KR910002039B1 - 반도체기억장치의 제조방법 - Google Patents
반도체기억장치의 제조방법 Download PDFInfo
- Publication number
- KR910002039B1 KR910002039B1 KR1019870004316A KR870004316A KR910002039B1 KR 910002039 B1 KR910002039 B1 KR 910002039B1 KR 1019870004316 A KR1019870004316 A KR 1019870004316A KR 870004316 A KR870004316 A KR 870004316A KR 910002039 B1 KR910002039 B1 KR 910002039B1
- Authority
- KR
- South Korea
- Prior art keywords
- insulating film
- capacitor
- electrode
- forming
- relay electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/038—Making the capacitor or connections thereto the capacitor being in a trench in the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61-102456 | 1986-05-02 | ||
| JP61102456A JPS62259464A (ja) | 1986-05-02 | 1986-05-02 | 半導体記憶装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR870011695A KR870011695A (ko) | 1987-12-26 |
| KR910002039B1 true KR910002039B1 (ko) | 1991-03-30 |
Family
ID=14327968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019870004316A Expired KR910002039B1 (ko) | 1986-05-02 | 1987-05-02 | 반도체기억장치의 제조방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4784969A (enExample) |
| JP (1) | JPS62259464A (enExample) |
| KR (1) | KR910002039B1 (enExample) |
| DE (1) | DE3714338A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0824169B2 (ja) * | 1989-05-10 | 1996-03-06 | 富士通株式会社 | 半導体記憶装置の製造方法 |
| US5065273A (en) * | 1990-12-04 | 1991-11-12 | International Business Machines Corporation | High capacity DRAM trench capacitor and methods of fabricating same |
| DE4132140A1 (de) * | 1991-09-26 | 1993-04-08 | Siemens Ag | Verfahren zur herstellung einer selbstjustierten kontaktlochanordnung und selbstjustierte kontaktlochanordnung |
| US5395784A (en) * | 1993-04-14 | 1995-03-07 | Industrial Technology Research Institute | Method of manufacturing low leakage and long retention time DRAM |
| US5406515A (en) * | 1993-12-01 | 1995-04-11 | International Business Machines Corporation | Method for fabricating low leakage substrate plate trench DRAM cells and devices formed thereby |
| US6750091B1 (en) * | 1996-03-01 | 2004-06-15 | Micron Technology | Diode formation method |
| US5998821A (en) * | 1997-05-21 | 1999-12-07 | Kabushiki Kaisha Toshiba | Dynamic ram structure having a trench capacitor |
| JP2003197770A (ja) * | 2001-12-25 | 2003-07-11 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| CA2652424C (en) * | 2006-05-18 | 2016-01-05 | Smart Medical Systems Ltd. | Flexible endoscope system and functionality |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812739B2 (ja) * | 1975-05-07 | 1983-03-10 | 株式会社日立製作所 | 半導体記憶装置 |
| DE3243125A1 (de) * | 1982-11-22 | 1984-05-24 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von mos-transistoren mit flachen source/drain-gebieten, selbstjustierten polysiliziumkontakten und kurzen kanallaengen |
| JPS60152058A (ja) * | 1984-01-20 | 1985-08-10 | Toshiba Corp | 半導体記憶装置 |
| JPS60175448A (ja) * | 1984-02-21 | 1985-09-09 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
| US4658283A (en) * | 1984-07-25 | 1987-04-14 | Hitachi, Ltd. | Semiconductor integrated circuit device having a carrier trapping trench arrangement |
| EP0201706B1 (en) * | 1985-04-01 | 1991-09-18 | Nec Corporation | Dynamic random access memory device having a plurality of improved one-transistor type memory cells |
-
1986
- 1986-05-02 JP JP61102456A patent/JPS62259464A/ja active Pending
-
1987
- 1987-04-28 US US07/043,444 patent/US4784969A/en not_active Expired - Lifetime
- 1987-04-29 DE DE19873714338 patent/DE3714338A1/de active Granted
- 1987-05-02 KR KR1019870004316A patent/KR910002039B1/ko not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| KR870011695A (ko) | 1987-12-26 |
| DE3714338C2 (enExample) | 1991-12-19 |
| US4784969A (en) | 1988-11-15 |
| JPS62259464A (ja) | 1987-11-11 |
| DE3714338A1 (de) | 1987-11-05 |
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| JP2778579B2 (ja) | 半導体装置 |
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