BR8300105A - Aparelho e metodo para aplicar material de solda em superficies metalicas - Google Patents

Aparelho e metodo para aplicar material de solda em superficies metalicas

Info

Publication number
BR8300105A
BR8300105A BR8300105A BR8300105A BR8300105A BR 8300105 A BR8300105 A BR 8300105A BR 8300105 A BR8300105 A BR 8300105A BR 8300105 A BR8300105 A BR 8300105A BR 8300105 A BR8300105 A BR 8300105A
Authority
BR
Brazil
Prior art keywords
solder
soldering
printed circuit
wave
circuit boards
Prior art date
Application number
BR8300105A
Other languages
English (en)
Inventor
William H Down
Original Assignee
Electrovert Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovert Ltd filed Critical Electrovert Ltd
Publication of BR8300105A publication Critical patent/BR8300105A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Arc Welding In General (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Developing Agents For Electrophotography (AREA)
BR8300105A 1982-01-12 1983-01-07 Aparelho e metodo para aplicar material de solda em superficies metalicas BR8300105A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/338,952 US4530457A (en) 1982-01-12 1982-01-12 Wave-soldering of printed circuit boards

Publications (1)

Publication Number Publication Date
BR8300105A true BR8300105A (pt) 1983-10-04

Family

ID=23326840

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8300105A BR8300105A (pt) 1982-01-12 1983-01-07 Aparelho e metodo para aplicar material de solda em superficies metalicas

Country Status (7)

Country Link
US (1) US4530457A (pt)
EP (1) EP0083680B1 (pt)
JP (2) JPS58122173A (pt)
AT (1) ATE27931T1 (pt)
BR (1) BR8300105A (pt)
CA (1) CA1196426A (pt)
DE (1) DE3276624D1 (pt)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824010A (en) * 1980-12-26 1989-04-25 Matsushita Electric Industrial Co., Ltd. Process and apparatus for soldering printed circuit boards
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
US4666077A (en) * 1983-02-28 1987-05-19 Electrovert Solder pot for wave soldering machine
EP0140997A1 (en) * 1983-11-04 1985-05-15 SOLTEC Besloten Vennootschap Flow soldering apparatus
US4637541A (en) * 1985-06-28 1987-01-20 Unit Industries, Inc. Circuit board soldering device
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device
JPS6240967A (ja) * 1985-08-19 1987-02-21 Tamura Kaken Kk はんだ付け方法
US4676426A (en) * 1986-03-10 1987-06-30 Ibm Corp. Solder leveling technique
FR2598055B1 (fr) * 1986-04-28 1990-08-31 Talco Sa Procede de brasage de composants de surface sur un circuit imprime
DE3765359D1 (de) * 1986-08-13 1990-11-08 Senju Metal Industry Co Loetgeraet des springbrunnentyps.
KR920008948B1 (ko) * 1987-02-12 1992-10-12 니혼 덴네쯔 게이기 가부시끼가이샤 프린트 기판의 납땜방법 및 그의 장치
US4891472A (en) * 1987-09-10 1990-01-02 Siemens Aktiengesellschaft Interconnects on a printed circuit board having connecting points for an electronic component with a plurality of terminals
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating
US4886201A (en) * 1988-06-09 1989-12-12 Electrovert Limited Solder wave nozzle construction
FR2638051B1 (fr) * 1988-10-13 1990-12-28 Sagem Procede de soudage a la vague et machine pour la mise en oeuvre du procede
JP2504122Y2 (ja) * 1990-08-01 1996-07-10 大阪アサヒ化学株式会社 噴流半田付け装置
JP2504129Y2 (ja) * 1990-09-13 1996-07-10 大阪アサヒ化学株式会社 噴流半田付け装置
JPH04172174A (ja) * 1990-10-31 1992-06-19 Yokota Kikai Kk 自動半田付け方法及び装置
GB9109899D0 (en) * 1991-05-08 1991-07-03 Lymn Peter P A Solder leveller
FR2680070B1 (fr) * 1991-07-30 1993-12-10 Applications Gles Elect Meca Carte de circuit imprime pour soudage a la vague.
NL9200060A (nl) * 1992-01-14 1993-08-02 Soltec Bv Soldeermachine met verbeterde configuratie van soldeerstromen.
US5934540A (en) * 1997-07-31 1999-08-10 Teledyne Industries, Inc. Horizontal soldering system with oil blanket
GB2366536A (en) * 2000-09-11 2002-03-13 Invicta Contract Eng Ltd wave soldering machine
MY124946A (en) * 2000-10-23 2006-07-31 Senju Metal Industry Co Automatic wave soldering apparatus and method
US7918383B2 (en) * 2004-09-01 2011-04-05 Micron Technology, Inc. Methods for placing substrates in contact with molten solder
US20060102703A1 (en) * 2004-11-12 2006-05-18 Salman Akhtar Circuit board soldering method utilizing thermal mass compensating pallets
WO2007131360A1 (en) * 2006-05-16 2007-11-22 Celestica International Inc. Laminar flow well
JP2008147203A (ja) * 2006-12-05 2008-06-26 Sanken Electric Co Ltd 半導体発光装置
US9370838B2 (en) 2014-08-21 2016-06-21 Illinois Tool Works Inc. Wave soldering nozzle system and method of wave soldering
US10029326B2 (en) 2016-10-26 2018-07-24 Illinois Tool Works Inc. Wave soldering nozzle having automatic adjustable throat width
US10780516B2 (en) 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB862722A (en) * 1958-08-26 1961-03-15 Sylvania Electric Prod Wave soldering of circuit components to electrical circuit boards
GB1099330A (en) * 1966-05-03 1968-01-17 Philips Electronic Associated Improvements in and relating to soldering machines
US3989180A (en) * 1971-11-10 1976-11-02 Electrovert Manufacturing Company, Limited Wave soldering with supported inclined wave
JPS5051449A (pt) * 1973-09-07 1975-05-08
CA1002391A (en) * 1974-10-07 1976-12-28 Electrovert Ltd. - Electrovert Ltee Wave-soldering of printed circuits
JPS5327227A (en) * 1976-08-25 1978-03-14 Nisshin Kogyo Kk Waterproofing material and heat insulating waterproof material
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
US4101066A (en) * 1977-08-31 1978-07-18 Western Electric Co., Inc. Soldering method and apparatus utilizing dual solder waves of different variable velocities
JPS56112094A (en) * 1980-02-06 1981-09-04 Hitachi Netsu Kigu Kk High frequency heater
DE3176527D1 (en) * 1980-12-26 1987-12-17 Matsushita Electric Ind Co Ltd Apparatus for soldering chip type components
EP0058766B1 (en) * 1981-02-23 1985-08-07 Matsushita Electric Industrial Co., Ltd. Soldering apparatus
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
JPS6051940B2 (ja) * 1981-06-16 1985-11-16 松下電器産業株式会社 プリント基板半田付装置

Also Published As

Publication number Publication date
JPS6037261A (ja) 1985-02-26
US4530457A (en) 1985-07-23
CA1196426A (en) 1985-11-05
EP0083680B1 (en) 1987-06-24
EP0083680A1 (en) 1983-07-20
JPS58122173A (ja) 1983-07-20
ATE27931T1 (de) 1987-07-15
DE3276624D1 (en) 1987-07-30

Similar Documents

Publication Publication Date Title
BR8300105A (pt) Aparelho e metodo para aplicar material de solda em superficies metalicas
DE3376472D1 (en) Solder and braze fluxes and processes for using the same
WO1986004848A1 (en) Wave soldering with timed subsequent reflow soldering
US5568894A (en) Applying flux to a solder wave for wave soldering an element
ATE7868T1 (de) Vorrichtung zum ausloeten elektronischer bauteile aus leiterplatten.
EP0119272A4 (en) WELDING METHOD AND DEVICE FOR PRINTED CIRCUIT PLATES.
US20020011511A1 (en) Apparatus and method for soldering electronic components to printed circuit boards
GB2124835B (en) Current printed circuit boards
DE3176527D1 (en) Apparatus for soldering chip type components
US5720426A (en) Method of wave-soldering assembled units
GB2143759B (en) Method of laser soldering
MY113624A (en) Soldering apparatus and a method thereof
JPS57165169A (en) Soldering method for electrical parts
SU1558589A1 (ru) Устройство дл пайки микросхем на печатные платы
JPS5586679A (en) Method and apparatus for continuous soldering
PL243877A1 (en) Solder for contact material soldering purpose
CA2155351A1 (en) Solder Nozzle with Gas Knife Jet
SG67423A1 (en) Fluxless laser reflow with template for solder balls of bga packaging
Selvaduray et al. Effect of flux type and surface coating on the wetting force between copper and eutectic Pb-Sn solder
JPS57190767A (en) Soldering method for chip parts
JPS5545501A (en) Soldering tool
JPS6450596A (en) Method of soldering for surface mounting component
JPS5832488A (ja) 印刷配線基板装置
Daly Method for Laser Soldering
IT8722933A0 (it) Apparecchio portatile che utilizza lega per saldature fusa per procedimenti quali la saldatura ela dissaldatura.

Legal Events

Date Code Title Description
B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 07/01/98