KR920015456A - 액도포 시스템 - Google Patents

액도포 시스템 Download PDF

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Publication number
KR920015456A
KR920015456A KR1019920000821A KR920000821A KR920015456A KR 920015456 A KR920015456 A KR 920015456A KR 1019920000821 A KR1019920000821 A KR 1019920000821A KR 920000821 A KR920000821 A KR 920000821A KR 920015456 A KR920015456 A KR 920015456A
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KR
South Korea
Prior art keywords
liquid
supply source
nozzle means
inlet
nozzle
Prior art date
Application number
KR1019920000821A
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English (en)
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KR100230753B1 (ko
Inventor
게이조 하세베
기요히사 다테야마
유지 요시모또
유지 마쯔야마
데쯔로 나까하라
요시오 기무라
Original Assignee
이노우에 아끼라
도꾜 일렉트론 리미티드
다까시마 히로시
도꾜 일렉트론 큐슈 리미티드
아오이 죠이찌
가부시기가이샤 도시바
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Publication date
Priority claimed from JP908091A external-priority patent/JP2888262B2/ja
Application filed by 이노우에 아끼라, 도꾜 일렉트론 리미티드, 다까시마 히로시, 도꾜 일렉트론 큐슈 리미티드, 아오이 죠이찌, 가부시기가이샤 도시바 filed Critical 이노우에 아끼라
Publication of KR920015456A publication Critical patent/KR920015456A/ko
Application granted granted Critical
Publication of KR100230753B1 publication Critical patent/KR100230753B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

내용 없음

Description

액도포 시스템
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 다수의 처리 유닛을 가지는 레지스트 처리장치의 개요를 나타내는 평면 레이아웃도, 제2도는 현상유닛의 개요를 나타내는 평면 레이 아웃도, 제3도는 본 발명의 실시예에 관한 현상액도포 시스템의 전체 개요를 나타내는 기구블록도, 제4도는 현상액 도포 시스템의 구동계를 나타내는 기구 블록도, 제5도는 웨이퍼에 대면시킨 노즐을 나타내는 종단면도, 제6도는 웨이퍼에 대면시킨 노즐을 나타내는 종단면도, 제7도는 현상공정을 나타내는 프로세스들로도, 제 8,9도는 현상액 도도중의 노즐을 나타내는 사시도, 제10도는 노즐 및 세정장치를 나타내는 평면도, 제11도는 노즐 및 그 세정장치의 일부를 절결하여 나타내는 정면도, 제12도는 다른 실시예의 노즐을 나타내는 종 다면도, 제13도는 다른 실시예의 노즐을 나타내는 횡단면도.

Claims (8)

  1. 액 공급원과, 상기 액공급원에 연통하는 인렛을 가지며, 실질적으로 선형인 액토출부를 갖는 노즐 수단과, 상기 액 공급원에서 상기 노즐수단으로 향하여 가압가스에 의해 액을 압송하는 압송수단과, 피처리체를 재치 고정하는 재치대와, 상기 노즐수단의 액토출부를 상기 재치대위의 피처리체에 근접대면시키는 수단과, 상기 재치대와 상기 노즐수단을 상대적으로 이동시키는 수단을 구비하고, 상기 노즐수단은, 상기 인렛에 연통하고, 상기 액공급원에 공급된 액이 모이는 액 저장부와, 상기 액토출부에 형성하고, 상기 액 저장부에 연통하는 다수의 가는 구멍을 가지고, 상기 노즐 수단의 인렛과 상기 액공급원과의 사이의 연통로에 형성되고, 노즐 수단의 상기 액저장부로의 압송액의 압력을 줄이는 감압수단을 가지는 것을 포함하는 액도포 시스템.
  2. 제1항에 있어서, 또한, 액저장부의 상부에 연통하는 벤드통로가 형성되어 있는 것을 포함하는 액도포 시스템.
  3. 제2항에 있어서, 액저장부의 상부에서 중앙이 둘레가장자리보다 높이 솟아오르도록 경사지고, 벤트통로가 액저장부의 상부 중앙에 연통하는 한편, 인렛이 액저장부의 상부둘레가장자리에 연통하는 것을 포함하는 액도포 시스템.
  4. 제2항에 있어서, 또한, 벤트통로에 차단밸브 및 매스플로콘트롤러가 설치되고, 이들이 상기 압송수단 및 상기 감압수단과 함께 공통의 제어수단에 의해 조절되는 것을 포함하는 액도포 시스템.
  5. 제1항에 있어서, 또한, 노즐수단의 인렛과 액공급원과의 사이의 연통로에 액온도를 조절하는 온도조절수단이 형성되어 있는 것을 포함하는 액도포 시스템.
  6. 제1항에 있어서, 또한, 노즐수단의 액저장부에 액온도를 조절하는 온도조절수단이 형성되어 있는 것을 포함하는 액도포 시스템.
  7. 제1항에 있어서, 선형인 액토출부가 피처리체의 직경에 실질적으로 상당하는 길이로 형성되어 있는 것을 포함하는 액도포 시스템.
  8. 제1항에 있어서, 상대 이동 수단이 재치대를 회전시키는 회전 기구인 것을 포함하는 액도포 시스템.
    ※ 참고사항 : 최초출원 내용에 의하여 공개돠는 것임.
KR1019920000821A 1991-01-23 1992-01-21 액도포 시스템 KR100230753B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP91-6369 1991-01-23
JP636991 1991-01-23
JP91-9080 1991-01-29
JP908091A JP2888262B2 (ja) 1991-01-29 1991-01-29 処理液塗布方法

Publications (2)

Publication Number Publication Date
KR920015456A true KR920015456A (ko) 1992-08-26
KR100230753B1 KR100230753B1 (ko) 1999-11-15

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US (1) US5374312A (ko)
KR (1) KR100230753B1 (ko)

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US5374312A (en) 1994-12-20

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