JP3363467B2 - 集積回路パッケージ接着法 - Google Patents

集積回路パッケージ接着法

Info

Publication number
JP3363467B2
JP3363467B2 JP00170992A JP170992A JP3363467B2 JP 3363467 B2 JP3363467 B2 JP 3363467B2 JP 00170992 A JP00170992 A JP 00170992A JP 170992 A JP170992 A JP 170992A JP 3363467 B2 JP3363467 B2 JP 3363467B2
Authority
JP
Japan
Prior art keywords
adhesion promoter
integrated circuit
electronic component
adhesion
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP00170992A
Other languages
English (en)
Japanese (ja)
Other versions
JPH06104296A (ja
Inventor
ジー．マッケンナ ロバート
Original Assignee
テキサス インスツルメンツ インコーポレイテツド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by テキサス インスツルメンツ インコーポレイテツド filed Critical テキサス インスツルメンツ インコーポレイテツド
Publication of JPH06104296A publication Critical patent/JPH06104296A/ja
Application granted granted Critical
Publication of JP3363467B2 publication Critical patent/JP3363467B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • H10W72/00—
    • H10W74/01—
    • H10W74/127—
    • H10W72/01515—
    • H10W72/075—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP00170992A 1991-01-08 1992-01-08 集積回路パッケージ接着法 Expired - Fee Related JP3363467B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63877691A 1991-01-08 1991-01-08
US638776 1991-01-08

Publications (2)

Publication Number Publication Date
JPH06104296A JPH06104296A (ja) 1994-04-15
JP3363467B2 true JP3363467B2 (ja) 2003-01-08

Family

ID=24561374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP00170992A Expired - Fee Related JP3363467B2 (ja) 1991-01-08 1992-01-08 集積回路パッケージ接着法

Country Status (6)

Country Link
EP (2) EP0572043A1 (enExample)
JP (1) JP3363467B2 (enExample)
KR (1) KR920015524A (enExample)
DE (1) DE69218630T2 (enExample)
SG (1) SG43864A1 (enExample)
TW (1) TW207586B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10127894B4 (de) * 2001-06-08 2004-08-12 Mühlbauer Ag Verfahren, Vorrichtung und Produktionsanlage zum Aufbringen von kleinen Kunststoffmengen auf elektrische Bauteile, wie Mikrochips oder deren Träger

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900580A (en) * 1987-10-22 1990-02-13 Klaus Grah Process for the electrostatic lacquering of printed circuit boards
JPH0244738A (ja) * 1988-08-05 1990-02-14 Semiconductor Energy Lab Co Ltd 電子装置作製方法

Also Published As

Publication number Publication date
DE69218630D1 (de) 1997-05-07
DE69218630T2 (de) 1997-09-11
EP0494634A2 (en) 1992-07-15
SG43864A1 (en) 1997-11-14
EP0494634B1 (en) 1997-04-02
KR920015524A (ko) 1992-08-27
EP0494634A3 (en) 1992-09-02
TW207586B (enExample) 1993-06-11
JPH06104296A (ja) 1994-04-15
EP0572043A1 (en) 1993-12-01

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