ES2040996T3 - Metodo para fabricar un articulo que comprende una ranura en tandem y articulo producido por el metodo. - Google Patents

Metodo para fabricar un articulo que comprende una ranura en tandem y articulo producido por el metodo.

Info

Publication number
ES2040996T3
ES2040996T3 ES198989301712T ES89301712T ES2040996T3 ES 2040996 T3 ES2040996 T3 ES 2040996T3 ES 198989301712 T ES198989301712 T ES 198989301712T ES 89301712 T ES89301712 T ES 89301712T ES 2040996 T3 ES2040996 T3 ES 2040996T3
Authority
ES
Spain
Prior art keywords
slot
opening
article
masking layer
narrow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198989301712T
Other languages
English (en)
Inventor
Greg. E. Blonder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of ES2040996T3 publication Critical patent/ES2040996T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3801—Permanent connections, i.e. wherein fibres are kept aligned by mechanical means
    • G02B6/3803—Adjustment or alignment devices for alignment prior to splicing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30608—Anisotropic liquid etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Weting (AREA)

Abstract

RANURAS DOBLES (U OTRO TIPO CARACTERISTICA EN FORMA DE RANURA) CON TRANSICION CONTROLADA ENTRE LA PARTE ESTRECHA Y LA PARTE ANCHA DE LA RANURA, PUEDEN FORMARSE EN UNA SUPERFICIE SEMICONDUCTORA, EN EL EJEMPLO UNA SUPERFICIE DE SILICIO (100), MEDIANTE UN METODO QUE CONSISTE EN CONFIGURAR UNA PRIMERA CAPA DE ENMASCARAMIENTO, COMO LA ABERTURA RESULTANTE EN LA CAPA DE ENMASCARAMIENTO, SOMETIENDO A LA PARTE ANCHA DE LA ABERTURA A UN ATAQUE QUIMICO INICIAL, RETIRANDO LA SEGUNDA CAPA DE ENMASCARAMIENTO DE LA PARTE ESTRECHA DE LA ABERTURA, Y SOMETIENDO A LA ABERTURA A OTRO ATAQUE QUIMICO DE FORMA QUE TANTO LA PARTE ANCHA COMO LA ESTRECHA DE LA RANURA DOBLE SEAN COMPLETADAS. EL METODO DEL INVENTO ES UTILIZADO VENTAJOSAMENTE PARA PRODUCIR RANURAS QUE PERMITEN LA FIJACION DE UNA FIBRA OPTICA RECUBIERTO POR UN SUBSTRATO DE SILICIO.
ES198989301712T 1988-03-03 1989-02-22 Metodo para fabricar un articulo que comprende una ranura en tandem y articulo producido por el metodo. Expired - Lifetime ES2040996T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/163,685 US4810557A (en) 1988-03-03 1988-03-03 Method of making an article comprising a tandem groove, and article produced by the method

Publications (1)

Publication Number Publication Date
ES2040996T3 true ES2040996T3 (es) 1993-11-01

Family

ID=22591133

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198989301712T Expired - Lifetime ES2040996T3 (es) 1988-03-03 1989-02-22 Metodo para fabricar un articulo que comprende una ranura en tandem y articulo producido por el metodo.

Country Status (7)

Country Link
US (1) US4810557A (es)
EP (1) EP0331333B1 (es)
JP (1) JPH07117614B2 (es)
KR (1) KR910005950B1 (es)
CA (1) CA1301956C (es)
DE (1) DE68907079T2 (es)
ES (1) ES2040996T3 (es)

Families Citing this family (39)

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US5053836A (en) * 1989-11-21 1991-10-01 Eastman Kodak Company Cleaving of diode arrays with scribing channels
US4997793A (en) * 1989-11-21 1991-03-05 Eastman Kodak Company Method of improving cleaving of diode arrays
US4957592A (en) * 1989-12-27 1990-09-18 Xerox Corporation Method of using erodable masks to produce partially etched structures in ODE wafer structures
FR2659148B1 (fr) * 1990-03-01 1993-04-16 Commissariat Energie Atomique Procede de connexion entre une fibre optique et un microguide optique.
US5293516A (en) * 1992-01-28 1994-03-08 International Business Machines Corporation Multiprobe apparatus
DE69331876T2 (de) * 1992-01-28 2002-11-28 British Telecomm Ausrichtung von integrierten optischen Komponenten
US5217568A (en) * 1992-02-03 1993-06-08 Motorola, Inc. Silicon etching process using polymeric mask, for example, to form V-groove for an optical fiber coupling
GB9203128D0 (en) * 1992-02-14 1992-04-01 Lucas Ind Plc Alignment device for optical fibre
US5550088A (en) * 1993-06-02 1996-08-27 Lucent Technologies Inc. Fabrication process for a self-aligned optical subassembly
US5385635A (en) * 1993-11-01 1995-01-31 Xerox Corporation Process for fabricating silicon channel structures with variable cross-sectional areas
JP3345518B2 (ja) * 1994-09-28 2002-11-18 株式会社東芝 光半導体モジュールの製造方法
GB2297626A (en) * 1995-01-27 1996-08-07 Cambridge Consultants Miniature mounting grooved substrate
US5471552A (en) * 1995-02-22 1995-11-28 Industrial Technology Research Institute Fabrication of static-alignment fiber-guiding grooves for planar lightwave circuits
US5808293A (en) * 1996-08-28 1998-09-15 Hewlett-Packard Company Photo detector with an integrated mirror and a method of making the same
IT1286385B1 (it) * 1996-11-19 1998-07-08 Italtel Spa Procedimento per realizzare l'accoppiamento in un dispositivo optoelettronico tra una fibra ottica ed una guida d'onda e dispositivo
GB9700150D0 (en) * 1997-01-07 1997-02-26 Cambridge Consultants Hybrid chip process
US5896481A (en) * 1997-05-30 1999-04-20 The Boeing Company Optical subassembly with a groove for aligning an optical device with an optical fiber
US6282351B1 (en) 1998-02-20 2001-08-28 Sumitomo Electric Industries, Ltd. Optical module and a method of fabricating the same
US6296789B1 (en) 1998-02-20 2001-10-02 Sumitomo Electric Industries, Ltd. Optical module and a method of fabricating the same
US6280102B1 (en) 1998-02-20 2001-08-28 Sumitomo Electric Industries, Ltd. Optical module product with sealing cap
JPH11258467A (ja) 1998-03-16 1999-09-24 Sumitomo Electric Ind Ltd 光モジュール用リードフレーム、光モジュールの製造方法、及び光モジュール
JP4019538B2 (ja) 1998-03-16 2007-12-12 住友電気工業株式会社 光モジュール用基体及び光モジュール
US5995688A (en) * 1998-06-01 1999-11-30 Lucent Technologies, Inc. Micro-opto-electromechanical devices and method therefor
US6265757B1 (en) 1999-11-09 2001-07-24 Agere Systems Guardian Corp. Forming attached features on a semiconductor substrate
US6811853B1 (en) 2000-03-06 2004-11-02 Shipley Company, L.L.C. Single mask lithographic process for patterning multiple types of surface features
US6627096B2 (en) 2000-05-02 2003-09-30 Shipley Company, L.L.C. Single mask technique for making positive and negative micromachined features on a substrate
US6885786B2 (en) * 2001-02-07 2005-04-26 Shipley Company, L.L.C. Combined wet and dry etching process for micromachining of crystalline materials
US6907150B2 (en) * 2001-02-07 2005-06-14 Shipley Company, L.L.C. Etching process for micromachining crystalline materials and devices fabricated thereby
US20030021572A1 (en) * 2001-02-07 2003-01-30 Steinberg Dan A. V-groove with tapered depth and method for making
US6964804B2 (en) * 2001-02-14 2005-11-15 Shipley Company, L.L.C. Micromachined structures made by combined wet and dry etching
US20020195417A1 (en) * 2001-04-20 2002-12-26 Steinberg Dan A. Wet and dry etching process on <110> silicon and resulting structures
KR100439088B1 (ko) * 2001-09-14 2004-07-05 한국과학기술원 상호 자기 정렬된 다수의 식각 홈을 가지는 광결합 모듈및 그 제작방법
GB0128617D0 (en) * 2001-11-29 2002-01-23 Denselight Semiconductors Pte Self-aligned v-groove and deep trench etching of semiconductors
GB0201969D0 (en) * 2002-01-29 2002-03-13 Qinetiq Ltd Integrated optics devices
US6817776B2 (en) * 2002-11-19 2004-11-16 International Business Machines Corporation Method of bonding optical fibers and optical fiber assembly
CN100365775C (zh) 2003-05-23 2008-01-30 罗姆和哈斯电子材料有限责任公司 用于显微机械加工晶体材料的蚀刻方法以及由此方法制备的器件
US7802928B2 (en) * 2008-01-04 2010-09-28 Honeywell International Inc. System and method for fiber based resonator coupling
JP2010251588A (ja) * 2009-04-17 2010-11-04 Renesas Electronics Corp 光送信装置およびその製造方法
US10656362B2 (en) 2018-01-04 2020-05-19 Globalfoundries Singapore Pte. Ltd. Gamma groove arrays for interconnecting and mounting devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR96065E (fr) * 1967-11-01 1972-05-19 Western Electric Co Procédé de gravure précise de semiconducteurs.
US3765969A (en) * 1970-07-13 1973-10-16 Bell Telephone Labor Inc Precision etching of semiconductors
US3864018A (en) * 1973-10-18 1975-02-04 Bell Telephone Labor Inc Method and means for splicing arrays of optical fibers
FR2500642B1 (fr) * 1981-02-24 1986-06-06 Nippon Sheet Glass Co Ltd Structure de support pour la fixation de fibres optiques et de lentilles et procede pour leur preparation ainsi que dispositif les utilisant
JPS59197137A (ja) * 1983-04-25 1984-11-08 Fujitsu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
KR890015039A (ko) 1989-10-28
EP0331333B1 (en) 1993-06-16
EP0331333A2 (en) 1989-09-06
CA1301956C (en) 1992-05-26
JPH027010A (ja) 1990-01-11
DE68907079T2 (de) 1993-10-07
US4810557A (en) 1989-03-07
EP0331333A3 (en) 1991-01-16
JPH07117614B2 (ja) 1995-12-18
DE68907079D1 (de) 1993-07-22
KR910005950B1 (en) 1991-08-09

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