KR920013637A - 컷팅시스템 - Google Patents

컷팅시스템 Download PDF

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Publication number
KR920013637A
KR920013637A KR1019910022542A KR910022542A KR920013637A KR 920013637 A KR920013637 A KR 920013637A KR 1019910022542 A KR1019910022542 A KR 1019910022542A KR 910022542 A KR910022542 A KR 910022542A KR 920013637 A KR920013637 A KR 920013637A
Authority
KR
South Korea
Prior art keywords
cutting
workpiece
cutting system
detecting
detecting means
Prior art date
Application number
KR1019910022542A
Other languages
English (en)
Other versions
KR0142223B1 (ko
Inventor
이사오 유사와
마사히로 요시이
카즈마 세키야
Original Assignee
세키야 겐이치
가부시키가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키야 겐이치, 가부시키가이샤 디스코 filed Critical 세키야 겐이치
Publication of KR920013637A publication Critical patent/KR920013637A/ko
Application granted granted Critical
Publication of KR0142223B1 publication Critical patent/KR0142223B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27B—SAWS FOR WOOD OR SIMILAR MATERIAL; COMPONENTS OR ACCESSORIES THEREFOR
    • B27B31/00—Arrangements for conveying, loading, turning, adjusting, or discharging the log or timber, specially designed for saw mills or sawing machines
    • B27B31/06—Adjusting equipment, e.g. using optical projection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

내용 없음.

Description

컷팅시스템
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1 실시예에 관한 다이싱시스템을 도시적으로 나타낸 상세도, 제2도는 다수의 불확정한 형태와 무질서한 웨이퍼를 갖는 프레임의 평면도, 제3도는 웨이퍼용 X방향의 컷팅스트로크를 나타낸 상세도.

Claims (8)

  1. 워크피스의 크기, 형태 및 위치를 검출하는 단계와, 검출된 정보에 따라 상기 워크피스를 적당히 컷팅해주는 단계로 구성된 것을 특징으로 하는 워크피스컷팅용 컷팅시스템.
  2. 제1항에 있어서, 프레임에 놓여지는 워크피스의 크기, 형태 및 위치를 검출하는 제1 검출수단과, 상기 제1검출수단으로 검출된 정보에 따라 상기 워크피스를 얼라인해 주는 제2검출수단 및 상기 제1 및 제2 검출수단으로 검출된 정보에 따라 워크피스를 컷팅해 주는 컷팅수단으로 구성된 것을 특징으로 하는 컷팅시스템.
  3. 제2항에 있어서, 상기 제1 검출수단이 X-Y축 매트릭스상 워크피스의 크기, 형상 및 위치를 검출한 것을 특징으로하는 컷팅시스템.
  4. 제2항 또는 제3항에 있어서, 컷팅스트로크가 상기 제1 검출수단으로 검출된 정보에 따라 제어된 것을 특징으로 하는 컷팅시스템.
  5. 제2항 내지 제4항중 어느 한 항에 있어서, 프레임에 2개 또는 그 이상의 워크피스가 놓여지는 것을 특징으로 하는 컷팅시스템.
  6. 제2항 내지 제5항중 어느 한 항에 있어서, 상기 제2 검출수단과 컷팅수단이 동일장치내에 설치되고, 상기 제1검출수단이 독립적인 장치 또는 다른 장치내에 설치된 것을 특징으로 하는 컷팅시스템.
  7. 제2항 내지 제5항중 어느 한 항에 있어서, 상기 제1 검출수단, 제2 검출수단 및 컷팅수단이 동일장치내에 설치된 것을 특징으로 하는 컷팅시스템.
  8. 제7항에 있어서, 상기 제1 검출수단과 제2 검출수단이 공통인 것을 특징으로 하는 컷팅시스템.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910022542A 1990-12-12 1991-12-10 워크피스 컷팅방법 및 장치 KR0142223B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP90-409894 1990-12-12
JP40989490 1990-12-12
JP91-222390 1991-08-08
JP22239091A JP3173052B2 (ja) 1990-12-12 1991-08-08 半導体ウェーハのダイシング方法

Publications (2)

Publication Number Publication Date
KR920013637A true KR920013637A (ko) 1992-07-29
KR0142223B1 KR0142223B1 (ko) 1998-07-15

Family

ID=26524856

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910022542A KR0142223B1 (ko) 1990-12-12 1991-12-10 워크피스 컷팅방법 및 장치

Country Status (5)

Country Link
EP (1) EP0490324B1 (ko)
JP (1) JP3173052B2 (ko)
KR (1) KR0142223B1 (ko)
DE (1) DE69125112T2 (ko)
TW (1) TW201862B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2991593B2 (ja) * 1993-08-19 1999-12-20 株式会社東京精密 ダイシング装置の半導体ウェハ形状認識装置
JP3203364B2 (ja) 1997-12-01 2001-08-27 株式会社東京精密 アライメント方法及びその装置
JP2001196328A (ja) * 2000-01-12 2001-07-19 Disco Abrasive Syst Ltd Ｃｓｐ基板の分割方法
JP4657585B2 (ja) * 2003-06-05 2011-03-23 株式会社ディスコ 半導体ウェーハの分割方法
JP4648056B2 (ja) * 2005-03-31 2011-03-09 株式会社ディスコ ウエーハのレーザー加工方法およびレーザー加工装置
JP4671760B2 (ja) * 2005-05-19 2011-04-20 三星ダイヤモンド工業株式会社 レーザ加工装置における加工範囲設定方法、および加工範囲設定プログラム
JP5049000B2 (ja) * 2006-12-15 2012-10-17 株式会社ディスコ ウエーハの分割方法
US20100029022A1 (en) * 2007-02-02 2010-02-04 Suss Microtec Test Systems Gmbh Method for improved utilization of semiconductor material
EP2891174B1 (en) * 2012-08-31 2019-08-14 Semiconductor Technologies & Instruments Pte Ltd. System and method for automatically correcting for rotational misalignment of wafers on film frames
JP6218658B2 (ja) * 2014-03-27 2017-10-25 株式会社ディスコ レーザー加工方法
DE102014118833A1 (de) * 2014-12-17 2016-06-23 Mechatronic Systemtechnik Gmbh Verfahren und Vorrichtung zum Vorausrichten eines flachen Substrats

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0031318A1 (en) * 1978-03-09 1981-07-01 GULF & WESTERN CORPORATION Apparatus for cutting an element from a natural tobacco leaf
JPS60100450A (ja) * 1983-11-07 1985-06-04 Disco Abrasive Sys Ltd 半導体ウエーハ装着及び切断装置
US4856904A (en) * 1985-01-21 1989-08-15 Nikon Corporation Wafer inspecting apparatus

Also Published As

Publication number Publication date
KR0142223B1 (ko) 1998-07-15
JP3173052B2 (ja) 2001-06-04
JPH04363047A (ja) 1992-12-15
TW201862B (ko) 1993-03-11
DE69125112D1 (de) 1997-04-17
DE69125112T2 (de) 1997-06-19
EP0490324B1 (en) 1997-03-12
EP0490324A1 (en) 1992-06-17

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