KR900007091A - 본딩방법 및 본딩장치 - Google Patents

본딩방법 및 본딩장치 Download PDF

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KR900007091A
KR900007091A KR1019890013732A KR890013732A KR900007091A KR 900007091 A KR900007091 A KR 900007091A KR 1019890013732 A KR1019890013732 A KR 1019890013732A KR 890013732 A KR890013732 A KR 890013732A KR 900007091 A KR900007091 A KR 900007091A
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South Korea
Prior art keywords
bonding
frequency
ball
wire rod
chip
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KR1019890013732A
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English (en)
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KR920008255B1 (ko
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미쓰기요 다니
히데오 시라이시
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미다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
가와이 노부유끼
가부시기가이샤 히다찌콤퓨터일렉트로닉스
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Publication of KR900007091A publication Critical patent/KR900007091A/ko
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Publication of KR920008255B1 publication Critical patent/KR920008255B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

내용 없음.

Description

본딩방법 및 본딩장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 선단에 볼을 형성한 선재(線材)를 본딩패스상에 배치한 상태를 나타내는 정면도.
제3도는 볼본딩한 본딩부의 위에 다시 겹쳐서 볼본딩한 상태를 나타내는 정면도.
제4도는 본원 발명의 본딩장치의 일예를 나타내는 개략구성도.
제6도는 본원 발명의 효과를 설명하기 위한 본딩부의 강도를 나타내는 도면.

Claims (7)

  1. 본딩패드상에 선단이 볼형상의 선재(線材)를 본딩하는 장치로서, 본딩패드상의 상기 선재의 볼을 가압하는 본딩칩과, 상기 본딩칩에 초음파를 인가하는 수단과, 상기 본딩칩에 고주파전류를 인가해서 가열하는 수단을 가진 것을 특징으로 하는 본딩장치.
  2. 제1항에 있어서, 상기 초음파의 진동수를 30KHz-90KHz의 범위의 어느 진동수로 하는 것을 특징으로 하는 본딩장치.
  3. 제1항에 있어서, 상기 고주파전류의 주파수를 200KHz-2KHz의 범위의 어느 주파수로 하는 것을 특징으로 하는 본딩장치.
  4. 본딩패드상에 선단이 볼형상의 선재를 본딩하는 방법으로서, 본딩패드상의 상기 선재의 볼을 본딩칩으로 가압하고, 상기 본딩칩에 초음파를 인가하고, 상기 본딩칩에 고주파전류를 인가해서 가열하는 것을 특징으로 하는 본딩방법.
  5. 제4항에 있어서, 상기 초음파의 진동수를 30KHz-90KHz의 범위의 어느 진동수로 하는 것을 특징으로 하는 본딩방법.
  6. 제4항에 있어서, 상기 고주파전류의 주파수를 200KHz-2KHz의 범위의 어느 주파수로 하는 것을 특징으로 하는 본딩방법.
  7. 볼본딩에 의해 본딩패드상에 선재가 본딩된 다시 별도의 상기 선재가 상기 볼의 상면의 형상이 평탄해지도록 겹쳐서 본딩된 것을 특징으로 하는 회로기판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890013732A 1988-10-11 1989-09-25 본딩방법 및 본딩장치 KR920008255B1 (ko)

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JP63-253763 1988-10-11
JP88-253763 1988-10-11
JP63253763A JPH02101754A (ja) 1988-10-11 1988-10-11 ボンディング方法及びボンディング装置

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KR920008255B1 (ko) 1992-09-25
US5002217A (en) 1991-03-26
JPH02101754A (ja) 1990-04-13
DE3933982C2 (de) 1994-05-11

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