KR910005415A - 반도체장치의 배선접속장치 - Google Patents

반도체장치의 배선접속장치 Download PDF

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Publication number
KR910005415A
KR910005415A KR1019900012667A KR900012667A KR910005415A KR 910005415 A KR910005415 A KR 910005415A KR 1019900012667 A KR1019900012667 A KR 1019900012667A KR 900012667 A KR900012667 A KR 900012667A KR 910005415 A KR910005415 A KR 910005415A
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South Korea
Prior art keywords
workpiece
semiconductor device
recognition
pattern recognition
wiring connection
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KR1019900012667A
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English (en)
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KR940003562B1 (ko
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히로아키 고바야시
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아오이 죠이치
가부시키가이샤 도시바
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

내용 없음

Description

반도체장치의 배선접속장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도 내지 제3도는 본 발명의 1실시예를 나타낸 것으로, 제1도는 측면도.

Claims (3)

  1. 반송장치에 의해 반송되어 온 워크를 지지함과 더불어 상하이동자재(上下移動自在)로 임의의 위치에 정지할 수 있도록 된 워크 지지블럭(7)과, 이 워크지지블럭(7)에 의해 지지된 워크의 패턴인식을 행하기 위해 그 윗쪽에 배치된 광학적 수단(11)및, 이 광학적 수단(11)의 촛점에 맞춰지는 높이가 다른 워크의 2이상의 인식부 대상위치를 미리 기억시켜 놓은 기억수단(CPU)을 구비하고서, 동일워크의 2이상의 인식높이중 한쪽의 위치에서의 패턴인식을 실행한 후 다른 인식대상높이로 워크의 높이를 이동시킨 다음 그 위치에서의 패턴인식을 행하여 배선접속에 필요한 위치어긋남의 보정을 행하도록 된 것을 특징으로 하는 반도체장치의 배선접속장치.
  2. 제1항에 있어서, 등속캠곡선을 포함하는 구동캠(21)과 이 구동캠(21)을 회전시킴과 더불어 이 회전각을 전기적으로 제어할 수 있도록 된 모터(27)를 매개로 상기 워크지지블럭(7)을 상하이동자재로 임의 위치에 정지시킬 수 있도록 구성된 것을 특징으로 하는 반도체장치의 배선접속장치.
  3. 제1항에 있어서, 복수의 인식대상높이중에서 요구스팩이 엄격하지 않은 쪽을 먼저 패턴인식하도록 된 것을 특징으로 하는 반도체장치의 배선 접속장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900012667A 1989-08-18 1990-08-17 반도체 장치의 배선접속장치 KR940003562B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1212178A JPH0793340B2 (ja) 1989-08-18 1989-08-18 半導体装置の配線接続装置
JP01-212178 1989-08-18

Publications (2)

Publication Number Publication Date
KR910005415A true KR910005415A (ko) 1991-03-30
KR940003562B1 KR940003562B1 (ko) 1994-04-23

Family

ID=16618206

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900012667A KR940003562B1 (ko) 1989-08-18 1990-08-17 반도체 장치의 배선접속장치

Country Status (5)

Country Link
US (2) US5356065A (ko)
EP (1) EP0414146B1 (ko)
JP (1) JPH0793340B2 (ko)
KR (1) KR940003562B1 (ko)
DE (1) DE69007708T2 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
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JPH0793340B2 (ja) * 1989-08-18 1995-10-09 株式会社東芝 半導体装置の配線接続装置
US5176311A (en) * 1991-03-04 1993-01-05 Kulicke And Soffa Investments, Inc. High yield clampless wire bonding method
JP2914850B2 (ja) * 1993-07-16 1999-07-05 株式会社カイジョー ワイヤボンディング装置及びその方法
JP2992427B2 (ja) * 1993-07-16 1999-12-20 株式会社カイジョー ワイヤボンディング装置及びその方法
JP3009564B2 (ja) * 1993-07-16 2000-02-14 株式会社カイジョー ワイヤボンディング装置及びその方法
JP2541489B2 (ja) * 1993-12-06 1996-10-09 日本電気株式会社 ワイヤボンディング装置
JP3106345B2 (ja) * 1995-10-23 2000-11-06 株式会社新川 ワイヤボンディング装置
US5813590A (en) * 1995-12-18 1998-09-29 Micron Technology, Inc. Extended travel wire bonding machine
JPH11163047A (ja) * 1997-11-27 1999-06-18 Toshiba Corp 半導体装置の製造方法及びその装置
JP4425190B2 (ja) * 2005-06-30 2010-03-03 株式会社新川 ボンディング装置
US7721936B2 (en) * 2007-01-10 2010-05-25 Ethicon Endo-Surgery, Inc. Interlock and surgical instrument including same
JP5164230B1 (ja) * 2011-09-28 2013-03-21 株式会社カイジョー ボンディング装置
CN105364330B (zh) * 2015-11-17 2018-04-13 深圳市德沃先进自动化有限公司 半导体封装焊线设备
KR102275943B1 (ko) 2020-05-12 2021-07-13 한국항공우주산업 주식회사 실린더의 용접용 변형 방지 장치
CN113437008B (zh) * 2021-06-23 2023-11-17 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 键合机

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US3643321A (en) * 1970-06-17 1972-02-22 Kulicke & Soffa Ind Inc Method and apparatus for tailless wire bonding
US3838274A (en) * 1973-03-30 1974-09-24 Western Electric Co Electro-optical article positioning system
JPS55154740A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Wire bonding device
US4550871A (en) * 1982-08-24 1985-11-05 Asm Assembly Automation Ltd. Four-motion wire bonder
JPS6120345A (ja) * 1984-07-09 1986-01-29 Toshiba Corp ボンディング方法およびボンディング装置
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JPS62125639A (ja) * 1985-11-26 1987-06-06 Nec Corp ワイヤ−ボンデイング装置
JPH0793328B2 (ja) * 1988-01-18 1995-10-09 株式会社新川 ダイボンデイング方法
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US4919335A (en) * 1988-07-19 1990-04-24 The United States Of America As Represented By The United States Department Of Energy Method and apparatus for atomization and spraying of molten metals
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JPH0793340B2 (ja) * 1989-08-18 1995-10-09 株式会社東芝 半導体装置の配線接続装置
JPH03242947A (ja) * 1990-02-21 1991-10-29 Hitachi Ltd ワイヤボンディング方法及びワイヤボンディング装置

Also Published As

Publication number Publication date
JPH0376134A (ja) 1991-04-02
DE69007708D1 (de) 1994-05-05
EP0414146B1 (en) 1994-03-30
EP0414146A3 (en) 1991-06-26
KR940003562B1 (ko) 1994-04-23
DE69007708T2 (de) 1994-08-18
US5529236A (en) 1996-06-25
EP0414146A2 (en) 1991-02-27
JPH0793340B2 (ja) 1995-10-09
US5356065A (en) 1994-10-18

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