KR880012132A - 전자부품 장착장치 - Google Patents

전자부품 장착장치 Download PDF

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Publication number
KR880012132A
KR880012132A KR1019880002871A KR880002871A KR880012132A KR 880012132 A KR880012132 A KR 880012132A KR 1019880002871 A KR1019880002871 A KR 1019880002871A KR 880002871 A KR880002871 A KR 880002871A KR 880012132 A KR880012132 A KR 880012132A
Authority
KR
South Korea
Prior art keywords
electronic component
component mounting
frame
mounting device
rotating frame
Prior art date
Application number
KR1019880002871A
Other languages
English (en)
Other versions
KR900006678B1 (ko
Inventor
하타칸지
마사히로 마루야마
에이지 이테마다니
Original Assignee
다니이 아끼오
마쯔시다덴기산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다니이 아끼오, 마쯔시다덴기산교 가부시기가이샤 filed Critical 다니이 아끼오
Publication of KR880012132A publication Critical patent/KR880012132A/ko
Application granted granted Critical
Publication of KR900006678B1 publication Critical patent/KR900006678B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/18—Mechanical movements
    • Y10T74/18056—Rotary to or from reciprocating or oscillating
    • Y10T74/18296—Cam and slide
    • Y10T74/18304—Axial cam
    • Y10T74/18312—Grooved

Abstract

내용 없음

Description

전자부품 장착장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 종단정면도,
제2도는 승강부재의 상세 단면도.

Claims (1)

  1. 회전자재한 회전 프레임과, 이 회전프레임의 원주방향으로 등 간격으로 배치된 복수의 승강자재한 승강부재와, 각 승강부재에 승강 가능하게 장착된 전자부품의 파지부재와, 각 파지부재가 적어도 전자부품 공급위치와 전자부품 장착위치에서 정지하도록 상기 회전 프레임을 간헐회전 구동하는 회전 구동장치와, 상기 회전 프레임의 회전에 따라서 상기 승강부재를 승가시키는 캠 구동수단과, 전자부품 장착위치에 배치된 선형 모우터 구동의 파지부재 승강수단을 구비한 것을 특징으로 하는 전자부품 장치.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019880002871A 1987-03-20 1988-03-18 전자부품 장착장치 KR900006678B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP87-66384 1987-03-20
JP62-66384 1987-03-20
JP62066384A JPS63232496A (ja) 1987-03-20 1987-03-20 電子部品装着装置

Publications (2)

Publication Number Publication Date
KR880012132A true KR880012132A (ko) 1988-11-03
KR900006678B1 KR900006678B1 (ko) 1990-09-17

Family

ID=13314274

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880002871A KR900006678B1 (ko) 1987-03-20 1988-03-18 전자부품 장착장치

Country Status (4)

Country Link
US (1) US4815913A (ko)
JP (1) JPS63232496A (ko)
KR (1) KR900006678B1 (ko)
DE (1) DE3809122A1 (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03160797A (ja) * 1989-11-17 1991-07-10 Matsushita Electric Ind Co Ltd 電子部品挿入装置
US5035316A (en) * 1990-01-22 1991-07-30 Universal Instruments Corporation Isolating a first component to be pickup from other components on a vibratory feeder
US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components
US5523642A (en) * 1992-09-28 1996-06-04 Sanyo Electric Co., Ltd. External force measuring system and component mounting apparatus equipped with same
JPH0742200U (ja) * 1993-12-24 1995-07-21 富士通テン株式会社 電子部品装着装置
JP3433218B2 (ja) * 1995-01-17 2003-08-04 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
US5636887A (en) * 1995-03-20 1997-06-10 Chrysler Corporation Apparatus for lifting objects by suction and releasing them by gas pressure
NL1000675C2 (nl) * 1995-06-27 1996-12-31 Ebm Techniek Bv Overzetinrichting en samenstel van overzetinrichtingen.
JPH10106370A (ja) * 1996-09-27 1998-04-24 Harness Sogo Gijutsu Kenkyusho:Kk ワイヤーハーネスの製造
DE19706594A1 (de) * 1997-02-20 1998-08-27 Leybold Systems Gmbh Vorrichtung für den Transport von Substraten
US6877219B1 (en) 1999-10-26 2005-04-12 Air Liquide America, L.P. Apparatus for placing components on printed circuit boards
US6622399B1 (en) 2000-03-31 2003-09-23 L'air Liquide-Societe Anonyme A' Directoire Et Conseil De Sureveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and method for maintaining a dry atmosphere to prevent moisture absorption and allow demoisturization of electronic components
US6628521B2 (en) * 2000-11-06 2003-09-30 Adc Telecommunications, Inc. Mechanical housing
WO2002065824A1 (fr) * 2001-02-14 2002-08-22 Ismeca Holding Sa Procede et dispositif de traitement de composants
JP2002368495A (ja) * 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
US6897377B2 (en) * 2001-07-31 2005-05-24 Adc Telecommunications, Inc. Clamping receptacle
US6894907B2 (en) * 2001-07-31 2005-05-17 Adc Telecommunications, Inc. Clamping case
US6862180B2 (en) * 2002-05-24 2005-03-01 Adc Dsl Systems, Inc. Housings for circuit cards
US6781830B2 (en) * 2002-11-05 2004-08-24 Adc Dsl Systems, Inc. Methods and systems of heat transfer for electronic enclosures
US6865085B1 (en) 2003-09-26 2005-03-08 Adc Dsl Systems, Inc. Heat dissipation for electronic enclosures
KR101563320B1 (ko) * 2013-10-10 2015-10-26 현대중공업 주식회사 고속 솔레노이드
CN108000216B (zh) * 2017-12-17 2020-11-17 诸暨市枫桥天竺五金油漆店 一种顿挫式加工的自动化机床

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027767A (en) * 1974-04-01 1977-06-07 William Gluck Indexing machine transfer mechanism
US4556362A (en) * 1983-12-21 1985-12-03 At&T Technologies, Inc. Methods of and apparatus for handling semiconductor devices
JP2537770B2 (ja) * 1984-08-31 1996-09-25 松下電器産業株式会社 電子部品の装着方法
JPS6198000A (ja) * 1984-10-19 1986-05-16 株式会社日立製作所 Ｉｃ插着装置
JPS61119100A (ja) * 1984-11-14 1986-06-06 松下電器産業株式会社 電子部品の装着装置

Also Published As

Publication number Publication date
KR900006678B1 (ko) 1990-09-17
JPS63232496A (ja) 1988-09-28
US4815913A (en) 1989-03-28
DE3809122C2 (ko) 1992-08-20
DE3809122A1 (de) 1988-09-29

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