KR890015039A - 반도체를 포함하는 아티클 제조방법 - Google Patents

반도체를 포함하는 아티클 제조방법 Download PDF

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Publication number
KR890015039A
KR890015039A KR1019890002381A KR890002381A KR890015039A KR 890015039 A KR890015039 A KR 890015039A KR 1019890002381 A KR1019890002381 A KR 1019890002381A KR 890002381 A KR890002381 A KR 890002381A KR 890015039 A KR890015039 A KR 890015039A
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South Korea
Prior art keywords
feature
groove
opening
masking layer
semiconductor
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KR1019890002381A
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English (en)
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KR910005950B1 (en
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이. 브론더 그레그
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엘리 와이스
아메리칸 텔리폰 앤드 텔레그라프 캄파니
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Publication of KR890015039A publication Critical patent/KR890015039A/ko
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Publication of KR910005950B1 publication Critical patent/KR910005950B1/ko

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3801—Permanent connections, i.e. wherein fibres are kept aligned by mechanical means
    • G02B6/3803—Adjustment or alignment devices for alignment prior to splicing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30608—Anisotropic liquid etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Weting (AREA)

Abstract

내용 없음.

Description

반도체를 포함하는 아티클 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 방법에 따른 전형적인 실시예의 주요 단계를 나타내는 블럭선도.
제3도 내지 제4도는 본 발명에 따른 아티클(article)을 여러 제조단계로 나타내는 개략도.

Claims (4)

  1. 가) 주요표면에 제1마스킹층(31)형성단계 및 홈과 같은 특징물의 제1 및 제2부분과 각각 병합된 넓은 부분 및 좁은 부분(33,34)을 갖는 개구(32)가 제1마스킹층에 형성되도록 제1마스킹층 패턴 단계와, 나)홈과 같은 특징물이 형성되도록 비등망성 엣칭액으로 제1마스킹층에 개구가 노출되는 주요표면영역 접촉 단게를 구비하고, 비교적 큰 횡단면 및 작은 횡단면을 갖는 제1 및 제2부분을 갖는 최소한 하나의 특징믈, 즉, 홈과 같은 특징물과 함께 주요표면을 갖는 반도체(30)를 포함하는 아티클 제조 방법에 있어서, 다)단계 가)다음이고 단계 나)이전의 단계로서, 개구의 넓은 부분이 근본적으로 커버되지 않고 남아 있는 동안 제2마스킹층(35)와 함께 개구의 좁은 부분을 커버하는 단계와, 비등방성 엣칭액으로 개구의 넓은 부분에 노출된 주요 표면 영역 접촉 및 홈과 같은 특징물의 제1부분 형성물이 완성되기 전에 상기 접촉 종결단계와, 개구의 좁은 부분으로부터 제2마스킹층 제거 단계를 더 구비하는 것을 특징으로 하는 반도체를 포함하는 아티클 제조방법.
  2. 제1항에 있어서, 상기 반도체는 Si이고, 상기 주요 표면은 대체로(001)결정 평면과 평행이며, 상기 홈과 같은 특징물은 대체로 [110]결정 방향과 평행인 것을 특징으로 하는 반도체를 포함하는 아티클 제조방법.
  3. 제1항 및 제2항중 어느 항에 있어서, 상기 홈과 같은 특징물은 광섬유의 단부를 그 특징물에 수용하기에 적합한 직렬 V홈인 것을 특징으로 하는 반도체를 포함하는 아티클 제조방법.
  4. 제1항 및 제2항중 어느 항에 있어서, 상기 홈과 같은 특징물은 비교적 큰 횡단면을 갖는 제3부분과, 제1부분 및 제3부분에 접속된 제2부분을 또한 구비하며, 두 광섬유가 광학적으로 결합되도록 각각의 두 광섬유의 단부를 반대위치에 수용하기에 적합한 직렬 V홈인 것을 특징으로 하는 반도체를 포함하는 아티클 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR8902381A 1988-03-03 1989-02-28 Method of making an article comprising a tandem groove and article produced by the method KR910005950B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US163685 1988-03-03
US07/163,685 US4810557A (en) 1988-03-03 1988-03-03 Method of making an article comprising a tandem groove, and article produced by the method

Publications (2)

Publication Number Publication Date
KR890015039A true KR890015039A (ko) 1989-10-28
KR910005950B1 KR910005950B1 (en) 1991-08-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR8902381A KR910005950B1 (en) 1988-03-03 1989-02-28 Method of making an article comprising a tandem groove and article produced by the method

Country Status (7)

Country Link
US (1) US4810557A (ko)
EP (1) EP0331333B1 (ko)
JP (1) JPH07117614B2 (ko)
KR (1) KR910005950B1 (ko)
CA (1) CA1301956C (ko)
DE (1) DE68907079T2 (ko)
ES (1) ES2040996T3 (ko)

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Also Published As

Publication number Publication date
DE68907079T2 (de) 1993-10-07
EP0331333A3 (en) 1991-01-16
CA1301956C (en) 1992-05-26
ES2040996T3 (es) 1993-11-01
EP0331333B1 (en) 1993-06-16
JPH027010A (ja) 1990-01-11
EP0331333A2 (en) 1989-09-06
KR910005950B1 (en) 1991-08-09
US4810557A (en) 1989-03-07
DE68907079D1 (de) 1993-07-22
JPH07117614B2 (ja) 1995-12-18

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