DE3276624D1 - Wavesoldering of chips - Google Patents

Wavesoldering of chips

Info

Publication number
DE3276624D1
DE3276624D1 DE8282101748T DE3276624T DE3276624D1 DE 3276624 D1 DE3276624 D1 DE 3276624D1 DE 8282101748 T DE8282101748 T DE 8282101748T DE 3276624 T DE3276624 T DE 3276624T DE 3276624 D1 DE3276624 D1 DE 3276624D1
Authority
DE
Germany
Prior art keywords
solder
soldering
printed circuit
wave
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282101748T
Other languages
English (en)
Inventor
William Henry Down
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrovert Ltd
Original Assignee
Electrovert Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovert Ltd filed Critical Electrovert Ltd
Application granted granted Critical
Publication of DE3276624D1 publication Critical patent/DE3276624D1/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Arc Welding In General (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE8282101748T 1982-01-12 1982-03-05 Wavesoldering of chips Expired DE3276624D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/338,952 US4530457A (en) 1982-01-12 1982-01-12 Wave-soldering of printed circuit boards

Publications (1)

Publication Number Publication Date
DE3276624D1 true DE3276624D1 (en) 1987-07-30

Family

ID=23326840

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282101748T Expired DE3276624D1 (en) 1982-01-12 1982-03-05 Wavesoldering of chips

Country Status (7)

Country Link
US (1) US4530457A (de)
EP (1) EP0083680B1 (de)
JP (2) JPS58122173A (de)
AT (1) ATE27931T1 (de)
BR (1) BR8300105A (de)
CA (1) CA1196426A (de)
DE (1) DE3276624D1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824010A (en) * 1980-12-26 1989-04-25 Matsushita Electric Industrial Co., Ltd. Process and apparatus for soldering printed circuit boards
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
US4666077A (en) * 1983-02-28 1987-05-19 Electrovert Solder pot for wave soldering machine
EP0140997A1 (de) * 1983-11-04 1985-05-15 SOLTEC Besloten Vennootschap Schwall-Lötvorrichtung
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device
US4637541A (en) * 1985-06-28 1987-01-20 Unit Industries, Inc. Circuit board soldering device
JPS6240967A (ja) * 1985-08-19 1987-02-21 Tamura Kaken Kk はんだ付け方法
US4676426A (en) * 1986-03-10 1987-06-30 Ibm Corp. Solder leveling technique
FR2598055B1 (fr) * 1986-04-28 1990-08-31 Talco Sa Procede de brasage de composants de surface sur un circuit imprime
DE3765359D1 (de) * 1986-08-13 1990-11-08 Senju Metal Industry Co Loetgeraet des springbrunnentyps.
KR920008948B1 (ko) * 1987-02-12 1992-10-12 니혼 덴네쯔 게이기 가부시끼가이샤 프린트 기판의 납땜방법 및 그의 장치
US4891472A (en) * 1987-09-10 1990-01-02 Siemens Aktiengesellschaft Interconnects on a printed circuit board having connecting points for an electronic component with a plurality of terminals
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating
US4886201A (en) * 1988-06-09 1989-12-12 Electrovert Limited Solder wave nozzle construction
FR2638051B1 (fr) * 1988-10-13 1990-12-28 Sagem Procede de soudage a la vague et machine pour la mise en oeuvre du procede
JP2504122Y2 (ja) * 1990-08-01 1996-07-10 大阪アサヒ化学株式会社 噴流半田付け装置
JP2504129Y2 (ja) * 1990-09-13 1996-07-10 大阪アサヒ化学株式会社 噴流半田付け装置
JPH04172174A (ja) * 1990-10-31 1992-06-19 Yokota Kikai Kk 自動半田付け方法及び装置
GB9109899D0 (en) * 1991-05-08 1991-07-03 Lymn Peter P A Solder leveller
FR2680070B1 (fr) * 1991-07-30 1993-12-10 Applications Gles Elect Meca Carte de circuit imprime pour soudage a la vague.
NL9200060A (nl) * 1992-01-14 1993-08-02 Soltec Bv Soldeermachine met verbeterde configuratie van soldeerstromen.
US5934540A (en) * 1997-07-31 1999-08-10 Teledyne Industries, Inc. Horizontal soldering system with oil blanket
GB2366536A (en) * 2000-09-11 2002-03-13 Invicta Contract Eng Ltd wave soldering machine
MY124946A (en) * 2000-10-23 2006-07-31 Senju Metal Industry Co Automatic wave soldering apparatus and method
US7918383B2 (en) * 2004-09-01 2011-04-05 Micron Technology, Inc. Methods for placing substrates in contact with molten solder
US20060102703A1 (en) * 2004-11-12 2006-05-18 Salman Akhtar Circuit board soldering method utilizing thermal mass compensating pallets
CA2652436A1 (en) * 2006-05-16 2007-11-22 Celestica International Inc. Laminar flow well
JP2008147203A (ja) * 2006-12-05 2008-06-26 Sanken Electric Co Ltd 半導体発光装置
US9370838B2 (en) 2014-08-21 2016-06-21 Illinois Tool Works Inc. Wave soldering nozzle system and method of wave soldering
US10029326B2 (en) 2016-10-26 2018-07-24 Illinois Tool Works Inc. Wave soldering nozzle having automatic adjustable throat width
US10780516B2 (en) 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB862722A (en) * 1958-08-26 1961-03-15 Sylvania Electric Prod Wave soldering of circuit components to electrical circuit boards
GB1099330A (en) * 1966-05-03 1968-01-17 Philips Electronic Associated Improvements in and relating to soldering machines
US3989180A (en) * 1971-11-10 1976-11-02 Electrovert Manufacturing Company, Limited Wave soldering with supported inclined wave
JPS5051449A (de) * 1973-09-07 1975-05-08
CA1002391A (en) * 1974-10-07 1976-12-28 Electrovert Ltd. - Electrovert Ltee Wave-soldering of printed circuits
JPS5327227A (en) * 1976-08-25 1978-03-14 Nisshin Kogyo Kk Waterproofing material and heat insulating waterproof material
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
US4101066A (en) * 1977-08-31 1978-07-18 Western Electric Co., Inc. Soldering method and apparatus utilizing dual solder waves of different variable velocities
JPS56112094A (en) * 1980-02-06 1981-09-04 Hitachi Netsu Kigu Kk High frequency heater
EP0055323B1 (de) * 1980-12-26 1987-11-11 Matsushita Electric Industrial Co., Ltd. Einrichtung zum Löten von chipartigen Bauteilen
EP0058766B1 (de) * 1981-02-23 1985-08-07 Matsushita Electric Industrial Co., Ltd. Lötapparat
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
JPS6051940B2 (ja) * 1981-06-16 1985-11-16 松下電器産業株式会社 プリント基板半田付装置

Also Published As

Publication number Publication date
CA1196426A (en) 1985-11-05
EP0083680B1 (de) 1987-06-24
US4530457A (en) 1985-07-23
EP0083680A1 (de) 1983-07-20
BR8300105A (pt) 1983-10-04
ATE27931T1 (de) 1987-07-15
JPS58122173A (ja) 1983-07-20
JPS6037261A (ja) 1985-02-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee