KR930007518B1 - 반도체장치 - Google Patents

반도체장치 Download PDF

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Publication number
KR930007518B1
KR930007518B1 KR1019840007370A KR840007370A KR930007518B1 KR 930007518 B1 KR930007518 B1 KR 930007518B1 KR 1019840007370 A KR1019840007370 A KR 1019840007370A KR 840007370 A KR840007370 A KR 840007370A KR 930007518 B1 KR930007518 B1 KR 930007518B1
Authority
KR
South Korea
Prior art keywords
header
resin
transistor
main surface
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019840007370A
Other languages
English (en)
Korean (ko)
Other versions
KR850005152A (ko
Inventor
마사오 야마구지
노브가즈 다나가
Original Assignee
가부시기가이샤 히다찌세이사꾸쇼
미쓰다 가쓰시게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 히다찌세이사꾸쇼, 미쓰다 가쓰시게 filed Critical 가부시기가이샤 히다찌세이사꾸쇼
Publication of KR850005152A publication Critical patent/KR850005152A/ko
Application granted granted Critical
Publication of KR930007518B1 publication Critical patent/KR930007518B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019840007370A 1983-12-16 1984-11-24 반도체장치 Expired - Fee Related KR930007518B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58-236154 1983-12-16
JP58236154A JPS60128646A (ja) 1983-12-16 1983-12-16 絶縁型パワートランジスタの製造方法

Publications (2)

Publication Number Publication Date
KR850005152A KR850005152A (ko) 1985-08-21
KR930007518B1 true KR930007518B1 (ko) 1993-08-12

Family

ID=16996560

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840007370A Expired - Fee Related KR930007518B1 (ko) 1983-12-16 1984-11-24 반도체장치

Country Status (3)

Country Link
JP (1) JPS60128646A (https=)
KR (1) KR930007518B1 (https=)
GB (1) GB2151845A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60172346U (ja) * 1984-04-23 1985-11-15 新電元工業株式会社 樹脂密封型半導体装置
JPS61207040U (https=) * 1985-06-17 1986-12-27
JPS62180957U (https=) * 1986-05-06 1987-11-17
JPH079917B2 (ja) * 1987-05-11 1995-02-01 サンケン電気株式会社 樹脂封止型半導体装置の製造方法
JPH0824156B2 (ja) * 1987-05-25 1996-03-06 サンケン電気株式会社 樹脂封止型半導体装置の製造方法
JPH0744194B2 (ja) * 1989-02-17 1995-05-15 サンケン電気株式会社 樹脂封止形半導体装置の製造方法
US5028741A (en) * 1990-05-24 1991-07-02 Motorola, Inc. High frequency, power semiconductor device
JP3598579B2 (ja) * 1995-04-17 2004-12-08 株式会社デンソー 電磁弁ブロック
US20040113240A1 (en) 2002-10-11 2004-06-17 Wolfgang Hauser An electronic component with a leadframe
JP4953205B2 (ja) * 2007-05-01 2012-06-13 三菱電機株式会社 半導体装置
US11602055B2 (en) * 2018-09-04 2023-03-07 Apple Inc. Overmolded components having sub-flush residuals

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS615818Y2 (https=) * 1979-06-07 1986-02-21
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
JPS58143538A (ja) * 1982-02-19 1983-08-26 Matsushita Electronics Corp 樹脂封止形半導体装置の製造方法

Also Published As

Publication number Publication date
GB8429620D0 (en) 1985-01-03
GB2151845A (en) 1985-07-24
KR850005152A (ko) 1985-08-21
JPH0527261B2 (https=) 1993-04-20
JPS60128646A (ja) 1985-07-09

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