KR920000118A - 와이어본딩방법 - Google Patents
와이어본딩방법 Download PDFInfo
- Publication number
- KR920000118A KR920000118A KR1019910002890A KR910002890A KR920000118A KR 920000118 A KR920000118 A KR 920000118A KR 1019910002890 A KR1019910002890 A KR 1019910002890A KR 910002890 A KR910002890 A KR 910002890A KR 920000118 A KR920000118 A KR 920000118A
- Authority
- KR
- South Korea
- Prior art keywords
- gold wire
- bonding method
- wire bonding
- electrode
- wire
- Prior art date
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 오이어본딩의 시퀀스도,
제2도는 본 발명에 사용되는 와이어본딩장치의 개관도,
제3도는 와이어본딩의 개관도.
Claims (1)
- 반도체칩(25)의 전극(26)과 리드프레임(24)의 리드를 초음파 혼(16)의 선단을 통과한 금선(22)으로 접속시키는 와이어본딩방법에 있어서, 상기 금선(22)이 상기 전극(26)에 접촉하기 전에 이 접촉한 상태에서의 접합에 최적의 제1차 초음파진동을 상기 금선(22)에 인가하는 공정과 이 접촉후에 상기 금선(22)의 찌부러진 면적에 적합한 제2차 초음파진동을 상기 금선(22)에 인가하는 것을 특징으로 하는 와이어본딩방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP02-041238 | 1990-02-23 | ||
JP2041238A JPH088285B2 (ja) | 1990-02-23 | 1990-02-23 | ワイヤボンディング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920000118A true KR920000118A (ko) | 1992-01-10 |
KR950000097B1 KR950000097B1 (ko) | 1995-01-09 |
Family
ID=12602847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910002890A KR950000097B1 (ko) | 1990-02-23 | 1991-02-22 | 와이어본딩 방법 |
Country Status (3)
Country | Link |
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US (1) | US5115960A (ko) |
JP (1) | JPH088285B2 (ko) |
KR (1) | KR950000097B1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2879270B2 (ja) * | 1991-04-16 | 1999-04-05 | 株式会社新川 | ボンデイング装置 |
US5586713A (en) * | 1993-08-31 | 1996-12-24 | Matsushita Electric Industrial Co., Ltd. | Method for wire bonding |
US6213378B1 (en) * | 1997-01-15 | 2001-04-10 | National Semiconductor Corporation | Method and apparatus for ultra-fine pitch wire bonding |
US6152350A (en) * | 1997-06-19 | 2000-11-28 | Fuji Photo Film Co., Ltd. | Ultrasonic welding device and method, and a magnetic tape cartridge reel welding device and method |
DE19902827C1 (de) * | 1999-01-15 | 2000-06-08 | Hielscher Gmbh | Verfahren zum Konstanthalten der mittleren Spaltbreite zwischen einer Sonotrode eines Ultraschall-Systems und einem als Gegenwerkzeug ausgebildeten Schneidwerkzeugs einer Ultraschall-Schneideinrichtung |
JP3474132B2 (ja) | 1999-09-28 | 2003-12-08 | インターナショナル・ビジネス・マシーンズ・コーポレーション | ワイヤボンディング方法および装置 |
TW521358B (en) * | 2000-09-22 | 2003-02-21 | Asm Tech Singapore Pte Ltd | A method of bonding wires |
JP4202617B2 (ja) * | 2001-03-16 | 2008-12-24 | 矢崎総業株式会社 | 被覆電線の超音波接合方法およびその方法を用いた超音波接合装置 |
JP4531084B2 (ja) * | 2007-08-31 | 2010-08-25 | 株式会社新川 | ボンディング装置及びボンディング方法 |
US11517977B2 (en) * | 2017-09-15 | 2022-12-06 | Tech-Sonic, Inc. | Dual cam servo weld splicer |
EP3603826B1 (en) * | 2018-07-31 | 2023-05-10 | Infineon Technologies AG | Method for calibrating an ultrasonic bonding machine |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5950536A (ja) * | 1982-09-16 | 1984-03-23 | Toshiba Corp | ワイヤボンデイング装置 |
SU1094704A1 (ru) * | 1982-12-30 | 1984-05-30 | Предприятие П/Я Р-6429 | Способ ультразвуковой сварки |
US4496095A (en) * | 1983-04-12 | 1985-01-29 | Fairchild Industries, Inc. | Progressive ultrasonic welding system |
US4597519A (en) * | 1984-02-27 | 1986-07-01 | Fairchild Camera & Instrument Corporation | Lead wire bonding with increased bonding surface area |
US4696425A (en) * | 1984-07-17 | 1987-09-29 | Texas Instruments Incorporated | Programmable ultrasonic power supply |
JPH0732173B2 (ja) * | 1985-03-15 | 1995-04-10 | 株式会社東芝 | ワイヤボンデイング方法 |
JPS62126647A (ja) * | 1985-11-28 | 1987-06-08 | Toshiba Corp | ワイヤボンデイング方法 |
JPS63194343A (ja) * | 1987-02-09 | 1988-08-11 | Toshiba Corp | ワイヤボンディング装置の制御方法 |
JPH01241838A (ja) * | 1988-03-23 | 1989-09-26 | Mitsubishi Electric Corp | ワイヤボンデイング方法 |
JPH0244745A (ja) * | 1988-08-05 | 1990-02-14 | Sharp Corp | ワイヤボンディング方法 |
-
1990
- 1990-02-23 JP JP2041238A patent/JPH088285B2/ja not_active Expired - Lifetime
-
1991
- 1991-01-25 US US07/645,658 patent/US5115960A/en not_active Expired - Lifetime
- 1991-02-22 KR KR1019910002890A patent/KR950000097B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR950000097B1 (ko) | 1995-01-09 |
JPH088285B2 (ja) | 1996-01-29 |
US5115960A (en) | 1992-05-26 |
JPH03245544A (ja) | 1991-11-01 |
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