) * | 1958-07-25 | 1961-07-11 | Gen Electric | Method of improving the purity of silicon |
US4186032A (en) * | 1976-09-23 | 1980-01-29 | Rca Corp. | Method for cleaning and drying semiconductors |
US4261791A (en) * | 1979-09-25 | 1981-04-14 | Rca Corporation | Two step method of cleaning silicon wafers |
DE3128979C2 (de) * | 1981-07-22 | 1986-10-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Herstellen von für Solarzellen verwendbarem Silizium |
DE3129009A1 (de) * | 1981-07-22 | 1983-02-10 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von fuer solarzellen verwendbarem silizium |
DE3317286A1 (de) * | 1983-05-11 | 1984-11-22 | Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen | Verfahren zur reinigung von silicium durch saeureeinwirkung |
US4695327A (en) * | 1985-06-13 | 1987-09-22 | Purusar Corporation | Surface treatment to remove impurities in microrecesses |
DE3728693A1 (de) * | 1987-08-27 | 1989-03-09 | Wacker Chemitronic | Verfahren und vorrichtung zum aetzen von halbleiteroberflaechen |
FR2659956B1 (fr) * | 1990-03-21 | 1992-06-26 | Cogema | Procede de traitement d'une solution aqueuse contenant principalement de l'acide nitrique et de l'acide fluorhydrique. |
-
1991
- 1991-10-29 JP JP3308268A patent/JPH05121390A/ja active Pending
-
1992
- 1992-10-28 US US07/967,066 patent/US5346557A/en not_active Expired - Fee Related
- 1992-10-29 KR KR1019920020055A patent/KR100230979B1/ko not_active IP Right Cessation
- 1992-10-29 EP EP92118561A patent/EP0548504B1/en not_active Expired - Lifetime
- 1992-10-29 DE DE69217024T patent/DE69217024T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH05121390A (ja) | 1993-05-18 |
DE69217024D1 (de) | 1997-03-06 |
KR100230979B1 (ko) | 1999-11-15 |
DE69217024T2 (de) | 1997-08-21 |
EP0548504A3 (en) | 1993-12-01 |
EP0548504A2 (en) | 1993-06-30 |
US5346557A (en) | 1994-09-13 |
EP0548504B1 (en) | 1997-01-22 |
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A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |