JPH0244745A - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法

Info

Publication number
JPH0244745A
JPH0244745A JP63196375A JP19637588A JPH0244745A JP H0244745 A JPH0244745 A JP H0244745A JP 63196375 A JP63196375 A JP 63196375A JP 19637588 A JP19637588 A JP 19637588A JP H0244745 A JPH0244745 A JP H0244745A
Authority
JP
Japan
Prior art keywords
ball
pad
output
wire
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63196375A
Other languages
English (en)
Inventor
Kenji Toyosawa
健司 豊沢
Takamichi Maeda
前田　崇道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP63196375A priority Critical patent/JPH0244745A/ja
Priority to US07/386,519 priority patent/US4993618A/en
Publication of JPH0244745A publication Critical patent/JPH0244745A/ja
Pending legal-status Critical Current

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、半導体チップのパッドとインナーリードとを
ボンディングワイヤで接続するワイヤボンディング方法
に関する。
〈従来の技術〉 第３図はワイヤボンディング方法を示す説明図、第４図
は従来のワイヤボンディング方法を示すタイムチャート
、第５図は従来のワイヤボンディング方法の問題点を示
す説明図である。
ワイヤボンディングとは、半導体チップ１０の電極であ
るパッド１１と、リードフレーム等のインナーリード（
図示省略）とを金線等のボンディングワイヤ３０で接続
することをいい、このワイヤボンディングを行うワイヤ
ボンディング装置は、ファーストボンディング箇所であ
るパッド１１と、セカンドボンディング箇所であるイン
ナーリードとの間にわたってボンディングワイヤ３０を
移動させるとともに、パッド１１及びインナーリードと
にボンディングワイヤ３０を圧接するキャピラリー４０
と、このキャピラリー４０の先端から突出したボンディ
ングワイヤ３０の先端にボール３１を形成するトーチ（
図示省略）とを有している。
まず、トーチでボンディングワイヤ３０の先端にボール
３１を形成しく第３図（ａ）参照）、このボール３１を
キャピラリー４０で押し潰すようにしてパッド１１に圧
接する。ボール３１が押し潰された後、キャピラリー４
０をボール３１に押し付けたままの状態で、第４図に示
すＴ２からＴ４までの間、一定出力の　　態で一定出力
の強い超音波を加えると、バッド１１超音波をボール３
１に加えてボール３１とパッド１１と　　の真下にある
絶縁酸化膜１２、Ｌｏｃｏｓ膜１４等にクラの接合をよ
り強固なものにする　（第３図（ｂ）参照）　　　ツク
１２１等のダメージが発生する　（第５図参照）ボール
３１とパッドエ１との接合が完了したならば、キャピラ
リー４０をセカンドボンディング側に移動させてセカン
ドボンディングを行う　（第３図（Ｃ）参照、第４図に
示すＴ５においてキャピラリー４０がボール３１から離
れる）。
なお、キャピラリー４０の上下動にはパルスモータ等が
使用される。
〈発明が解決しようとする課題〉 しかしながら、上述した従来のワイヤボンディング方法
によると以下のような問題点がある。
すなわち、パッド１１が薄く、かつパッド１１を構成す
るメタルの硬度が低い場合、ボール３１をパッド１１に
圧接すると、ボール３１がパッド１１の中に入り込み、
当該ポール３１がパッド１１の真下にある絶縁酸化膜１
２に接近することがある。
絶縁酸化膜１２は機械的強度が低いので、この状特に、
銅、銀等の金より硬度の高い材料をボンディングワイヤ
として用いると、ボールがパッドの中により入り込んで
、ボールと絶縁酸化膜との間の間隔が小さくなるので、
絶縁酸化膜に対して直接超音波が加えられることになり
、より顕著なダメージが発生する。
本発明は上記事情に鑑みて創案されたもので、パッドの
真下にある絶縁酸化膜等にクラック等のダメージが発生
しないワイヤボンディング方法を提供することを目的と
している。
〈課題を解決するための手段〉 本発明に係るワイヤボンディング方法は、半導体チ亀ン
プのパッドとインナーリードとをボンディングワイヤで
接続するワイヤボンディング方法であって、ボンディン
グワイヤの先端に形成されたボールが前記バンドに圧接
されている間に、前記ボールに加えられる超音波の出力
を減少させるようにしている。
〈作用〉 ボンディングワイヤの先端に形成されたボールをパッド
に圧接する。このボールに超音波を加える。ボールがパ
ッドに圧接されている間に、超音波の出力を減少させる
。
〈実施例〉 以下、図面を参照して本発明に係る一実施例を説明する
。
第１図は本発明に係るワイヤボンディング方法を示すタ
イムチャート、第２図はこのワイヤボンディング方法に
よるワイヤボンディングの説明図である。なお、従来の
ものと路間−の部品等には同一の符号を付して説明を行
う。
本発明に係るワイヤボンディング方法は、半導体チップ
１０のパッド１１とインナーリードとをボンディングワ
イヤ３０で接続するワイヤボンディング方法であって、
ボンディングワイヤ３０の先端に形成されたボール３１
が前記パッド１１に圧接されている間に、前記ボール３
１に加えられる超音波の出力を減少させるようにしてい
る。
まず、本発明に係るワイヤボンディング方法でワイヤボ
ンディングされる半導体チップ１０の構造の一例につい
て説明する。
この半導体チップ１０は、シリコン基板１５の上にＬｏ
ｃｏｓ膜１４、絶縁酸化膜１２、パッシベーション膜１
３が順次積層されたものであって、パッシベーション膜
１３が開口している部分にはファーストボンディング箇
所としてのパッド１１が設けられている。
本発明に係るワイヤボンディング方法によるワイヤボン
ディングは次のようにして行われる。
まず、トーチによってボンディングワイヤ３０の先端に
ボール３１が形成される。このボール３１は、キャピラ
リー４０によってパッド１１に圧接される。
すなわち、第１図に示すＴ１においてボール３１がパッ
ド１１に対して圧接され、Ｔ２において超音波がボール
３１に対して加えられる。
ボール３１がパッド１１に圧接されている間に、超音波
の出力を減少させる。超音波の出力の減少には、第１図
（ａ）に示すように徐々に出力を減少させる方法と、第
１図℃）に示すように段階的に出力を減少させる方法と
の２つの方法がある。
徐々に出力を減少させる場合には、Ｔ２において超音波
を加え始め、最高出力Ｂに達すると同時に徐々に出力を
減少させ、Ｔ４において出力Ａになると同時に超音波の
発振を停止する。この場合において、最高出力Ｂは、ボ
ール３１がパッド１１に入り込んでいない状態でボール
３１に対して加えられても、パッド１１にクラックが入
ったり、飛び散ったりしない程度の出力とする。また、
出力Ａはボール３１がパッド１１に入り込んだ状態で、
ボール３１に対して加えてもパッド１１にダメージが発
生しない程度の出力とする。
また、第１図（ｂ）に示すように超音波の出力を段階的
に減少させる場合は、Ｔ２において超音波の発振を始め
、最高出力Ｂに達したならば、Ｔ、までその状態を維持
し、Ｔ３からＴ４まではＡの出力で超音波を発振する。
この場合における最高出力Ｂ及び出力Ａは上記と同様に
設定しておく。
〈発明の効果〉 本発明に係るワイヤボンディング方法は、ボンディング
ワイヤの先端に形成されたボールがパッドに圧接されて
いる間に、前記ボールに加えられる超音波の出力を減少
させるようになっているので、以下に述べるような理由
から機械的強度が低い絶縁酸化膜にクランク等のダメー
ジが発生しない。
■ボールをパッドに圧接した直後は、ボールがパッドの
中にまだ入り込んでいないので、高い出力の超音波を加
えても、パッドの下に形成された絶縁酸化膜等にまで超
音波は伝わらない。
■ボールがパッドの中に入り込んでも、その状態におけ
る超音波の出力は既に低くなっているので、ボールに出
力される超音波で絶縁酸化膜にクランクが発生すること
がない。
本発明に係るワイヤボンディング方法で、金より硬度の
高い銅ワイヤをボンディングワイヤとしてワイヤボンデ
ィングを行った実験の結果を示す。
なお、この実験の結果はワイヤボンディング後のボンデ
ィングワイヤを硝酸で除去した後、加熱されたＮａＯＨ
水溶液でパッド及び絶縁酸化膜下のシリコン等をエツチ
ングすることにより、絶縁酸化膜に入ったクラックを顕
在化させて求めた。
従来の、ワイヤボンディング方法、すなわちボールがパ
ッドに圧接した後、一定出力の超音波を加えると、約９
０％の半導体チップにクランクが発生した。それに対し
て、本発明に係るワイヤボンディング方法では、クラン
クの発生率は減少することが確認された。
実験結果からも明らかなように、本発明に係るワイヤボ
ンディング方法による場合には、ワイヤボンディングに
よるクラック等のダメージがほとんど発生しないので、
より信頼性の高い半導体チップを提供することができる
。
さらに、ワイヤボンディング材料として金より硬度が高
い銅、銀を用いた場合には信頼性が高く、かつ安価な半
導体チップを提供することができる。
【図面の簡単な説明】
第１図は本発明に係るワイヤボンディング方法を示すタ
イムチャート、第２図はこのワイヤボンディング方法に
よるワイヤボンディングの説明図、第３図はワイヤボン
ディング方法を示す説明図、第４図は従来のワイヤボン
ディング方法を示すタイムチャート、第５図は従来のワ
イヤボンディング方法の問題点を示す説明図である。 １０・・・半導体チップ、１１・・・パッド、３０・・
・ボンディングワイヤ、３１・・・ボール。

Claims (1)

    【特許請求の範囲】
  1. （１）半導体チップのパッドとインナーリードとをボン
    ディングワイヤで接続するワイヤボンディング方法にお
    いて、ボンディングワイヤの先端に形成されたボールが
    前記パッドに圧接されている間に、前記ボールに加えら
    れる超音波の出力を減少させることを特徴とするワイヤ
    ボンディング方法。
JP63196375A 1988-08-05 1988-08-05 ワイヤボンディング方法 Pending JPH0244745A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP63196375A JPH0244745A (ja) 1988-08-05 1988-08-05 ワイヤボンディング方法
US07/386,519 US4993618A (en) 1988-08-05 1989-07-27 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63196375A JPH0244745A (ja) 1988-08-05 1988-08-05 ワイヤボンディング方法

Publications (1)

Publication Number Publication Date
JPH0244745A true JPH0244745A (ja) 1990-02-14

Family

ID=16356819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63196375A Pending JPH0244745A (ja) 1988-08-05 1988-08-05 ワイヤボンディング方法

Country Status (2)

Country Link
US (1) US4993618A (ja)
JP (1) JPH0244745A (ja)

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JP2017168735A (ja) * 2016-03-17 2017-09-21 豊田合成株式会社 ワイヤボンディング方法

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JPH088285B2 (ja) * 1990-02-23 1996-01-29 株式会社東芝 ワイヤボンディング方法
US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components
US5595330A (en) * 1994-08-24 1997-01-21 Verity Instruments, Inc. Power supply
US5661082A (en) * 1995-01-20 1997-08-26 Motorola, Inc. Process for forming a semiconductor device having a bond pad
US6152350A (en) * 1997-06-19 2000-11-28 Fuji Photo Film Co., Ltd. Ultrasonic welding device and method, and a magnetic tape cartridge reel welding device and method
EP2133915A1 (de) * 2008-06-09 2009-12-16 Micronas GmbH Halbleiteranordnung mit besonders gestalteten Bondleitungen und Verfahren zum Herstellen einer solchen Anordnung
JP6680239B2 (ja) * 2017-02-20 2020-04-15 日亜化学工業株式会社 発光装置の製造方法
US11517977B2 (en) * 2017-09-15 2022-12-06 Tech-Sonic, Inc. Dual cam servo weld splicer

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SU961900A1 (ru) * 1980-08-22 1982-09-30 Всесоюзный Научно-Исследовательский Проектно-Технологический Институт Токов Высокой Частоты Им.В.П.Вологдина Способ управлени процессом ультразвуковой сварки и устройство дл его осуществлени
JPS5950536A (ja) * 1982-09-16 1984-03-23 Toshiba Corp ワイヤボンデイング装置
JPS60101039A (ja) * 1983-11-09 1985-06-05 東洋化学株式会社 包装用袋体
US4603802A (en) * 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
US4696425A (en) * 1984-07-17 1987-09-29 Texas Instruments Incorporated Programmable ultrasonic power supply
JPH0815166B2 (ja) * 1985-03-14 1996-02-14 株式会社東芝 ワイヤボンデイング方法
JPS6341217A (ja) * 1986-08-05 1988-02-22 Mazda Motor Corp 車両のサスペンシヨン装置
JPS63124435A (ja) * 1986-11-12 1988-05-27 Mitsubishi Electric Corp ワイヤボンデイング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017168735A (ja) * 2016-03-17 2017-09-21 豊田合成株式会社 ワイヤボンディング方法

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Publication number Publication date
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