KR920021308A - 동장적층판의 제조방법 - Google Patents

동장적층판의 제조방법 Download PDF

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Publication number
KR920021308A
KR920021308A KR1019920007997A KR920007997A KR920021308A KR 920021308 A KR920021308 A KR 920021308A KR 1019920007997 A KR1019920007997 A KR 1019920007997A KR 920007997 A KR920007997 A KR 920007997A KR 920021308 A KR920021308 A KR 920021308A
Authority
KR
South Korea
Prior art keywords
film
polyamide
clad laminate
copper clad
manufacturing
Prior art date
Application number
KR1019920007997A
Other languages
English (en)
Other versions
KR0172456B1 (ko
Inventor
기미가쥬 가토
게이지 마주마
료이치 오구로
Original Assignee
노무라 마사
스미토모 베크라이트 가부시끼가이샤
히라사 가추요시
후루카와 서키트 호일 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 노무라 마사, 스미토모 베크라이트 가부시끼가이샤, 히라사 가추요시, 후루카와 서키트 호일 가부시끼가이샤 filed Critical 노무라 마사
Publication of KR920021308A publication Critical patent/KR920021308A/ko
Application granted granted Critical
Publication of KR0172456B1 publication Critical patent/KR0172456B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

내용 없음.

Description

동장적층판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 열경화성 수지를 직포 또는 부직포에 함침 건조하여 반경화시켜서 얻어지는 프리프레그의 1매 또는 복수매를 겹치고, 양면 또는 한면에, 양면을 미리 조화(粗化)한 동박을 적층하고, 이것들을 압축기의 압축판에 끼워서 가열 가압하여 동장적충판을 제조하는 공정에 있어서, 그 동박과 압축판사이에 융점이 적층 온도이상인 폴리아미드계 필름을 끼워 넣고 압축-성형하는 것을 특징으로 하는 프린트 배선판용 동작적층판의 제조방법.
  2. 제1항에 있어서, 폴리아미드계 필름의 융점이 170℃이상인 제조방법.
  3. 제1항에 있어서, 폴리아미드계 필름이 나일론 6필름과 나일론 6.6 필름 중에서 선택됨을 특징으로 하는 제조방법.
  4. 제1항에 있어서, 폴리아미드계 필름의 두께가 10-100㎛인 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019920007997A 1991-05-13 1992-05-12 동장적층판의 제조방법 KR0172456B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-201525 1991-05-13
JP3201525A JP3029487B2 (ja) 1991-05-13 1991-05-13 銅張積層板の製造方法

Publications (2)

Publication Number Publication Date
KR920021308A true KR920021308A (ko) 1992-12-18
KR0172456B1 KR0172456B1 (ko) 1999-03-20

Family

ID=16442492

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920007997A KR0172456B1 (ko) 1991-05-13 1992-05-12 동장적층판의 제조방법

Country Status (7)

Country Link
US (1) US5286330A (ko)
EP (1) EP0514074B1 (ko)
JP (1) JP3029487B2 (ko)
KR (1) KR0172456B1 (ko)
DE (1) DE69208515T2 (ko)
MY (1) MY108012A (ko)
TW (1) TW243583B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100319834B1 (ko) * 1999-08-24 2002-01-10 고연종 복합보드 및 그 제조방법

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EP0599779A1 (de) * 1992-10-29 1994-06-01 OCG Microelectronic Materials AG Hochauflösender negativ arbeitender Photoresist mit grossem Prozessspielraum
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
ID19337A (id) * 1996-12-26 1998-07-02 Ajinomoto Kk Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini
US6229096B1 (en) * 1997-10-07 2001-05-08 Mitsubishi Gas Chemical Company, Inc. Nonwoven reinforcement for printed wiring base board and process for producing the same
DE19859613C2 (de) * 1998-12-23 2001-09-06 Buerkle Gmbh Robert Presspaketaufbau und Verfahren zu dessen Herstellung
US6168634B1 (en) 1999-03-25 2001-01-02 Geoffrey W. Schmitz Hydraulically energized magnetorheological replicant muscle tissue and a system and a method for using and controlling same
US6584820B1 (en) 1999-09-23 2003-07-01 Polyclad Laminates, Inc. Surface enhanced metal press plates for use in manufacture of laminates and multilayer materials and method of making same
JP4025177B2 (ja) 2001-11-26 2007-12-19 三井金属鉱業株式会社 絶縁層付銅箔の製造方法
EP1616909B1 (en) 2003-04-18 2012-02-22 Asahi Kasei Chemicals Corporation Release film for printed wiring board production
WO2006073168A1 (ja) 2005-01-07 2006-07-13 Asahi Kasei Chemicals Corporation ハードディスクドライブ内部部品
KR100839760B1 (ko) * 2006-02-06 2008-06-19 주식회사 엘지화학 칩 온 필름용 동장 적층판
JP5201131B2 (ja) * 2007-03-01 2013-06-05 味の素株式会社 金属膜転写用フィルム、金属膜の転写方法及び回路基板の製造方法
KR101949812B1 (ko) * 2017-08-11 2019-02-20 주식회사 비앤엠 펀칭공법을 이용한 제련용 냉각편 제조장치
KR102171513B1 (ko) * 2019-01-16 2020-10-30 주식회사 비앤엠 이중열 펀칭공법을 이용한 제련용 직사각형 냉각편 제조장치
JP7031955B2 (ja) * 2019-09-10 2022-03-08 Ｆｉｃｔ株式会社 回路基板の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3677876A (en) * 1970-02-18 1972-07-18 Formica Corp Decorative laminate surfaced with a transparent film of polyvinyl fluoride which film is temporarily covered with a transparent film of nylon
JPS5434142B2 (ko) * 1973-09-29 1979-10-25
CA1230526A (en) * 1983-12-09 1987-12-22 Martin J. Wilheim Mold release sheet and method of manufacture
EP0235582A3 (en) * 1986-02-27 1989-03-29 Hewlett-Packard Company Bonded press pad
JPS62214939A (ja) * 1986-03-15 1987-09-21 Matsushita Electric Works Ltd 積層板の製法
JPS62274795A (ja) * 1986-05-23 1987-11-28 新神戸電機株式会社 多層回路板の製造法
EP0333744B1 (en) * 1986-11-13 1995-08-30 JOHNSTON, James A. Method and apparatus for manufacturing printed circuit boards
GB8725746D0 (en) * 1987-11-03 1987-12-09 Du Pont Canada Release sheet for printed circuit board
US4861648A (en) * 1988-03-14 1989-08-29 Gila River Products, Inc. Materials for laminating flexible printed circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100319834B1 (ko) * 1999-08-24 2002-01-10 고연종 복합보드 및 그 제조방법

Also Published As

Publication number Publication date
EP0514074A2 (en) 1992-11-19
TW243583B (ko) 1995-03-21
JPH06316032A (ja) 1994-11-15
US5286330A (en) 1994-02-15
DE69208515T2 (de) 1996-09-26
MY108012A (en) 1996-07-30
DE69208515D1 (de) 1996-04-04
EP0514074B1 (en) 1996-02-28
EP0514074A3 (en) 1993-05-19
JP3029487B2 (ja) 2000-04-04
KR0172456B1 (ko) 1999-03-20

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