KR920002343Y1 - 양면 프린트 기판 - Google Patents

양면 프린트 기판 Download PDF

Info

Publication number
KR920002343Y1
KR920002343Y1 KR2019890016706U KR890016706U KR920002343Y1 KR 920002343 Y1 KR920002343 Y1 KR 920002343Y1 KR 2019890016706 U KR2019890016706 U KR 2019890016706U KR 890016706 U KR890016706 U KR 890016706U KR 920002343 Y1 KR920002343 Y1 KR 920002343Y1
Authority
KR
South Korea
Prior art keywords
substrate
board
printed
conductive
hole
Prior art date
Application number
KR2019890016706U
Other languages
English (en)
Korean (ko)
Other versions
KR910010399U (ko
Inventor
요시가즈 아사오
Original Assignee
송갑수
화인덴시 가부시기가이샤
요시가즈 아사오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 송갑수, 화인덴시 가부시기가이샤, 요시가즈 아사오 filed Critical 송갑수
Publication of KR910010399U publication Critical patent/KR910010399U/ko
Application granted granted Critical
Publication of KR920002343Y1 publication Critical patent/KR920002343Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0221—Perforating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
KR2019890016706U 1989-08-09 1989-11-13 양면 프린트 기판 KR920002343Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP89-92987 1989-08-09
JP1989092987U JPH0635499Y2 (ja) 1989-08-09 1989-08-09 両面プリント基板

Publications (2)

Publication Number Publication Date
KR910010399U KR910010399U (ko) 1991-06-29
KR920002343Y1 true KR920002343Y1 (ko) 1992-04-09

Family

ID=14069727

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019890016706U KR920002343Y1 (ko) 1989-08-09 1989-11-13 양면 프린트 기판

Country Status (3)

Country Link
JP (1) JPH0635499Y2 (US07860544-20101228-C00003.png)
KR (1) KR920002343Y1 (US07860544-20101228-C00003.png)
GB (1) GB2235825A (US07860544-20101228-C00003.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023506A1 (en) * 2006-08-02 2008-02-28 Murata Manufacturing Co., Ltd. Chip device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
GB2101411B (en) * 1981-06-04 1985-06-05 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
JPS60149196A (ja) * 1984-01-17 1985-08-06 ソニー株式会社 プリント基板およびその製造方法
DE3429236A1 (de) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin Folie mit beidseitig aufgedruckten elektrischen leiterbahnen
JPS6185893A (ja) * 1984-10-04 1986-05-01 横浜ゴム株式会社 可撓性フイルムへの電子回路印刷法
JPS6187392A (ja) * 1984-10-05 1986-05-02 横浜ゴム株式会社 可撓性プリント配線板の製造方法
GB2219892B (en) * 1988-06-16 1992-07-15 Plessey Co Plc A circuit board laminate and method of providing same

Also Published As

Publication number Publication date
JPH0332465U (US07860544-20101228-C00003.png) 1991-03-29
KR910010399U (ko) 1991-06-29
GB2235825A (en) 1991-03-13
GB9017182D0 (en) 1990-09-19
JPH0635499Y2 (ja) 1994-09-14

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Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee