KR930002816B1 - 리드프레임의 가공방법 - Google Patents
리드프레임의 가공방법 Download PDFInfo
- Publication number
- KR930002816B1 KR930002816B1 KR1019890017849A KR890017849A KR930002816B1 KR 930002816 B1 KR930002816 B1 KR 930002816B1 KR 1019890017849 A KR1019890017849 A KR 1019890017849A KR 890017849 A KR890017849 A KR 890017849A KR 930002816 B1 KR930002816 B1 KR 930002816B1
- Authority
- KR
- South Korea
- Prior art keywords
- plating
- lead
- circuit pattern
- lead frame
- dam bar
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63308361A JP2648353B2 (ja) | 1988-12-06 | 1988-12-06 | リードフレームの製造方法 |
JP63-308361 | 1988-12-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900010984A KR900010984A (ko) | 1990-07-11 |
KR930002816B1 true KR930002816B1 (ko) | 1993-04-10 |
Family
ID=17980140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890017849A KR930002816B1 (ko) | 1988-12-06 | 1989-12-04 | 리드프레임의 가공방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2648353B2 (ja) |
KR (1) | KR930002816B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100641512B1 (ko) | 2002-12-30 | 2006-10-31 | 동부일렉트로닉스 주식회사 | 반도체 패키지 공정에서의 리드 프레임 구조 |
KR100789419B1 (ko) * | 2006-11-27 | 2007-12-28 | (주)원일사 | 리드프레임 모재 가공방법 |
JP6518547B2 (ja) * | 2015-08-07 | 2019-05-22 | 新光電気工業株式会社 | リードフレーム、半導体装置及びリードフレームの製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55151357A (en) * | 1979-05-16 | 1980-11-25 | Nec Corp | Lead frame for semiconductor device |
-
1988
- 1988-12-06 JP JP63308361A patent/JP2648353B2/ja not_active Expired - Fee Related
-
1989
- 1989-12-04 KR KR1019890017849A patent/KR930002816B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH02154454A (ja) | 1990-06-13 |
KR900010984A (ko) | 1990-07-11 |
JP2648353B2 (ja) | 1997-08-27 |
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Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060327 Year of fee payment: 14 |
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LAPS | Lapse due to unpaid annual fee |