SG67423A1 - Fluxless laser reflow with template for solder balls of bga packaging - Google Patents

Fluxless laser reflow with template for solder balls of bga packaging

Info

Publication number
SG67423A1
SG67423A1 SG1997003591A SG1997003591A SG67423A1 SG 67423 A1 SG67423 A1 SG 67423A1 SG 1997003591 A SG1997003591 A SG 1997003591A SG 1997003591 A SG1997003591 A SG 1997003591A SG 67423 A1 SG67423 A1 SG 67423A1
Authority
SG
Singapore
Prior art keywords
template
solder balls
bga packaging
laser reflow
fluxless laser
Prior art date
Application number
SG1997003591A
Inventor
Yun Cheng Cai
Tay Hock Lau
Original Assignee
Advanced Systems Automation Li
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation Li filed Critical Advanced Systems Automation Li
Priority to SG1997003591A priority Critical patent/SG67423A1/en
Priority to TW087106696A priority patent/TW399275B/en
Priority to PCT/SG1998/000054 priority patent/WO1999017593A1/en
Publication of SG67423A1 publication Critical patent/SG67423A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
SG1997003591A 1997-09-26 1997-09-26 Fluxless laser reflow with template for solder balls of bga packaging SG67423A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG1997003591A SG67423A1 (en) 1997-09-26 1997-09-26 Fluxless laser reflow with template for solder balls of bga packaging
TW087106696A TW399275B (en) 1997-09-26 1998-04-30 A system of solder ball placement and fluxless laser reflow of ball grid array packaging of an IC chip with a substrate having an array of pads, and an apparatus for solder ball placement of ball grid array packaging of an IC chip with a substrate having
PCT/SG1998/000054 WO1999017593A1 (en) 1997-09-26 1998-07-06 Fluxless laser reflow with template for solder balls of bga packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1997003591A SG67423A1 (en) 1997-09-26 1997-09-26 Fluxless laser reflow with template for solder balls of bga packaging

Publications (1)

Publication Number Publication Date
SG67423A1 true SG67423A1 (en) 1999-09-21

Family

ID=20429748

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997003591A SG67423A1 (en) 1997-09-26 1997-09-26 Fluxless laser reflow with template for solder balls of bga packaging

Country Status (3)

Country Link
SG (1) SG67423A1 (en)
TW (1) TW399275B (en)
WO (1) WO1999017593A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4068304B2 (en) * 1998-08-25 2008-03-26 ピーエーシー ティーイーシーエイチ − パッケージング テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Solder material shaped parts placement, remelting method and apparatus thereof
US7003874B1 (en) 1998-09-03 2006-02-28 Micron Technology, Inc. Methods of bonding solder balls to bond pads on a substrate
CN113634890A (en) * 2020-05-11 2021-11-12 三赢科技（深圳）有限公司 Laser welding system and laser welding method

Also Published As

Publication number Publication date
TW399275B (en) 2000-07-21
WO1999017593A1 (en) 1999-04-08

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