KR920015524A - 성형 화합물에 대한 접착력을 개선하기 위한 집적 회로 다이 및 리드 프레임에 물질을 인가하는 방법 및 장치 - Google Patents

성형 화합물에 대한 접착력을 개선하기 위한 집적 회로 다이 및 리드 프레임에 물질을 인가하는 방법 및 장치 Download PDF

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Publication number
KR920015524A
KR920015524A KR1019920000078A KR920000078A KR920015524A KR 920015524 A KR920015524 A KR 920015524A KR 1019920000078 A KR1019920000078 A KR 1019920000078A KR 920000078 A KR920000078 A KR 920000078A KR 920015524 A KR920015524 A KR 920015524A
Authority
KR
South Korea
Prior art keywords
adhesion
integrated circuit
adhesion enhancing
enhancing material
hexamethyldisilagen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019920000078A
Other languages
English (en)
Korean (ko)
Inventor
지. 맥케나 로버트
Original Assignee
윌리엄 이. 힐러
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윌리엄 이. 힐러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 이. 힐러
Publication of KR920015524A publication Critical patent/KR920015524A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
KR1019920000078A 1991-01-08 1992-01-07 성형 화합물에 대한 접착력을 개선하기 위한 집적 회로 다이 및 리드 프레임에 물질을 인가하는 방법 및 장치 Withdrawn KR920015524A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63877691A 1991-01-08 1991-01-08
US07/638,776 1991-01-08

Publications (1)

Publication Number Publication Date
KR920015524A true KR920015524A (ko) 1992-08-27

Family

ID=24561374

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920000078A Withdrawn KR920015524A (ko) 1991-01-08 1992-01-07 성형 화합물에 대한 접착력을 개선하기 위한 집적 회로 다이 및 리드 프레임에 물질을 인가하는 방법 및 장치

Country Status (6)

Country Link
EP (2) EP0494634B1 (enExample)
JP (1) JP3363467B2 (enExample)
KR (1) KR920015524A (enExample)
DE (1) DE69218630T2 (enExample)
SG (1) SG43864A1 (enExample)
TW (1) TW207586B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10127894B4 (de) * 2001-06-08 2004-08-12 Mühlbauer Ag Verfahren, Vorrichtung und Produktionsanlage zum Aufbringen von kleinen Kunststoffmengen auf elektrische Bauteile, wie Mikrochips oder deren Träger

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900580A (en) * 1987-10-22 1990-02-13 Klaus Grah Process for the electrostatic lacquering of printed circuit boards
JPH0244738A (ja) * 1988-08-05 1990-02-14 Semiconductor Energy Lab Co Ltd 電子装置作製方法

Also Published As

Publication number Publication date
JPH06104296A (ja) 1994-04-15
EP0572043A1 (en) 1993-12-01
DE69218630T2 (de) 1997-09-11
TW207586B (enExample) 1993-06-11
EP0494634B1 (en) 1997-04-02
DE69218630D1 (de) 1997-05-07
SG43864A1 (en) 1997-11-14
JP3363467B2 (ja) 2003-01-08
EP0494634A3 (en) 1992-09-02
EP0494634A2 (en) 1992-07-15

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St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

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P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000