KR900015369A - 다이본더의 웨이퍼 홀딩장치 - Google Patents

다이본더의 웨이퍼 홀딩장치 Download PDF

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Publication number
KR900015369A
KR900015369A KR1019890003789A KR890003789A KR900015369A KR 900015369 A KR900015369 A KR 900015369A KR 1019890003789 A KR1019890003789 A KR 1019890003789A KR 890003789 A KR890003789 A KR 890003789A KR 900015369 A KR900015369 A KR 900015369A
Authority
KR
South Korea
Prior art keywords
die bonder
wafer
wafer holding
tray
holding device
Prior art date
Application number
KR1019890003789A
Other languages
English (en)
Other versions
KR910007417B1 (ko
Inventor
기세걸
Original Assignee
송세창
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 송세창, 삼성항공산업 주식회사 filed Critical 송세창
Priority to KR1019890003789A priority Critical patent/KR910007417B1/ko
Publication of KR900015369A publication Critical patent/KR900015369A/ko
Application granted granted Critical
Publication of KR910007417B1 publication Critical patent/KR910007417B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

내용 없음.

Description

다이본더의 웨이퍼 홀딩장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제l도는 본발명의 전체 사시도,
제2도는 본발명의 웨이퍼 홀더부 평면도, 제5도는 본발명의 트레이 사시도.

Claims (3)

  1. 웨이퍼를 진공흡착하는 흡착판(8)이 리이드스크류(5)상에 이송가능케 설치되어 웨이퍼 매거진(1)로부터 웨이퍼를 진공흡착하여 이송하는 트랜스퍼(3)과, 채널(17)이 형성되어 상호 대향설치되는 장착대(14) 및 이장착대(14)를 승강시키는 익스팬딩용 실린더(18)과 저면에 렉(21)이 형성된 플랜지(19)를 보유하는 트레이(15)로 이루어져 장착과 익스팬딩을 행하는 구동부(16)과, 스텝모터(23)의 회전축에 설치된 피니온(24)가 전기한 트레이(15)의 플렌지(19) 하단 전면에 형성된 렉(21)과 치차결합되어 트레이(15)를 회전시킴으로서 얼라인을 행하는 얼라인부(20)으로 구성됨을 특징으로 하는 다이본더의 웨이퍼 홀딩장치.
  2. 제1항에 있어서, 흡착판(8)은 원호상으로 형성된 1쌍의 만곡판(80a)(80b)가 동일 원주상에 대향설치되어 구성됨을 특징으로 하는 다이본더의 웨이퍼 홀딩장치.
  3. 제1항에 있어서, 구동부(16)이 설치되는 연결부(12)에는 직선운동기구로되는 언로딩 수단(120)이 설치되어 짐을 특징으로 나는 다이본더의 웨이퍼 홀딩장치.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019890003789A 1989-03-25 1989-03-25 다이본더의 웨이퍼 홀딩장치 KR910007417B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890003789A KR910007417B1 (ko) 1989-03-25 1989-03-25 다이본더의 웨이퍼 홀딩장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890003789A KR910007417B1 (ko) 1989-03-25 1989-03-25 다이본더의 웨이퍼 홀딩장치

Publications (2)

Publication Number Publication Date
KR900015369A true KR900015369A (ko) 1990-10-26
KR910007417B1 KR910007417B1 (ko) 1991-09-25

Family

ID=19284798

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890003789A KR910007417B1 (ko) 1989-03-25 1989-03-25 다이본더의 웨이퍼 홀딩장치

Country Status (1)

Country Link
KR (1) KR910007417B1 (ko)

Also Published As

Publication number Publication date
KR910007417B1 (ko) 1991-09-25

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