KR920005293A - 프로우빙 테스트 방법 - Google Patents

프로우빙 테스트 방법 Download PDF

Info

Publication number
KR920005293A
KR920005293A KR1019910014278A KR910014278A KR920005293A KR 920005293 A KR920005293 A KR 920005293A KR 1019910014278 A KR1019910014278 A KR 1019910014278A KR 910014278 A KR910014278 A KR 910014278A KR 920005293 A KR920005293 A KR 920005293A
Authority
KR
South Korea
Prior art keywords
probe needle
pad
test method
probing test
probing
Prior art date
Application number
KR1019910014278A
Other languages
English (en)
Other versions
KR0162499B1 (ko
Inventor
와타루 가라사와
Original Assignee
이노우에 아키라
도오교오 에레구토론 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16696965&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR920005293(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 이노우에 아키라, 도오교오 에레구토론 가부시끼가이샤 filed Critical 이노우에 아키라
Publication of KR920005293A publication Critical patent/KR920005293A/ko
Application granted granted Critical
Publication of KR0162499B1 publication Critical patent/KR0162499B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

내용 없음

Description

프로우빙 테스트 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 프로우빙 테스트 머신을 나타낸 전체 개요도.
제2도는 프로우빙 테스트 머신의 메인 보디를 윗쪽에서 보고 모식적으로 나타낸 평면 개요도.
제3도는 테스트 섹션내의 웨이퍼 스테이지와 프로우브 카아드를 모식적으로 나타낸 도면.

Claims (11)

  1. 패드와 프로우브 침과를 상호 접촉시키는 공정과, 상기 접촉공정후 또는 전 또는 동시에, 상기 패드 및 프로우브 침의 적어도 한쪽을, 상기 패드의 프로우브 침이 접촉하여야 할 면을 따라서 상대 이동시키는 공정과, 이 공정에 의한 상기 상대 이동중 또는 상대 이동을 정지시키고, 테스트하는 공정으로 이루어지는 프로우빙 테스트 방법.
  2. 제1항에 있어서, 상기 프로우브 침을 개재하여 상기 패드에 테스트시그날을 보내는 프로우빙 테스트 방법.
  3. 제1항에 있어서, 상기 프로우브 침을 저주파 진동시키는 프로우빙 테스트 방법.
  4. 제1항에 있어서, 상기 프로우브 침을 고주파 진동시키는 프로우빙 테스트 방법.
  5. 제1항에 있어서, 상기 프로우빙 침을, X축 방향, Y축 방향, θ회 전방향중의 적어도 한 방향으로 적어도 1회 이동시키는 프로우빙 테스트 방법.
  6. 제1항에 있어서, 상기 프로우브 침이 부착된 프로우브 카아드에 진동을 부여하는 프로우빙 테스트 방법.
  7. 제1항에 있어서, 상기 프로우브 침이 상기 패드의 면에 대하여 경사져서 접촉하는 프로우빙 테스트 방법.
  8. 제1항에 있어서, 프로우브 침이, 상기 패드의 면에 대하여 수직으로 접촉하는 프로우빙 테스트 방법.
  9. 제1항에 있어서, 상기 프로우브 침이 상기 패드에 접촉하는 곳을 넘어서, 또한 상기 프로우브 침을 상기 패드에 밀어붙이면서, 상기 프로우브 침 및 상기 패드를 상대 이동시키는 프로우빙 테스트 방법.
  10. 제1항에 있어서, 상기 프로우브 침이 상기 패드에 접촉하는 곳을 넘어서, 또한 상기 프로우브 침을 상기 패드에 밀어붙인 후에, 상기 프로우브 침 및 상기 패드를 상대 이동시키는 프로우빙 테스트 방법.
  11. 제1항에 있어서, 상기 패드와 프로우브 침과의 상호접속을 검출하고, 접촉검출결과에 의거하여 상기 프로우브 침을 상대 이동시키는 프로우빙 테스트 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임
KR1019910014278A 1990-08-20 1991-08-19 프로우빙 테스트 방법 KR0162499B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP21698290A JP3208734B2 (ja) 1990-08-20 1990-08-20 プローブ装置
JP90-216982 1990-08-20
JP216982 1990-08-20

Publications (2)

Publication Number Publication Date
KR920005293A true KR920005293A (ko) 1992-03-28
KR0162499B1 KR0162499B1 (ko) 1999-02-01

Family

ID=16696965

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910014278A KR0162499B1 (ko) 1990-08-20 1991-08-19 프로우빙 테스트 방법

Country Status (3)

Country Link
US (1) US5436571A (ko)
JP (1) JP3208734B2 (ko)
KR (1) KR0162499B1 (ko)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
JP3723232B2 (ja) * 1992-03-10 2005-12-07 シリコン システムズ インコーポレーテッド プローブ針調整ツール及びプローブ針調整法
JP2953263B2 (ja) * 1993-07-16 1999-09-27 信越半導体株式会社 ｎ型シリコンエピタキシャル層の抵抗率測定方法
US5559446A (en) * 1993-07-19 1996-09-24 Tokyo Electron Kabushiki Kaisha Probing method and device
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5644245A (en) * 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
US5777485A (en) * 1995-03-20 1998-07-07 Tokyo Electron Limited Probe method and apparatus with improved probe contact
US5949238A (en) * 1995-12-20 1999-09-07 Siemens Medical Systems, Inc. Method and apparatus for probing large pin count integrated circuits
AU6406696A (en) * 1996-01-24 1997-08-20 Intel Corporation Improved method and apparatus for scrubbing the bond pads of an integrated circuit during wafer sort
US5883519A (en) * 1996-02-23 1999-03-16 Kinetic Probe, Llc Deflection device
US5773987A (en) * 1996-02-26 1998-06-30 Motorola, Inc. Method for probing a semiconductor wafer using a motor controlled scrub process
US6166552A (en) * 1996-06-10 2000-12-26 Motorola Inc. Method and apparatus for testing a semiconductor wafer
US5777484A (en) * 1996-09-30 1998-07-07 Packard Hughes Interconnect Company Device for testing integrated circuit chips during vibration
US6140828A (en) * 1997-05-08 2000-10-31 Tokyo Electron Limited Prober and probe method
JPH10335395A (ja) * 1997-05-28 1998-12-18 Advantest Corp プローブカードの接触位置検出方法
JP3423979B2 (ja) * 1997-07-11 2003-07-07 東京エレクトロン株式会社 プローブ方法及びプローブ装置
US6433571B1 (en) * 1998-07-06 2002-08-13 Motorola, Inc. Process for testing a semiconductor device
US6731327B1 (en) 1999-02-12 2004-05-04 Hypervision, Inc. Dynamic structural coupling mechanism for reducing optical degradation in vibrating environments
US6271676B1 (en) 1999-03-02 2001-08-07 Tsk America, Inc. Spiral chuck
JP2000260852A (ja) 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
US7009415B2 (en) * 1999-10-06 2006-03-07 Tokyo Electron Limited Probing method and probing apparatus
JP2001110857A (ja) 1999-10-06 2001-04-20 Tokyo Electron Ltd プローブ方法及びプローブ装置
JP4218816B2 (ja) 2000-02-15 2009-02-04 東京エレクトロン株式会社 針荷重測定方法、検査方法及び検査装置
WO2004011953A1 (en) * 2000-03-15 2004-02-05 Tsk America, Inc. Spiral chuck
JP2001356134A (ja) * 2000-04-13 2001-12-26 Innotech Corp プローブカード装置およびそれに用いられるプローブ
US6791344B2 (en) 2000-12-28 2004-09-14 International Business Machines Corporation System for and method of testing a microelectronic device using a dual probe technique
JP2002313857A (ja) * 2001-04-12 2002-10-25 Ando Electric Co Ltd 距離変化出力装置及び方法
JP2003222654A (ja) * 2002-01-30 2003-08-08 Tokyo Electron Ltd プローブ装置
JP2004152916A (ja) * 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法
US7202682B2 (en) 2002-12-20 2007-04-10 Formfactor, Inc. Composite motion probing
JP4387125B2 (ja) * 2003-06-09 2009-12-16 東京エレクトロン株式会社 検査方法及び検査装置
JP4339631B2 (ja) * 2003-06-20 2009-10-07 東京エレクトロン株式会社 検査方法及び検査装置
US20050205778A1 (en) * 2003-10-17 2005-09-22 Gsi Lumonics Corporation Laser trim motion, calibration, imaging, and fixturing techniques
US7218127B2 (en) * 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
EP1587113B1 (en) * 2004-04-15 2012-10-03 Fei Company Stylus system for modifying small structures
US7733101B2 (en) * 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US7659739B2 (en) * 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US9097740B2 (en) * 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US20060071679A1 (en) * 2004-10-04 2006-04-06 Texas Instruments Incorporated System and method for the probing of a wafer
US7362116B1 (en) * 2005-11-09 2008-04-22 Electroglas, Inc. Method for probing impact sensitive and thin layered substrate
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
JP4950719B2 (ja) * 2007-03-23 2012-06-13 東京エレクトロン株式会社 プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置
JP5034614B2 (ja) * 2007-03-30 2012-09-26 東京エレクトロン株式会社 プロービング方法、プローブ装置及び記憶媒体
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7573283B2 (en) * 2007-06-19 2009-08-11 Suss Micro Tec Test Systems Gmbh Method for measurement of a device under test
JP4950779B2 (ja) * 2007-06-22 2012-06-13 東京エレクトロン株式会社 プローブカードの登録方法及びこのプログラムを記録したプログラム記録媒体
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) * 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
JP2009276215A (ja) * 2008-05-15 2009-11-26 Tokyo Electron Ltd プローブ装置及びコンタクト位置の補正方法
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US8120304B2 (en) * 2008-12-12 2012-02-21 Formfactor, Inc. Method for improving motion times of a stage
KR20100089131A (ko) * 2009-02-03 2010-08-12 삼성전자주식회사 프로버의 위치 보정 방법 및 이를 수행하기 위한 장치
JP5384170B2 (ja) * 2009-03-31 2014-01-08 東京エレクトロン株式会社 コンタクトパラメータの設定方法、コンタクトパラメータの設定用プログラム及びコンタクトパラメータの設定用プログラムが記録された記録媒体
US10802071B2 (en) * 2017-12-01 2020-10-13 International Business Machines Corporation Elemental mercury-containing probe card
DE102018121911A1 (de) * 2018-09-07 2020-03-12 Formfactor Gmbh Verfahren zur Positionierung von Testsubstrat, Sonden und Inspektionseinheit relativ zueinander und Prober zu dessen Ausführung
CN116990620B (zh) * 2023-09-26 2023-12-19 江苏迅镭激光科技有限公司 Ccs组件振动测试方法
CN117406072B (zh) * 2023-12-14 2024-02-13 深圳市铨天科技有限公司 用于半导体散粒芯片测试装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3453545A (en) * 1967-07-07 1969-07-01 Rca Corp Probe assembly for testing semiconductor wafers including a wafer vibrator for effecting good test connections
DE2344239B2 (de) * 1973-09-01 1977-11-03 Luther, Erich, 3050 Wunstorf; Maelzer, Fritz; Maelzer, Martin; 7910 Reutti Post Neu-Ulm; Türkkan, Tamer, 3011 Laatzen Kontaktvorrichtung zum anschliessen einer gedruckten schaltung an ein pruefgeraet
US4123706A (en) * 1975-03-03 1978-10-31 Electroglas, Inc. Probe construction
JPS56133842A (en) * 1980-03-24 1981-10-20 Toshiba Corp Device for measuring characteristics of semiconductor element
US4585991A (en) * 1982-06-03 1986-04-29 Texas Instruments Incorporated Solid state multiprobe testing apparatus
US4780836A (en) * 1985-08-14 1988-10-25 Kabushiki Kaisha Toshiba Method of testing semiconductor devices using a probe card
US4943767A (en) * 1986-08-21 1990-07-24 Tokyo Electron Limited Automatic wafer position aligning method for wafer prober
US4758785A (en) * 1986-09-03 1988-07-19 Tektronix, Inc. Pressure control apparatus for use in an integrated circuit testing station
US4918383A (en) * 1987-01-20 1990-04-17 Huff Richard E Membrane probe with automatic contact scrub action
US4864227A (en) * 1987-02-27 1989-09-05 Canon Kabushiki Kaisha Wafer prober
JP2519737B2 (ja) * 1987-07-31 1996-07-31 東京エレクトロン株式会社 プロ−ブカ−ド
JPH0719819B2 (ja) * 1987-09-14 1995-03-06 東京エレクトロン株式会社 プローブ装置
JP2635054B2 (ja) * 1987-09-28 1997-07-30 東京エレクトロン株式会社 プロービングカード
US4929893A (en) * 1987-10-06 1990-05-29 Canon Kabushiki Kaisha Wafer prober
JPH02290036A (ja) * 1989-02-13 1990-11-29 Tokyo Electron Ltd 半導体ウエハの検査方法

Also Published As

Publication number Publication date
KR0162499B1 (ko) 1999-02-01
JP3208734B2 (ja) 2001-09-17
US5436571A (en) 1995-07-25
JPH04100251A (ja) 1992-04-02

Similar Documents

Publication Publication Date Title
KR920005293A (ko) 프로우빙 테스트 방법
KR880004325A (ko) 집적회로 프로브의 접촉설정장치 및 그 방법
ATE350672T1 (de) Fingertester
KR940006232A (ko) 프로우브 장치
KR870002442A (ko) 프루브 검사방법
DE3785978T2 (de) Gerät zum Feststellen der räumlichen Anordnung eines elektronischen Bauteils.
DE59604229D1 (de) Testvorrichtung für elektronische flachbaugruppen
JPS585601A (ja) 測定装置用プロ−ブ
EP0397116A3 (en) Information detecting apparatus
EP0919820A3 (en) Circuit board testing apparatus and method
KR970016625A (ko) Pcb 검사장치
ATE211253T1 (de) Messtaster zur verifikation der lineardimensionen von werkstücken
KR890012370A (ko) 반도체 장치
EP0945804A3 (de) Integrierte Schaltung und Verfahren zu ihrer Prüfung
DE59913814D1 (de) Vielsondentestkopf und prüfverfahren
KR840006079A (ko) 물체의 위치 측정용 초음파 장치
KR970001339Y1 (ko) 웨이퍼의 먼지제거회로
KR910010660A (ko) 내부리드본딩 검사방법
SU1421974A1 (ru) Способ измерени размеров детали
DE3882964D1 (de) Vorrichtung zum messen der ortsaufgeloesten druckverteilung.
DE3872645D1 (de) Verfahren und vorrichtung zur ermittlung der bewegungsrichtung eines elektrisch leitenden gegenstandes.
Drozda Versatile Hardness Tester Checks 1800 Parts/Hour
FR2398337A1 (fr) Procede et dispositif statique de lecture de trace
JPS52116279A (en) Friction tester
GB1303247A (ko)

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20100825

Year of fee payment: 13

EXPY Expiration of term