KR890018025A - 회로프린트판 및 그 부품면부착 위치인식방법 - Google Patents

회로프린트판 및 그 부품면부착 위치인식방법 Download PDF

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Publication number
KR890018025A
KR890018025A KR1019890005555A KR890005555A KR890018025A KR 890018025 A KR890018025 A KR 890018025A KR 1019890005555 A KR1019890005555 A KR 1019890005555A KR 890005555 A KR890005555 A KR 890005555A KR 890018025 A KR890018025 A KR 890018025A
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KR
South Korea
Prior art keywords
pattern
lead wire
printed board
wire connection
conductive pattern
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KR1019890005555A
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English (en)
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KR920002969B1 (ko
Inventor
유다까 마에노
세이지 하시구찌
게이이찌 하세가와
마사아끼 하찌야
싱고 유에야마
Original Assignee
미다 가쓰시게
가부시기가이샤 히다찌세이사꾸쇼
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Publication of KR890018025A publication Critical patent/KR890018025A/ko
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Publication of KR920002969B1 publication Critical patent/KR920002969B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Structure Of Printed Boards (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

내용 없음

Description

회로프린트판 및 그 부품면부착 위치인식방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본원 발명의 회로프린트판의 실시예를 나타내는 요부의 평면도, 제 2 도는 회로프린트판에 FIC를 납땜하기 전후의 상태를 나타내는 단면도.

Claims (11)

  1. 표면에 집적회로의 리드를 접속하기 위한 리드선접속용 도전패턴의 최소한 1쌍의 열(列)을 가지고 있으며, 그 쌍을 이루고 있는 열은 평행을 이루고 있는 회로프린트판에 있어서, 상기 각 열에 속해 있는 상기 리드선접속용 도전패턴의 최소한 2개의 상기 열과 직각을 이루는 방향에서 상기 리드선접속용 도전패턴에 대하여 특정의 위치에 위치검출용 패턴이 설치되어 있는 것을 특징으로 하는 회로프린트판.
  2. 제 1 항에 있어서, 상기 위치검출용 패턴의 폭은 상기 리드선접속용 도전패턴의 그것보다도 좁게 구성되어 있는 것을 특징으로 하는 회로프린트판.
  3. 제 1 항에 있어서, 상기 위치검출용 패턴은 도전체로 구성되어 있는 것을 특징으로 하는 회로프린트판.
  4. 제 3 항에 있어서, 상기 리드선접속용 도전패턴에는 납땜부착되어 있으며, 상기 위치검출용 패턴에는 납땜부착되어 있지 않은 것을 특징으로 하는 회로프린트판.
  5. 제 3 항에 있어서, 상기 위치검출용 패턴과 상기 리드선접속용 도전패턴은 도전체로 연속하여 구성되어 있는 것을 특징으로 하는 회로프린트판.
  6. 제 1 항에 있어서, 상기 위치검출용 패턴은 쌍을 이루고 있는 상기 리드선접속용 도전패턴을 사이에 두고 배치되어 있는 것을 특징으로 하는 회로프린트판.
  7. 제 3 항에 있어서, 상기 리드선접속용 도전패턴과 위치검출용 패턴과의 사이에는 상기 리드선접속용 도전패턴위의 상기 납땜이 용융되어 상기 위치검출용 패턴위에 부착하는 것을 저지하는 저지수단이 설치되어 있는 것을 특징으로 하는 회로프린트판.
  8. 제 7 항에 있어서, 상기 저지수단은 상기 리드선접속용 도전패턴과 위치검출용 패턴을 전기적으로 분리해서 배설되어 구성되어 있는 것을 특징으로 하는 회로프린트판.
  9. 제 7 항에 있어서, 상기 저지수단은 전기적으로 연결되어 있는 상기 리드선접속용 패턴과 위치검출용패턴과는 도중의 표면에 둑을 형성하여 구성되어 있는 것을 특징으로 하는 회로프린트판.
  10. 제 9 항에 있어서, 상기 둑은 솔더레지스트로 구성되어 있는 것을 특징으로 하는 회로프린트판.
  11. 표면에 집적회로의 리드를 접속하기 위한 리드선접속용 도전패턴의 최소한 1쌍의 열을 가지고 있으며, 그 쌍을 이루고 있는 열은 평행을 이루고 있는 회로프린트판의 상기 리드선접속용 도전패턴의 위치와 방향을 인식하는 방법에 있어서, 상기 각 열에 속해 있는 상기 리드선접선용 도전패턴의 최소한 2개의 상기 열과 직각을 이루는 방향 위치에서 상기 리드선접속용 도전패턴에 대하여 특정의 위치에 설치되어 있는 위치검출용 패턴의 위치정보를 구하는 검출공정과, 상기 위치정보를 기초로 상기 리드선접속용 도전패턴의 위치를 연산에 의해 구하는 연산공정을 가진 것을 특징으로 하는 회로프린트판의 부품면부착 위치인식방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890005555A 1988-05-11 1989-04-27 회로프린트판 KR920002969B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63-112403 1988-05-11
JP88-112403 1988-05-11
JP63112403A JPH01283993A (ja) 1988-05-11 1988-05-11 回路プリント板、その面付け部品位置認識装置、及び面付け部品検査装置

Publications (2)

Publication Number Publication Date
KR890018025A true KR890018025A (ko) 1989-12-18
KR920002969B1 KR920002969B1 (ko) 1992-04-11

Family

ID=14585783

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890005555A KR920002969B1 (ko) 1988-05-11 1989-04-27 회로프린트판

Country Status (5)

Country Link
US (1) US5047714A (ko)
EP (1) EP0341629B1 (ko)
JP (1) JPH01283993A (ko)
KR (1) KR920002969B1 (ko)
DE (1) DE68919268T2 (ko)

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JPH04105582U (ja) * 1991-02-25 1992-09-10 三菱電機株式会社 プリント配線板
DE4121107C2 (de) * 1991-06-26 1995-01-26 Siemens Nixdorf Inf Syst Verfahren und Anordnung zum Auflöten von oberflächenbefestigbaren Bausteinen auf Leiterplatten
US5315070A (en) * 1991-12-02 1994-05-24 Siemens Aktiengesellschaft Printed wiring board to which solder has been applied
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JP2002204041A (ja) 2000-12-27 2002-07-19 Alps Electric Co Ltd 電気部品の取付位置検出構造
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Also Published As

Publication number Publication date
EP0341629A2 (en) 1989-11-15
US5047714A (en) 1991-09-10
JPH01283993A (ja) 1989-11-15
EP0341629B1 (en) 1994-11-09
DE68919268D1 (de) 1994-12-15
DE68919268T2 (de) 1995-03-23
EP0341629A3 (en) 1990-12-27
KR920002969B1 (ko) 1992-04-11

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