KR920000118A - 와이어본딩방법 - Google Patents

와이어본딩방법 Download PDF

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Publication number
KR920000118A
KR920000118A KR1019910002890A KR910002890A KR920000118A KR 920000118 A KR920000118 A KR 920000118A KR 1019910002890 A KR1019910002890 A KR 1019910002890A KR 910002890 A KR910002890 A KR 910002890A KR 920000118 A KR920000118 A KR 920000118A
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KR
South Korea
Prior art keywords
gold wire
bonding method
wire bonding
electrode
wire
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Application number
KR1019910002890A
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English (en)
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KR950000097B1 (ko
Inventor
야스히코 시미즈
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
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Publication of KR920000118A publication Critical patent/KR920000118A/ko
Application granted granted Critical
Publication of KR950000097B1 publication Critical patent/KR950000097B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음

Description

와이어본딩방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 오이어본딩의 시퀀스도,
제2도는 본 발명에 사용되는 와이어본딩장치의 개관도,
제3도는 와이어본딩의 개관도.

Claims (1)

  1. 반도체칩(25)의 전극(26)과 리드프레임(24)의 리드를 초음파 혼(16)의 선단을 통과한 금선(22)으로 접속시키는 와이어본딩방법에 있어서, 상기 금선(22)이 상기 전극(26)에 접촉하기 전에 이 접촉한 상태에서의 접합에 최적의 제1차 초음파진동을 상기 금선(22)에 인가하는 공정과 이 접촉후에 상기 금선(22)의 찌부러진 면적에 적합한 제2차 초음파진동을 상기 금선(22)에 인가하는 것을 특징으로 하는 와이어본딩방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910002890A 1990-02-23 1991-02-22 와이어본딩 방법 KR950000097B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP02-041238 1990-02-23
JP2041238A JPH088285B2 (ja) 1990-02-23 1990-02-23 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
KR920000118A true KR920000118A (ko) 1992-01-10
KR950000097B1 KR950000097B1 (ko) 1995-01-09

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Application Number Title Priority Date Filing Date
KR1019910002890A KR950000097B1 (ko) 1990-02-23 1991-02-22 와이어본딩 방법

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Country Link
US (1) US5115960A (ko)
JP (1) JPH088285B2 (ko)
KR (1) KR950000097B1 (ko)

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JP2879270B2 (ja) * 1991-04-16 1999-04-05 株式会社新川 ボンデイング装置
US5586713A (en) * 1993-08-31 1996-12-24 Matsushita Electric Industrial Co., Ltd. Method for wire bonding
US6213378B1 (en) * 1997-01-15 2001-04-10 National Semiconductor Corporation Method and apparatus for ultra-fine pitch wire bonding
US6152350A (en) * 1997-06-19 2000-11-28 Fuji Photo Film Co., Ltd. Ultrasonic welding device and method, and a magnetic tape cartridge reel welding device and method
DE19902827C1 (de) * 1999-01-15 2000-06-08 Hielscher Gmbh Verfahren zum Konstanthalten der mittleren Spaltbreite zwischen einer Sonotrode eines Ultraschall-Systems und einem als Gegenwerkzeug ausgebildeten Schneidwerkzeugs einer Ultraschall-Schneideinrichtung
JP3474132B2 (ja) 1999-09-28 2003-12-08 インターナショナル・ビジネス・マシーンズ・コーポレーション ワイヤボンディング方法および装置
TW521358B (en) * 2000-09-22 2003-02-21 Asm Tech Singapore Pte Ltd A method of bonding wires
JP4202617B2 (ja) * 2001-03-16 2008-12-24 矢崎総業株式会社 被覆電線の超音波接合方法およびその方法を用いた超音波接合装置
JP4531084B2 (ja) * 2007-08-31 2010-08-25 株式会社新川 ボンディング装置及びボンディング方法
US11517977B2 (en) * 2017-09-15 2022-12-06 Tech-Sonic, Inc. Dual cam servo weld splicer
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5950536A (ja) * 1982-09-16 1984-03-23 Toshiba Corp ワイヤボンデイング装置
SU1094704A1 (ru) * 1982-12-30 1984-05-30 Предприятие П/Я Р-6429 Способ ультразвуковой сварки
US4496095A (en) * 1983-04-12 1985-01-29 Fairchild Industries, Inc. Progressive ultrasonic welding system
US4597519A (en) * 1984-02-27 1986-07-01 Fairchild Camera & Instrument Corporation Lead wire bonding with increased bonding surface area
US4696425A (en) * 1984-07-17 1987-09-29 Texas Instruments Incorporated Programmable ultrasonic power supply
JPH0732173B2 (ja) * 1985-03-15 1995-04-10 株式会社東芝 ワイヤボンデイング方法
JPS62126647A (ja) * 1985-11-28 1987-06-08 Toshiba Corp ワイヤボンデイング方法
JPS63194343A (ja) * 1987-02-09 1988-08-11 Toshiba Corp ワイヤボンディング装置の制御方法
JPH01241838A (ja) * 1988-03-23 1989-09-26 Mitsubishi Electric Corp ワイヤボンデイング方法
JPH0244745A (ja) * 1988-08-05 1990-02-14 Sharp Corp ワイヤボンディング方法

Also Published As

Publication number Publication date
KR950000097B1 (ko) 1995-01-09
JPH088285B2 (ja) 1996-01-29
US5115960A (en) 1992-05-26
JPH03245544A (ja) 1991-11-01

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