KR970060350A - 부품장착장치 - Google Patents

부품장착장치 Download PDF

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Publication number
KR970060350A
KR970060350A KR1019970002397A KR19970002397A KR970060350A KR 970060350 A KR970060350 A KR 970060350A KR 1019970002397 A KR1019970002397 A KR 1019970002397A KR 19970002397 A KR19970002397 A KR 19970002397A KR 970060350 A KR970060350 A KR 970060350A
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KR
South Korea
Prior art keywords
eccentric cam
holder
suction bit
component mounting
predetermined angle
Prior art date
Application number
KR1019970002397A
Other languages
English (en)
Other versions
KR100254263B1 (ko
Inventor
다다오 오카자키
원영식
Original Assignee
이대원
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이대원, 삼성항공산업 주식회사 filed Critical 이대원
Publication of KR970060350A publication Critical patent/KR970060350A/ko
Application granted granted Critical
Publication of KR100254263B1 publication Critical patent/KR100254263B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본 발명에 따른 부품장착장치는 장착헤드의 홀더에 반시계 또는 시계방향으로 회전 가능하게 설치된 편심캠과, 이 편심캠에 접촉되며 흡입비트에 연결된 종동자를 구비하여, 편심캠 회전수단에 의해 편심캠이 소정각도 회전할 때 흡입비트가 하강 및 상승이동한다. 따라서, 흡입비트를 간단한 구조로 고속으로 구동할 수 있다.

Description

부품장착장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일 실시예에 따른 부품장착장치의 개략적인 구조를 나타내는 평면도이다.
제2도는 제1도에 도시된 장치의 정면도이다.
제3도는 제1도 및 제2도에 도시된 장착헤드를 상세하게 나타낸 정면도이다.
제4도의 (a)는 제3도의 Ⅳa-Ⅳa선 단면도이며, 제4도의 (b)는 (a)의 Ⅳb-Ⅳb선 단면도이다.

Claims (7)

  1. 부품 스테이지에 놓인 부품을 기판에 장착하기 위한 부품장착장치에 있어서, 상기 부품 스테이지와 상기 기판 사이에 이동 가능하게 설치된 장착헤드와, 상기 장착헤드에 결합된 홀더와, 상기 홀더에 결합되며 상기 부품을 흡착하는 흡입비트와, 상기 홀더에 회전 가능하게 결합되는 편심캠과, 상기 편심캠을 회전시키는 편심캠 회전수단과, 상기 흡입비트에 연결되어 그 일측이 상기 편심캠의 캠면에 접촉되며 상기 편심캠회전수단에 의해 상기 편심캠이 소정각도 회전할 때 상기 흡입비트를 상하로 이동시키는 종동자를 구비하여 된 것을 특징으로 하는 부품장착장치.
  2. 제1항에 있어서, 상기 편심캠 회전수단은 상기 홀더에 직선방향으로 왕복이동 가능하게 설치되는 랙부재를 구비하며, 상기 랙부재가 일방향으로 직성이동할 때 상기 편심캠이 상기 소정각도만큼 회전되는 것을 특징으로 하는 부품장착장치.
  3. 제1항에 있어서, 상기 편심캠은 상기 소정각도만큼 회전될 때 상기 흡입비트를 상승한계위치와 하강한계위치 사이에서 이동시키며, 상기 흡입비트는 상기 편심캠을 일방향으로 회전시킬 때 저속으로 하강한 후 고속으로 상승하는 한편, 상기 편심캠을 역방향으로 회전시킬 때는 고속으로 하강한 후 저속으로 상승하는 것을 특징으로 하는 부품장착장치.
  4. 제1항에 있어서, 상기 소정각도는 360°인 것을 특징으로 하는 부품장착장치.
  5. 제1항에 있어서, 상기 소정각도는 180°인 것을 특징으로 하는 부품장착장치.
  6. 제1항에 있어서, 상기 홀더는 상기 장착헤드에 상하이동 가능하게 설치되며 그 홀더의 상하이동에 의해 상기 흡입비트의 상하이동범위가 변화될 수 있으며, 상기 홀더를 상하이동시키는 홀더승강수단을 구비하여 된 것을 특징으로 하는 부품장착장치.
  7. 제1항에 있어서, 상기 흡입비트는 상기 홀더에 회전 가능하게 설치되며, 상기 흡입비트는 회전시키기 위한 흡입비트회전수단을 구비하여 된 것을 특징으로 하는 부품장착장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970002397A 1996-01-29 1997-01-28 부품장착장치 KR100254263B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP01260796A JP3677108B2 (ja) 1996-01-29 1996-01-29 部品搭載装置
JP12607 1996-01-29

Publications (2)

Publication Number Publication Date
KR970060350A true KR970060350A (ko) 1997-08-12
KR100254263B1 KR100254263B1 (ko) 2000-05-01

Family

ID=11810054

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970002397A KR100254263B1 (ko) 1996-01-29 1997-01-28 부품장착장치

Country Status (7)

Country Link
US (1) US5850683A (ko)
JP (1) JP3677108B2 (ko)
KR (1) KR100254263B1 (ko)
CN (1) CN1097421C (ko)
CH (1) CH691420A5 (ko)
DE (1) DE19702866A1 (ko)
TW (1) TW353262B (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3802955B2 (ja) * 1996-11-27 2006-08-02 富士機械製造株式会社 回路部品装着システム
JP3969808B2 (ja) * 1997-10-29 2007-09-05 富士機械製造株式会社 電気部品供給方法および装置ならびに電気部品装着装置
US6101707A (en) * 1998-03-03 2000-08-15 Sanyo Electric Co., Ltd. Mounting head for electronic component-mounting apparatus
JP4303345B2 (ja) * 1998-03-12 2009-07-29 Ｊｕｋｉ株式会社 表面実装部品搭載機
US6671946B1 (en) * 1998-05-11 2004-01-06 Matsushita Electric Industrial Co., Ltd. Component mounting machine
KR100585588B1 (ko) * 1999-03-13 2006-06-07 삼성테크윈 주식회사 부품 실장기용 헤드 조립체
JP3387881B2 (ja) * 1999-03-17 2003-03-17 ティーディーケイ株式会社 電子部品挿入ヘッドおよび電子部品挿入装置
JP2001047385A (ja) * 1999-08-05 2001-02-20 Fuji Mach Mfg Co Ltd 電気部品装着ヘッド
JP3907876B2 (ja) * 1999-08-25 2007-04-18 松下電器産業株式会社 電子部品装着装置
KR100348400B1 (ko) * 2000-05-20 2002-08-10 미래산업 주식회사 표면실장장치의 모듈헤드의 노즐회전장치
US6920687B2 (en) * 2000-12-06 2005-07-26 Matsushita Electric Industrial Co., Ltd. Component mounting method employing temperature maintenance of positioning apparatus
US6796022B2 (en) * 2001-03-30 2004-09-28 Sanyo Electric Co., Ltd. Electronic component mounting apparatus
JP3817207B2 (ja) * 2002-08-21 2006-09-06 Ｔｄｋ株式会社 実装処理装置及び該実装処理装置の制御装置
DE10313255B4 (de) * 2002-12-18 2007-08-16 Geringer, Michael Transfer-Kopf für eine Vorrichtung zum Transportieren von Bauelementen sowie Vorrichtung mit einem solchen Transferkopf
DE10341186A1 (de) * 2003-09-06 2005-03-31 Martin Michalk Verfahren und Vorrichtung zum Kontaktieren von Halbleiterchips
US11375651B2 (en) 2018-02-26 2022-06-28 Universal Instruments Corporation Dispensing head, nozzle and method
SE544249C2 (en) 2018-02-26 2022-03-15 Universal Instruments Corp Pick-and-place spindle module, bank, and method

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JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS59224279A (ja) * 1983-06-01 1984-12-17 富士機械製造株式会社 電子部品の位置決め保持方法および装置
CH664110A5 (fr) * 1985-11-08 1988-02-15 Ismeca S A Machine automatique de placement de composants sur des substrats, tete de placement pour cette machine.
US4759124A (en) * 1987-04-28 1988-07-26 Universal Instruments Corp. Method and apparatus for controlling component pickup and placement pressures
GB2214894B (en) * 1988-02-03 1991-10-30 Ind Tech Res Inst Surface mounting device pick-and-place head
JPH07105637B2 (ja) * 1990-05-31 1995-11-13 三洋電機株式会社 部品装着装置
JP3159473B2 (ja) * 1991-07-12 2001-04-23 松下電器産業株式会社 電子部品の移載ヘッド
JP3433218B2 (ja) * 1995-01-17 2003-08-04 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP2708016B2 (ja) * 1995-06-14 1998-02-04 松下電器産業株式会社 電子部品自動実装装置

Also Published As

Publication number Publication date
KR100254263B1 (ko) 2000-05-01
CH691420A5 (fr) 2001-07-13
TW353262B (en) 1999-02-21
JP3677108B2 (ja) 2005-07-27
DE19702866A1 (de) 1997-07-31
JPH09214188A (ja) 1997-08-15
US5850683A (en) 1998-12-22
CN1097421C (zh) 2002-12-25
CN1170334A (zh) 1998-01-14

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