KR950701770A - 몇몇 집적회로 구성요소를 서로 본드 와이어 접속시키는 방법 및 장치(a method of and arrangement for bond wire connecting together gertain integrated circuit components) - Google Patents

몇몇 집적회로 구성요소를 서로 본드 와이어 접속시키는 방법 및 장치(a method of and arrangement for bond wire connecting together gertain integrated circuit components)

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Publication number
KR950701770A
KR950701770A KR1019940704149A KR19940704149A KR950701770A KR 950701770 A KR950701770 A KR 950701770A KR 1019940704149 A KR1019940704149 A KR 1019940704149A KR 19940704149 A KR19940704149 A KR 19940704149A KR 950701770 A KR950701770 A KR 950701770A
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South Korea
Prior art keywords
die
bonding
conductive
bond pads
component
Prior art date
Application number
KR1019940704149A
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English (en)
Inventor
란잔 제이. 매츄
아놀드 스미드
루 티. 뉴엔
Original Assignee
낸시 루크 루저스
내쇼날 세미컨덕터 코포레이션
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Publication date
Priority to US08/034,683 priority Critical patent/US5328079A/en
Priority to US08/034,683 priority
Application filed by 낸시 루크 루저스, 내쇼날 세미컨덕터 코포레이션 filed Critical 낸시 루크 루저스
Priority to PCT/US1994/002934 priority patent/WO1994022166A1/en
Publication of KR950701770A publication Critical patent/KR950701770A/ko

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    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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Abstract

본원에는 각각이 다이 입/출력 본드 패드(18)의 어레이 및 전도성 리드의 어레이를 포함하는 기판 또는 리드 프레임과 같은 다이 지지수단(12)을 갖는 하나 이상의 다이(16)를 포함하는 집적회로 패키지의 몇몇 구성요소가 개시되어 있다. 또한, 본원에는 열음파 또는 열압축 볼 본딩 도구를 사용하여 제2다이(34)의 본드 패드(38)에나 기판 또는 리드 프레임의 전도성 리드에 특정의 다이의 본드 패드를 와이어 본드 접속시키는 기술이 개시되어 있다. 이러한 기술에 의하면, 적어도 하나의 다이가 포함되어 있는 경우, 다이에 손상을 주지않는 방식으로 스티치 본딩에 의해 상기 다이의 본드 패드에 접속이 형성된다.

Description

몇몇 집적회로 구성요소를 서로 본드 와이어 접속시키는 방법 및 장치(A METHOD OF AND ARRANGEMENT FOR BOND WIRE CONNECTING TOGETHER GERTAIN INTEGRATED CIRCUIT COMPONENTS)

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

제1도는 기판상에 지지된 다이를 포함하는 집적회로 패키지의 일부를 개략적으로 예시한 도면,

제2도는 제1도와 유사하지만 전도성 리드와 다이 본드 패드를 전기적으로 접속시키는 용인될 수 없는 제2의 방법을 구체적으로 예시한 도면,

제3도 및 제4도는 제1도 및 제2도에 도시된 집적회로 패키지의 동일부분을 개략적으로 나타낸 도면이지만 다이 본드 패드 및 전도성 리드를 서로 전기접속시키는 신규한 열음파 또는 열압축 와이어 본딩 기술을 구체적으로 예시한 도면,

제5도는 제3도 및 제4도와 연관된 와이어 본딩 기술을 실시하는 바람직한 방법의 단계중 한 단계를 개략적으로 나타낸 도면,

제6도는 제3도 및 제4도의 연관된 와이어 본딩 기술이 다이와 다이의 접속을 형성하는데 사용되는 방법을 개략적으로 예시한 도면,

제7도는 제3도 및 제4도와 연관된 와이어 기술이 다이와 리드 프레임의 접속을 형성하는데 사용되는 방법을 개략적으로 예시한 도면,

제8도 및 제9도는 몇몇 구성 요소(미세한 피치 리드, 패드 또는 다른 그러한 전도성 접점을 갖는 것을 포함함)가 미세한 피치 본딩에 의해 서로 전기 접속되는 2가지 방법을 개략적으로 예시한 도면이다.

Claims (21)

  1. 제1 및 제2구성요소를 포함하는 전자 디바이스를 제조함에 있어서, (a) 상기 제2구성요소상에 전도성 범프를 형성하는 단계, 및 (b) 열음파 또는 열엽축 볼 본딩 도구를 사용하여, 우선 상기 제1구성요소에 전도성 본딩 와이어의 유리 단부를 볼 본딩시킨후에 상기 제2구성요소상의 전도성 범프에 전도성 본딩 와이어의 반대측 단부를 스치티 본딩함으로써 상기 구성요소 각각에 전도성 본딩 와이어를 접속시키는 단계를 포함하여, 상기 구성요소를 서로 전기접속시키는 방법.
  2. 제1항에 있어서, 상기 제2구성 요소가 다이의 일부를 형성하는 다이 본드 패드인 전기 접속 방법.
  3. 제2항에 있어서, 상기 제1구성 요소가 기판 또는 리드 프레임의 일부를 형성하는 전도성리드인 전기 접속 방법.
  4. 제2항에 있어서, 상기 제1구성 요소가 제2다이의 일부를 형성하는 다이 본드 패드인 전기 접속 방법.
  5. 다이 입/출력 본드 패드의 어레이를 포함하며 전도성 리드의 어레이를 포함하는 수단에 의해 지지되는 다이를 포함하는 집적 회로 패키지를 제조함에 있어서, (a) 해당하는 각각의 다이 본드 패드상에 전도성 범프를 형성하는 단계,및 (b) 열음파 또는 열압축 볼 본딩 도구를 사용하여, 우선 각각의 본딩 와이어의 유리 단부를 그에 해당하는 리드에 볼 본딩시킨후에 해당 다이본드 패드상의 전도성 범프에 상기 본딩 와이어의 반대측 단부를 스티치 본딩함으로써 각각의 리드 및 그에 해당하는 다이 본드 패드에 전도성 본딩 와이어를 접속시키는 단계를 포함하여, 상기 리드 각각을 상기 다이 본드 패드중 해당하는 다이 본드패드와 전기 접속시키는 방법.
  6. 제5항에 있어서, 상기 전도성 범프 각각은, 우선 상기 볼 본딩 도구를 사용하여 다이 본드 패드상에 전도성 본딩 와이어의 유리 단부를 볼 본딩한 후에, 동일한 도구를 사용하여, 볼 본드 및 스티치 본드가 서로 상기전도성 범프를 형성할 정도로 상기 볼 본딩된 단부에 바로 인접한 본딩 와이어상의 한 지점에서 볼 본딩된 단부에 동일 와이어를 스티치 본딩함으로써 사이 본드 패드상에 형성되는 전기 접속 방법.
  7. 제5항에 있어서, 상기 다이 본드 패드사이의 피치는 상기 리드사이의 피치보다 미세한 전기 접속 방법.
  8. 제5항에 있어서, 상기 다이를 지지하는 수단은 기판이며 그의 한 표면상에 상기 리드가 인쇄되어 있는 전기 접속 방법.
  9. 제5항에 있어서, 상기 다이를 지지하는 수단은 리드 프레임인 전기 접속 방법.
  10. 각각이 다이 입/출력 본드 패드의 어레이를 포함하는 제1 및 제2 다이를 포함하는 집적회로 패키지를 제조함에 있어서, (a) 제2다이의 다이 본드 패드상 각각에 전도성 범프를 형성하는 단계, 및 (b) 열음파 또는 열압축 볼 본딩 도구를 사용하여, 우선 각각의 본딩 와이어의 유리 단부를 상기 제1다이의 해당 다이 본드패드에 볼 본딩시킨후에, 상기 제2다이의 해당 다이 본드 패드상의 전도성 범프에 상기 본딩 와이어의 반대측 단부를 스티치 본딩함으로써 상기 제1다이의 각각의 다이 본드 패드 및 상기 제2 다이의 해당 다이 본드 패드에 전도성 본딩 와이어를 접속시키는 단계 를 포함하여, 상기 제1다이의 본드 패드 각각을 상기 제2다이의 다이 본드 패드중 해당 다이본드 패드와 전기접속시키는 방법.
  11. 제10항에 있어서, 상기 전도성 범프 각각은, 우선 상기 볼 본딩 도구를 사용하여 다이 본드 패드상에 전도성 본딩 와이어의 유리 단부를 볼 본딩한 후에, 동일한 도구를 사용하여, 볼 본드 및 스티치 본드가 서로 상기 전도성 범프를 형성할 정도로 볼 본딩된 단부에 바로 인접한 전도성 본딩 와이어 상의 한 지점에서 동일한 전도성 와이어를 볼 본딩된 단부에 스티치 본딩함으로써 볼 본딩된 단부상에 형성되는 전기 접속 방법.
  12. 제1 및 제2구성 요소를 포함하는 전자 디바이스에 있어서, (a) 상기 제2구성 요소상에 형성된 전도성 범프, 및 (b) 상기 구성요소 각각에 접속되어 있되, 한 단부에서는 상기 제1구성 요소에 볼 본딩되어 있고 반대측 단부에는 상기 제2구성 요소상의 전도성 범프에 스티치 본딩되어 있는 전도성 본딩 와이어를 포함하여, 상기 구성요소를 서로 전기 접속시키는 장치.
  13. 제12항에 있어서, 상기 제2구성 요소가 다이의 일부를 형성하는 다이 본드 패드인 전기 접속 장치.
  14. 제13항에 있어서, 상기 제1구성 요소가 기판 또는 리드 프레임의 일부를 형성하는 전도성 리드인 전기 접속 장치.
  15. 제13항에 있어서, 상기 제1구성 요소가 제2다이의 일부를 형성하는 다이 본드 패드인 전기 접속 장치.
  16. 다이 입/출력 본드 패드의 어레이를 포함하며 전도성 리드의 어레이를 포함하는 수단에 의해 지지되어 있는 다이를 포함하는 집적회로 패키지에 있어서, (a) 제2다이의 해당하는 각각의 다이 본드 패드상에 형성된 전도성 범프, 및 (b) 각각의 리드 및 그에 해당하는 다이 본드 패드에 접속되어 있되, 한 단부에서는 관련된 리드에 볼 본딩되어 있으며, 반대측 단부에는 해당 다이 본드 패드상의 전도성 범프에 스치티 본딩되어 있는 전도성 본딩 와이어를 포함하며, 상기 다이 본드 패드중 해당하는 다이 본드 패드와 상기 리드 각각을 전기 접속시키는 장치.
  17. 각각이 다이 입/출력 본드 패드의 어레이를 포함하는 제1및 제2다이를 포함하는 집적회로 패키지에 있어서, (a) 상기 제2다이의 해당하는 각각의 다이 본드 패드상에 형성된 전도성 범프, 및 (b) 상기 제1다이의 각각의 다이 본드 패드에 접속되어 있되, 한 단부에서는 상기 제1다이의 관련된 다이 본드 패드에 볼 본딩되어 있으며 반대측 단부에는 상기 제2다이의 해당 다이 본드 패드상의 전도성 범프에 스티치 본딩되어 있는 전도성 본딩 와이어를 포함하며, 상기 제2다이의 다이 본드 패드중 해당하는 다이 본드 패드와 상기 제1다이의 다이본드 패드 각각을 전기접속시키는 장치.
  18. 제1 및 제2구성 요소를 포함하되, 상기 제2구성 요소가 미세한 피치 전도성 접점의 어레이를 포함하는 전자 디바이스를 제조함에 있어서, (a) 상기 미세한 피치 접점상 각각에 전도성 범프를 형성하는 단계, 및 (b) 캐필러리를 포함하는 열음파 또는 열압축 볼 본딩 도구를 사용하여, 상기 제1구성요소의 접점 각각에 본딩와이어의 유리단부를 볼 본딩시킨후에 상기 제2구성요소의 해당하는 미세한 미치 접점상의 전도성 범프에 상기 본딩와이어의 반대측 단부를 스티치 본딩함으로써 상기 캐필러리로 부터의 방해없이 해당하는 접점의 각각의 쌍에 전도성 본딩 와이어를 미세 피치 본딩하는 단계를 포함하여, 상기 제1구성 요소의 일부를 형성하는 해당 접점과 상기 제2구성요소의 미세한 피치 접점의 어레이를 서로 접속시키는 방법.
  19. 제18항에 있어서, 상기 제2구성요소는 다이인 접속방법.
  20. 인접한 해당하는 전도성 접점의 어레이를 갖는 제1 및 제2구성요소를 포함하는 전자 디바이스를 제조함에 있어서, (a) 열음파 또는 열압축 볼 본딩 도구를 제공하는 단계, (b) 상기 도구를 사용하여, 우선 상기 제1구성요소상의 제1쌍의 접점에 제1의 전도성 본딩 와이어의 유리 단부를 볼 본딩시킨후에, 상기 제2구성요소상의 제1쌍의 접점과 제1의 전도성 본딩 와이어의 반대측 단부를 스티치 본딩함으로써 상기 접점의 제1의 해당쌍에 제1전도성 본딩와이어를 접속시키는 단계, (c) 상기 도구를 사용하여, 우선 상기 제2구성요소상의 제2쌍의 접점에 제2본딩 와이어의 반대측 단부를 스티치 본딩함으로써 상기 접점의 제1쌍에 바로 인접한 접점의 제2의 해당하는 쌍에 제2의 전도성 본딩 와이어를 접속시키는 단계, 및 (d) 접점의 연속쌍을 위해 단계 (b) 및 단계(c)를 반복하는 단계를 포함하여, 상기 접점의 해당하는 쌍을 서로 전기 접속시키는 방법.
  21. 제20항에 있어서, 스티치 본드를 수취하기전에 스티치 본드를 수취한 상기 쌍의 접점 각각은 스티치 본드가 형성되는 전도성 범프를 구비하는 전기접속 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940704149A 1993-03-19 1994-03-18 몇몇 집적회로 구성요소를 서로 본드 와이어 접속시키는 방법 및 장치(a method of and arrangement for bond wire connecting together gertain integrated circuit components) KR950701770A (ko)

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US08/034,683 US5328079A (en) 1993-03-19 1993-03-19 Method of and arrangement for bond wire connecting together certain integrated circuit components
US08/034,683 1993-03-19
PCT/US1994/002934 WO1994022166A1 (en) 1993-03-19 1994-03-18 A method of and arrangement for bond wire connecting together certain integrated circuit components

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