KR900017056A - 저 인더런스 세라믹 캐패시터의 박막 필름 마무리부 형성 방법 및 그 방법으로 제조된 제품 - Google Patents
저 인더런스 세라믹 캐패시터의 박막 필름 마무리부 형성 방법 및 그 방법으로 제조된 제품 Download PDFInfo
- Publication number
- KR900017056A KR900017056A KR1019890016627A KR890016627A KR900017056A KR 900017056 A KR900017056 A KR 900017056A KR 1019890016627 A KR1019890016627 A KR 1019890016627A KR 890016627 A KR890016627 A KR 890016627A KR 900017056 A KR900017056 A KR 900017056A
- Authority
- KR
- South Korea
- Prior art keywords
- capacitor
- layer
- ceramic capacitor
- metal layer
- thin film
- Prior art date
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 3
- 238000000034 method Methods 0.000 title claims 12
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
- 239000003990 capacitor Substances 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910001080 W alloy Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 230000000873 masking effect Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 238000001771 vacuum deposition Methods 0.000 claims 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 전극 연결 탭을 관통하여 도시한 세라믹 캐패시터의 개략적 수직 관통 단면도,
제2도는 최초 폴리싱 단계이후의 제1도에 대한 단면도,
제3도는 본 발명에 따라 최종 폴리싱 단계를 거친 제1도 및 제2도에 대한 단면도,
제4도는 캐패시터 표면이 금속화되고 땜납볼이 금속화된 쇼팅바에 고정된 이후의 제1도 내지 3도의 단면도,
제5도는 세라믹 표면에 대한 쇼팅 바 및/또는 땜납 볼의 접착성과 관계하여 최종 연마 입자 크기를 비교하는 그래프.
Claims (8)
- 제1표면상에 나란히 배치된 도전성 탭을 갖는 저인덕턴스의 고품질 탭형 세라믹 캐패시터를 마무리하는 방법에 있어서, 소결된 상기 캐괘시터의 상기 제1표면을 연마하여 전체적으로 평탄한 형상을 형성하고, 약 2마이크론 내지 약 10마이크론 범위의 평균 입자 치수를 갖는 연마 폴리싱(polishing)매질을 이용하여 상기 표면을 폴리싱하고, 상기 탭들이 배치된 부분들을 노출시키면서 타부분들을 덮도록 상기 표면을 마스킹하고, 진공 증착 기술로 상기 마스크를 통해서 상기 표면상에 하나 이상의 금속층을 증착시키는 단계로 구성되는 것을 특징으로 하는 마무리 방법.
- 제1항에 있어 서, 상기 금속층들의 결합 두께가 약 5,000옹스트롬 내지 40,000옹스트롬인 것을 특징으로하는 방법.
- 제2항에 있어서. 상기 금속층이, 상기 표면에 직접 적용되며 필수적으로 텅스텐과 티타늄 합금으로 구성되는 제1층, 상기 제1층을 덮고 필수적으로 알루미늄으로 구성되는 제2층 및 상기 제2층을 덮고 필수적으로 텅스텐과 티타늄 합금으로 구성되는 제3층으로 구성되는 것을 특징으로하는 방법.
- 제2항에 있어서. 상기 마스크를 통해서 상기 금속층상의 선택된 위치에 하나 이상의 3차원 땜납 덩어리를 접합하는 단계를 표함하는 것을 특징으로하는 방법.
- 제1항의 방법에 따라 제조된 캐패시터.
- 제2항의 방법에 따라 제조된 캐패시터.
- 제3항의 방법에 따라 제조된 캐패시터.
- 제4항의 방법에 따라 제조된 캐패시터.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/332,993 US4862318A (en) | 1989-04-04 | 1989-04-04 | Method of forming thin film terminations of low inductance ceramic capacitors and resultant article |
US07/332993 | 1989-04-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR900017056A true KR900017056A (ko) | 1990-11-15 |
Family
ID=23300795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890016627A KR900017056A (ko) | 1989-04-04 | 1989-11-16 | 저 인더런스 세라믹 캐패시터의 박막 필름 마무리부 형성 방법 및 그 방법으로 제조된 제품 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4862318A (ko) |
JP (1) | JPH02288213A (ko) |
KR (1) | KR900017056A (ko) |
DE (1) | DE3936579A1 (ko) |
FR (1) | FR2645337A1 (ko) |
GB (1) | GB2230140B (ko) |
IT (1) | IT1237776B (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298338A (en) * | 1990-06-15 | 1994-03-29 | Hitachi Metals, Ltd. | Titanium-tungsten target material and manufacturing method thereof |
US5306569A (en) * | 1990-06-15 | 1994-04-26 | Hitachi Metals, Ltd. | Titanium-tungsten target material and manufacturing method thereof |
JPH0480762A (ja) * | 1990-07-23 | 1992-03-13 | Canon Inc | 位置検出装置及びその検出方法 |
US5345361A (en) * | 1992-08-24 | 1994-09-06 | Murata Erie North America, Inc. | Shorted trimmable composite multilayer capacitor and method |
JP3330836B2 (ja) * | 1997-01-22 | 2002-09-30 | 太陽誘電株式会社 | 積層電子部品の製造方法 |
JP3161362B2 (ja) * | 1997-05-01 | 2001-04-25 | 富士ゼロックス株式会社 | 微小構造体、その製造方法、その製造装置、基板および成形型 |
US5880925A (en) | 1997-06-27 | 1999-03-09 | Avx Corporation | Surface mount multilayer capacitor |
US6266228B1 (en) | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
US6266229B1 (en) | 1997-11-10 | 2001-07-24 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
JP2991175B2 (ja) | 1997-11-10 | 1999-12-20 | 株式会社村田製作所 | 積層コンデンサ |
US6292350B1 (en) | 1997-11-10 | 2001-09-18 | Murata Manufacturing, Co., Ltd | Multilayer capacitor |
US6549395B1 (en) | 1997-11-14 | 2003-04-15 | Murata Manufacturing Co., Ltd | Multilayer capacitor |
US6678927B1 (en) * | 1997-11-24 | 2004-01-20 | Avx Corporation | Miniature surface mount capacitor and method of making same |
US6011683A (en) * | 1997-12-29 | 2000-01-04 | Texas Instruments Incorporated | Thin multilayer ceramic capacitors |
JP3476127B2 (ja) | 1999-05-10 | 2003-12-10 | 株式会社村田製作所 | 積層コンデンサ |
JP3548821B2 (ja) | 1999-05-10 | 2004-07-28 | 株式会社村田製作所 | 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路 |
US6327134B1 (en) | 1999-10-18 | 2001-12-04 | Murata Manufacturing Co., Ltd. | Multi-layer capacitor, wiring board, and high-frequency circuit |
JP3489729B2 (ja) | 1999-11-19 | 2004-01-26 | 株式会社村田製作所 | 積層コンデンサ、配線基板、デカップリング回路および高周波回路 |
US6950300B2 (en) * | 2003-05-06 | 2005-09-27 | Marvell World Trade Ltd. | Ultra low inductance multi layer ceramic capacitor |
US20080314963A1 (en) * | 2006-07-03 | 2008-12-25 | Kulicke And Soffa Industries, Inc. | Bonding Tool With Improved Finish |
US10141277B2 (en) * | 2017-03-31 | 2018-11-27 | International Business Machines Corporation | Monolithic decoupling capacitor between solder bumps |
CN112750978B (zh) * | 2020-12-30 | 2022-03-15 | 珠海冠宇电池股份有限公司 | 极片及电池 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3436818A (en) * | 1965-12-13 | 1969-04-08 | Ibm | Method of fabricating a bonded joint |
US3621442A (en) * | 1968-11-07 | 1971-11-16 | Allen Bradley Co | Terminal connection of electronic devices |
FR2159848A5 (ko) * | 1971-11-05 | 1973-06-22 | Bosch | |
US4328530A (en) * | 1980-06-30 | 1982-05-04 | International Business Machines Corporation | Multiple layer, ceramic carrier for high switching speed VLSI chips |
US4439813A (en) * | 1981-07-21 | 1984-03-27 | Ibm Corporation | Thin film discrete decoupling capacitor |
US4419714A (en) * | 1982-04-02 | 1983-12-06 | International Business Machines Corporation | Low inductance ceramic capacitor and method for its making |
US4430690A (en) * | 1982-10-07 | 1984-02-07 | International Business Machines Corporation | Low inductance MLC capacitor with metal impregnation and solder bar contact |
US4661192A (en) * | 1985-08-22 | 1987-04-28 | Motorola, Inc. | Low cost integrated circuit bonding process |
DE3725454A1 (de) * | 1987-07-31 | 1989-02-09 | Siemens Ag | Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes |
-
1989
- 1989-04-04 US US07/332,993 patent/US4862318A/en not_active Expired - Lifetime
- 1989-09-19 GB GB8921195A patent/GB2230140B/en not_active Expired - Fee Related
- 1989-11-02 JP JP1287314A patent/JPH02288213A/ja active Granted
- 1989-11-03 DE DE3936579A patent/DE3936579A1/de not_active Ceased
- 1989-11-13 FR FR8914864A patent/FR2645337A1/fr not_active Withdrawn
- 1989-11-16 IT IT02240589A patent/IT1237776B/it active IP Right Grant
- 1989-11-16 KR KR1019890016627A patent/KR900017056A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE3936579A1 (de) | 1990-10-11 |
IT8922405A0 (it) | 1989-11-16 |
GB2230140B (en) | 1994-04-27 |
IT1237776B (it) | 1993-06-17 |
US4862318A (en) | 1989-08-29 |
FR2645337A1 (fr) | 1990-10-05 |
GB8921195D0 (en) | 1989-11-08 |
JPH02288213A (ja) | 1990-11-28 |
JPH0531285B2 (ko) | 1993-05-12 |
GB2230140A (en) | 1990-10-10 |
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